隨著半導體科技日新月異的持續進步，積體電路元件尺寸微縮，傳統銅金屬由於其高電子平均自由路徑，造成銅電阻率急遽上升，導致銅金屬在奈米化連導線使用中受到限制。鈷具有較低的電子平均自由路徑，並在奈米尺寸下具有跟銅金屬相近之電阻率，因此鈷在新型連導線製程中被認為具有相當的潛力取代傳統奈米級元件使用的銅金屬。本實驗使用電化學沉積製程沉積鈷及鈷磷薄膜，並整合自組裝單層改質應用於奈米級積體電路連導線製程。
本論文研究以NiSi底層及經過自組裝單層(SAM)改質之NiSi底層作為本研究之基板，以電化學沉積法製備Co及Co(P)薄膜，以研究不同基板所沉積之Co及Co(P)薄膜的性能。實驗藉由改變Co溶液種類和沉積電位來獲得最佳的沉積參數與薄膜特性。分析以四點探針量測電阻、掃描式電子顯微鏡觀察表面形貌及薄膜厚度、X光繞射分析儀進行結構分析、感應耦合電漿質譜儀對成份做定量分析、X光電子能譜儀分析元素鍵結、拉曼光譜儀分析晶格的振動模式。
由實驗得知，NiSi基板上以-1.5 V的沉積電位，並以氯化鈷溶液沉積之鈷薄膜具有最低電阻率為11.11 µΩ-cm。沉積Co(P)最好之參數為以-1.5 V 所沉積之薄膜，同樣以氯化鈷作為沉積溶液可獲得最低電阻率為61.97 µΩ-cm；SAM基板上以-1.9 V所沉積之鈷薄膜，並以氯化鈷所沉積來達到最佳薄膜電阻，電阻率為123.2 µΩ-cm。Co(P)薄膜最好參數為以-1.9 V所沉積之合金薄膜，沉積溶液以硫酸鈷所得Co(P) 薄膜，最低電阻率為498.3 µΩ-cm。結果顯示Co(P)合金薄膜在NiSi基板上沉積具有應用於下世代連導線之應用潛力。

As the semiconductor devices shrink, resistivity of nanoscale copper interconnects rises rapidly due to its high electron mean free path. This limits the use of copper metal in a nanoscale interconnect. Cobalt has a lower average mean free path of electrons and similar resistivity to copper in nanometer size, thus it has a great potential with replace the copper metal used in conventional nanoscale interconnect for the next-generation devices. In this study, the cobalt and cobalt-phosphorus films were fabricated by electrochemical deposition, and the properties of the films will be evaluated.
NiSi and NiSi modified with self-assembled monolayer (SAM) were used as substrates for this study. The optimum deposition parameters were obtained by evaluating the Co electrolyte and deposition potential. The properties of the studied films were examined by four-point probe, scanning electron microscopy, X-ray diffraction, inductively coupled plasma mass spectrometer, X-ray photoelectron spectrometer, and Raman spectrometer.
The results show that the lowest resistivity is 11.11 µΩ-cm for cobalt film deposited on NiSi substrate at -1.5 V using cobalt chloride solution. The lowest resistivity of Co(P) film is 61.97 µΩ-cm when the films was deposited at -1.5 V using cobalt chloride solution. On the SAM modified substrate, however, the lowest resistivity is 123.2 µΩ-cm and 498.3 µΩ-cm for cobalt film and Co(P) film, respectively, both deposited at -1.9 V using cobalt sulfate electrolyte. The results show that the Co and Co(P) is potentially used as an interconnecting material for next generation devices.

