臺灣博碩士論文加值系統

隨著科技快速發展，便攜式電子產品如智慧型手機與平板電腦的產品可靠度，逐漸成為消費者和製造商關注的焦點。由於便攜式電子產品在日常使用中經常不慎落摔，導致內部結構受到落摔衝擊，進而造成錫球產生裂紋，嚴重則造成錫球破裂，導致電子產品的失效。為了降低上述問題之風險，本研究分為兩個部份來探討電子封裝在落摔測試下錫球的可靠度。第一部份為透過實驗探討便攜式電子產品在類系統級落摔測試下，其落摔情形與響應，並透過加速規與應變規量測PCB受落摔衝擊時所產生之加速度G值與應變，以觀察落摔測試下對PCB之影響；第二部分則以有限元素模擬類系統級落摔測試，將模擬分析結果與實驗量測數據進行數值比對與驗證，以確保有限元素分析模型之適用性。後續將此有限元素模型應用於探討電子封裝在類系統級落摔測試與JEDEC板級落摔測試下對錫球可靠度分析，並比較兩種落摔測試對錫球所產生之最大應力。最終，以實驗計畫法評估幾何結構設計與材料的選用對錫球可靠度之影響，探討影響錫球最大應力之顯著因子，找出最佳參數組合，降低錫球所受之最大應力，避免錫球發生破裂的風險與提升產品可靠度。而研究結果顯示：
1.在類系統級落摔測試下，第二次落摔所產生之能量大於第一次落摔。
2.而類系統級落摔測試之落摔角度比較中，落摔角度為0度時影響較大。
3.且在TFBGA封裝之落摔測試對錫球可靠度分析中，類系統級落摔測試對錫球所產生之最大主應力大於JEDEC板級落摔測試。
4.從單因子優化分析結果得知，Housing重量為最顯著影響因子，而第二顯著影響因子則為PCB厚度。
5.透過一次一因子法分析求得最佳設計參數組合，能有效降低錫球所受之最大主應力，與原始設計相比下降15.5%。

With the rapid development of technology, the reliability of portable electronic products such as smartphones and tablets has become a focal point for both consumers and manufacturers. These devices are often accidentally dropped during daily use, causing internal structures to suffer impact, leading to cracks in the solder joints, and in severe cases, rupturing the solder joints, resulting in product failure. To mitigate the risk of such issues, this study is divided into two parts to investigate the reliability of solder joints in electronic packaging under drop test conditions. The first part involves experimentally investigating the drop behavior and response of portable electronic products under system-like drop tests. Accelerometers and strain gauges are used to measure the acceleration and strain generated by the PCB during drop impacts, to observe the effects of drop tests on the PCB. The second part involves using finite element simulation to perform system-like drop tests. The simulation results are compared with experimental measurement data for numerical validation, ensuring the applicability of the finite element analysis model. Subsequently, this finite element model will be used to investigate the reliability of solder joints in electronic packaging under system-like drop tests and JEDEC board-level drop tests. The maximum stress generated on the solder joints in the two types of drop tests will be compared. Finally, the design of experiments method is used to evaluate the impact of geometric structure design and material selection on the reliability of solder joints. Significant factors affecting the maximum stress on the solder joints are identified, and the optimal parameter combination is determined to reduce the maximum stress experienced by the solder joints, thereby minimizing the risk of solder joint rupture and enhancing product reliability.The results have illustrated：
1.In the system-like drop test, the energy generated during the second drop is larger than that of the first drop.
2.In the comparison of drop angles in the system-like drop test, the impact is larger at a drop angle of 0 degrees.
3.In the reliability analysis of solder joints in TFBGA package drop tests, the maximum principal stress generated on the solder joints in the system-like drop test is larger than that in the JEDEC board-level drop test.
4.The single-factor optimization analysis results indicate that Housing weight is the most significant influencing factor, followed by PCB thickness as the second most significant factor.
5.The one-factor-at-a-time analysis determined the optimal parameter combination, which effectively reduces the maximum principal stress experienced by the solder joints by 15.5% compared to the original design.

中文摘要...i
Abstract...ii
誌謝...iv
目錄...v
表目錄...vii
圖目錄...viii
符號說明...xii
第一章 緒論...1
1.1 前言...1
1.2 文獻回顧 2
1.2.1 電子產品落摔測試之實驗與量測方法...2
1.2.2 落摔測試之可靠度模擬與分析...5
1.3 研究動機與目的...9
1.4 研究流程...9
第二章 電子封裝概論...11
2.1 封裝發展趨勢...11
2.2 TFBGA封裝製程概論...13
第三章 模擬理論基礎與實驗方法...19
3.1 有限元素法理論...19
3.2 支承激振法(Support Excitation Scheme)...20
3.3 落摔測試理論基礎...23
3.4 JEDEC測試標準...24
第四章 類系統級落摔測試之實驗與量測...27
4.1 實驗治具與量測儀器...27
4.2 類系統級落摔測試設備與安裝架設...29
4.2.1 實驗設備...29
4.2.2 實驗設計與架設...29
4.3 類系統級落摔測試...30
4.3.1 實驗前置...30
4.3.2 實驗流程...31
4.4 實驗結果與討論 ...32
第五章 錫球落摔可靠度模擬與分析...34
5.1 有限元素模型建立...34
5.2 有限元素模型之邊界條件設定...34
5.3 有限元素分析結果與驗證...37
5.3.1 實驗與模擬分析之加速度G值比對與驗證...37
5.3.2 實驗與模擬分析之水平方向應變比對與驗證...37
5.4 TFBGA封裝之落摔測試對錫球可靠度分析...38
5.4.1 TFBGA有限元素模型建立...38
5.4.2 類系統級落摔測試對錫球可靠度分析...40
5.4.3 類系統級落摔測試對錫球可靠度分析之落摔角度比較...43
5.4.4 JEDEC落摔測試對錫球可靠度分析...44
5.5 模擬分析結果與討論...45
第六章 TFBGA優化設計分析...51
6.1 控制因子與參數設計...51
6.2 TFBGA因子分析結果與討論...52
6.3 TFBGA最佳參數設計之優化分析...57
第七章 結論與未來展望...58
7.1 結論...58
7.2 未來展望...59
參考文獻...60
Extended Abstract...62

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