摘要 ...i
Abstract ...iii
誌謝 ...iv
目錄 ...v
表目錄 ...xii
圖目錄 ...xiii
第一章 緒論 ...1
1.1 前言 ...1
1.2 研究動機 ...3
第二章 理論基礎及文獻回顧 ...7
2.1 半導體連導線製程 ...7
2.2 擴散阻障層 (Diffusion Barrier Layer) ...8
2.3 物理氣相沉積 (Physical Vapor Deposition, PVD) ...11
2.4 鈷合金 (Cobalt Alloy) ...14
2.4.1 物理氣相沉積製備鈷薄膜 ...14
2.4.2 電化學沉積製備鈷薄膜 ...15
2.5 電化學原理 ...17
2.5.1 循環伏安法 (Cyclic Voltammetry, CV) ...17
2.5.2 電化學交流阻抗 (Electrochemical Impedance Spectroscopy, EIS) ...18
2.6 電鍍添加劑 ...19
2.6.1 無機添加劑 ...19
2.6.2 有機添加劑 ...20
2.7 電鍍液pH值對電沉積之影響 ...21
2.8 電化學沉積薄膜成核原理 ...22
2.8.1 電化學反應過程 ...22
2.8.2 電化學沉積薄膜成核理論 ...22
第三章 實驗流程與儀器介紹 ...29
3.1 實驗材料 ...29
3.1.1 實驗基板 ...29
3.1.2 濺鍍靶材 ...29
3.1.3 製程氣體 ...29
3.1.4 化學藥品 ...29
3.2 實驗設備 ...31
3.2.1 磁控濺鍍系統 ...31
3.2.2 熱水浴系統 ...31
3.2.3 熱處理系統 ...31
3.2.4 pH值測定儀 ...32
3.2.5 三極式電化學沉積系統 ...32
3.3 實驗流程 ...33
3.3.1 基板清洗 ...33
3.3.2 製備鎳矽 (NiSi) 及自組裝單層 (SAM) 基板 ...33
3.3.3 電化學溶液配置 ...34
3.3.4 電化學製備金屬薄膜 ...35
3.4 分析儀器及原理 ...36
3.4.1. 四點探針(Four-Point Probe, FPP) ...36
3.4.2 X光繞射分析儀 (X-ray Diffraction, XRD) ...36
3.4.3 掃描式電子顯微鏡 (Scanning Electron Microscope, SEM) ...37
3.4.4 場發射掃描式電子顯微鏡 (Cold Field Emission Scanning Electron Microscope, FE-SEM) ...38
3.4.5 能量散射射光譜儀 (Energy Dispersive Spectroscopy, EDS) ...38
3.4.6 感應耦合電漿質譜分析儀 (Inductively Coupled Plasma-Mass Spectrometer, ICP-MS) ...39
3.4.7 拉曼光譜儀 (Raman Spectra) ...39
3.4.8 X光光電子能譜儀 (X-ray Photoelectron Spectroscopy. XPS) ...40
第四章 實驗結果與討論 ...53
4.1 鎳矽及自組裝單層基板製作 ...53
4.1.1 NiSi基板 ...53
4.1.2 自組裝單層基板 ...53
4.2 NiSi基板上電化學沉積純Co薄膜特性 ...55
4.2.1 NiSi基板以純Co溶液之CV分析 ...55
4.2.2 NiSi基板CoSO4溶液在不同沉積電位對電流密度之影響 ...55
4.2.3 NiSi基板CoCl2不同沉積電位對電流密度之影響 ...56
4.2.4 NiSi基板沉積純Co薄膜之結構分析 ...57
4.2.5 NiSi基板CoSO4沉積純Co薄膜之SEM圖分析 ...58
4.2.6 NiSi基板CoCl2沉積純Co薄膜之SEM圖分析 ...58
4.2.7 NiSi基板沉積Co薄膜之電性探討 ...59
4.2.8 NiSi基板沉積Co薄膜之電化學分析 ...60
4.2.9 NiSi基板沉積Co薄膜之拉曼分析 ...61
4.3 NiSi基板上電化學沉積Co(P)薄膜特性 ...62
4.3.1 NiSi基板上Co(P)溶液之CV圖 ...62
4.3.2 NiSi基板Co(P)溶液不同沉積電位對電流密度之影響 ...62
4.3.3 NiSi基板上Co(P)合金薄膜之P含量比較 ...64
4.3.4 NiSi基板沉積Co(P)合金薄膜之結構分析 ...64
4.3.5 NiSi基板CoSO4沉積Co(P)合金薄膜之SEM圖分析 ...65
4.3.6 NiSi基板CoCl2沉積Co(P)合金薄膜之SEM圖分析 ...66
4.3.7 NiSi基板沉積Co(P)合金薄膜之電性探討 ...67
4.3.8 NiSi基板沉積Co(P)合金薄膜之電化學分析 ...68
4.3.9 NiSi基板沉積Co(P)合金薄膜之拉曼分析 ...69
4.3.10 NiSi基板沉積Co(P)合金薄膜之XPS分析 ...69
4.4 SAM基板上電化學沉積純Co薄膜特性 ...71
4.4.1 SAM基板純Co溶液之CV分析 ...71
4.4.2 SAM基板Co溶液不同沉積電位對電流密度之影響 ...71
4.4.3 SAM基板沉積純Co薄膜之結構分析 ...73
4.4.4 SAM基板CoSO4溶液沉積純Co薄膜之SEM圖分析 ...73
4.4.5 SAM基板CoCl2溶液沉積純Co薄膜之SEM圖分析 ...74
4.4.6 SAM基板沉積純Co薄膜之電性探討 ...75
4.4.7 SAM基板沉積純Co薄膜之電化學分析 ...76
4.4.8 SAM基板沉積純Co薄膜之拉曼分析 ...77
4.5 SAM基板上電化學沉積Co(P)薄膜特性 ...79
4.5.1 SAM基板上Co(P)溶液之CV圖 ...79
4.5.2 SAM基板Co(P)溶液不同沉積電位對電流密度之影響 ...79
4.5.3 SAM基板沉積Co(P)合金薄膜之P含量比較 ...81
4.5.4 SAM基板沉積Co(P)合金薄膜之結構分析 ...81
4.5.5 SAM基板CoSO4沉積Co(P)合金薄膜之SEM圖分析 ...82
4.5.6 SAM基板CoCl2 + P沉積Co(P)合金薄膜之SEM圖分析 ...83
4.5.7 SAM基板沉積Co(P)合金薄膜之電性探討 ...84
4.5.8 SAM基板沉積Co(P)合金薄膜之電化學分析 ...85
4.5.9 SAM基板沉積Co(P)合金薄膜之拉曼分析 ...86
4.5.10 SAM基板沉積Co(P)合金薄膜之XPS分析 ...87
4.6 不同基板之薄膜比較 ...89
4.6.1 不同基板沉積純Co薄膜比較 ...89
4.6.2 不同基板沉積Co(P)合金薄膜比較 ...90
第五章 結論 ...146
參考文獻 ...147
Extended Abstract ...157

[1] International Roadmap For Devices and System 2020 EDITION, IEEE. (2020).
[2] Samsung Begins Chip Production Using 3nm Process Technology With GAA Architecture,(2022).
[3] Ali W. Elshaari, Stefan F. Preble, 10 Gb/s broadband silicon electro-optic absorption modulator, Opt. Commun, 283 (2010) 2829–2834.
[4] W. Zhang, S.H. Brongersma, O. Richard, B. Brijs, R. Palmans, L. Froyen, K. Maex, Influence of the electron mean free path on the resistivity of thin metal films, Microelectron Eng, 76 (2004) 146–152.
[5] L. Chen, Q. Chen, D. Ando, Y. Sutou, M. Kubo, J. Koike, Potential of low-resistivity Cu2Mg for highly scaled interconnects and its challenges, Appl. Surf. Sci., 537 (2021) 148035.
[6] International Roadmap for Devices and System, (2018) 5-17.
[7] K. Barmak, X. Liu, A. Darbal, N. T. Nuher, D. Choi, T. Sun, A. P. Warren, K. R. Coffey, M. F. Toney, On twin density and resistivity of nanometric Cu thin films, J. Appl. Phys., 120 (2016) 065106.
[8] T. Oku, E. Kawakami, M. Uekubo, K. Takahiro, S. Yamaguchi, M. Murakami, Diffusion barrier property of TaN between Si and Cu, Appl. Surf. Sci., 99 (1996) 265-272.
[9] M. Lane, R. H. Dauskardt, Adhesion and reliability of copper interconnects with Ta and TaN barrier layers, J. Mater.Res., 15.1 (2000) 203-211.
[10] K. L. Ou, W. F. Wu, C. P. Chou, S. Y. Chiou, C. C. Wu, Improved TaN barrier layer against Cu diffusion by formation of an amorphous layer using plasma treatment, J. Vac. Sci. Technol. B, 20.5 (2002) 2154-2161.
[11] K. Jeong, J. Lee, I. Byun, M. jun. Seong, J. Park, H. W. Kim, M. J. Kim, J. H. Kim, Jaegab Lee, Synthesis of highly conductive cobalt thin films by LCVD at atmospheric pressure, Mater Sci Semicond Process, 68 (2017) 245–251.
[12] O. Varela Pedreira, K. Croes, A. Lesniewska, C. Wu, M. H. van der Veen, J. de Messemaeker, K. Vandersmissen, N. Jourdan, L.G. Wen, C. Adelmann, B. Briggs, V. Vega Gonzalez, J. Bömmels, Zs. Tokei, Reliability Study on Cobalt and Ruthenium as Alternative Metals for Advanced Interconnects, 2017 IEEE IRPS, (2017) 6B-2.1-6B-2.8.
[13] E. Milosevic, S. Kerdsongpanya, D. Gall, The Resistivity Size Effect in Epitaxial Ru(0001) and Co(0001) Layers, 2018 IEEE Nanotechnology Symp. (ANTS), (2018) pp. 1-5.
[14] J.-W. Lim, M. Isshiki, Electrical resistivity of Cu films deposited by ion beam deposition: Effects of grain size, impurities, and morphological defect, J. Appl. Phys., 99 (2006) 094909.
[15] J.M. Purswani, D. Gall, Electron scattering at single crystal Cu surfaces, Thin Solid Films, 516 (2007) 465–469.
[16] E. Yoo, J. H. Moon, Y. S. Jeon, Y. Kim, J. P. Ahn, Y. K. Kim, Electrical resistivity and microstructural evolution of electrodeposited Co and Co-W nanowires, Mater Charact, 166 (2020) 110451.
[17] K. Venkatraman, Y. Dordi, R. Akolkar, Electrochemical Atomic Layer Deposition of Cobalt Enabled by the Surface-Limited Redox Replacement of Underpotentially Deposited Zinc, J. Electrochem. Soc., 164 (2) (2017) D104-D109.
[18] S. Dutta, S. Beyne, A. Gupta, S. Kundu, S.V. Elshocht, H. Bender, G. Jamieson, W. Vandervorst, J. Bömmels, C.J. Wilson, Z.T. okei, Christoph Adelmann, Sub-100 nm2 Cobalt Interconnects, IEEE. Electron Device Lett. 39(5) (2018) 731-734.
[19] R. Saeki, T. Ohgai, Determination of cathode current efficiency forelectrodeposition of ferromagnetic cobalt nanowire arrays innanochannels with extremely large aspect ratio, Results Phys., 15 (2019) 102658.
[20] G. Shu, C. Hu, T. Teng, X. P. Qu, Linewidth related resistivities and growth behavior of nickel silicide nanowires by solid state reaction between Ni and electron-beam lithography prepared Si nanowires, Thin Solid Films, 724 (2021) 138612.
[21] M. Zhou, Y. Zhao, W. Huang, B. M. Wang, G. P. Ru, Y. L. Jiang, R. Liu, X. P. Qu, Cu contact on NiSi substrate with a Ta/TaN barrier stack, Microelectron Eng, 85 (2008) 2028–2031.
[22] S. Biswas, P. Decorse, H. Kim, P. Lang, Organic planar diode with Cu electrode via modification of the metal surface by SAM of fluorobiphenyl based thiol, Appl. Surf. Sci., 558 (2021) 149794.
[23] Z. Jia, V. W. Lee, I. Kymissis, In situ study of pentacene interaction with archetypal hybrid contacts: Fluorinated versus alkane thiols on gold, Phys. Rev. B, 82 (2010) 125457.
[24] B. Li, T. D. Sullivan, T. C. Lee, D. Badami, Reliability challenges for copper interconnects, Microelectron Reliab, 44 (2004) 365–380.
[25] F. Messner, Material substitution and path dependence: empirical evidence on the substitution of copper for aluminum, Ecol Econ, 42 (2002) 259–271.
[26] C. J. Liu, J. S. Chen, Influence of Zr additives on the microstructure and oxidation resistance of Cu(Zr) thin films, Mater. Res. Soc., 20 (2005) 96-503.
[27] A. S. Kale, W. Nemeth, C. L. Perkins, D. Young, A. Marshall, K. Florent, S. K. Kurinec, P. Stradins, S. Agarwal, Thermal Stability of Copper–Nickel and Copper–Nickel Silicide Contacts for Crystalline Silicon, ACS Appl. Energy Mater., 1, 6, (2018) 2841–2848.
[28] A. E. Kaloyeros, E. Eisenbraun, Ultrathin diffusion barriers/liners for gagascale copper metallization,   Annu. Rev. Mater. Sci.; Palo Alto, 30 (2000) 363.
[29] M. H. Tsai, J. W. Yeh, J. Y. Gan, Diffusion barrier properties of AlMoNbSiTaTiVZr high-entropy alloy layer between copper and silicon, Thin Solid Films, 516 (2008) 5527 – 5530.
[30] K. E. Elers, V. Saanila, P. J. Soininen, W.-M. Li, J. T. Kostamo, S. Haukka, J. Juhanoja, W. F. A. Besling, Diffusion Barrier Deposition on a Copper Surface by Atomic Layer Deposition, Chem. Vap. Deposition, 8, 4 (2002) 149-153.
[31] M.A. Nicolet, Diffusion barriers in thin films, Thin Solid Films 52(3) (1978) 415-443.
[32] M. Stavrev, D. Fischer, Behavior of thin Ta-based films in the Cu/barrier/Si system, J. Vac. Sci. Technol. A, 17 (1999) 993.
[33] F. Cao, G. h. Wu, L. t. Jiang, Evaluation of Cu(V) self-forming barrier for Cu metallization, J. Alloys Compd., 657 (2016) 483-486.
[34] J. Borja, Joel. L. Plawsky, W. N. Gill, H. Bakhru, M. He, T. M. Lu, Penetration of Copper-Manganese Self-Forming Barrier into SiO2 Pore-Sealed SiCOH during Deposition, ECS J Solid State Sci Technol, 2 (2013) 9.
[35] M. Franz, R. Ecke, C. Kaufmann, J. Kriz, S. E. Schulz, Characterisation of the barrier formation process of self-forming barriers with CuMn, CuTi and CuZr alloys, Microelectron Eng, 156 (2016) 65-69
[36] A. Baptista, F. Silva, J. Porteiro, J. Míguez, G. Pinto, Sputtering Physical Vapour Deposition (PVD) Coatings: A Critical Review on Process Improvement andMarket Trend Demands, Coatings, 8.11 (2018) 402.
[37] R. J. Martín-Palmaa, A. Lakhtakia, Vapor-Deposition Techniques, Engineered Biomimicry. Elsevier Inc., 2013. 383-398.
[38] H. Sano, R. Ishida, T. Kura, S. Fujita, S. Naka, H. Okada, T. Takai, Transparent organic light-emitting diodes with top electrode using ion-plating method, IEICE Trans. Electron., 98.11 (2015) 1035-1038.
[39] R. Hippler, M. Cada, P. Ksirova, J. Olejnicek, P. Jiricek, J. Houdkova, H. Wulff, A. Kruth, C.A. Helm, Z. Hubicka, Deposition of cobalt oxide films by reactive pulsed magnetron sputtering, Surf. Coat. Technol., 405 (2021) 126590.
[40] B. Li, Y. Zhang, Z. Wu, Z. Qin, H. Ji, X. Liu, B. Li, W. Hu, Magnetic properties and corrosion resistance of Co-DLC nanocomposite films with different cobalt contents, Diam Relat Mater, 117 (2021) 108477.
[41] Z. h. Zheng, P. Fan, G. x. Liang, D. p. Zhang, Influence of deposition temperature on the microstructure and thermoelectric properties of antimonide cobalt thin films prepared by ion beam sputtering deposition, J. Alloys Compd., 619 (2015) 676–680.
[42] X. Li, R. Deng, Q. Zhang, Cobalt-phosphorous coatings with tunable composition fabricated by additive-controlled electrodeposition from choline chloride-ethylene glycol deep eutectic solvent for anti-corrosion application, Surf. Coat. Technol., 443 (2022) 128610.
[43] S. De, W.D. Sides, T. Brusuelas, Q. Huang, Electrodeposition of superconducting rhenium-cobalt alloys from water-insalt electrolytes, J. Electroanal. Chem., 860 (2020) 113889.
[44] A. Meng, H. Zhang, B. Huangfu, W. Tian, L. Sheng, Z. Li, S. Tan, Q. Li, Bimetal nickel–cobalt phosphide directly grown on commercial graphite substrate by the one-step electrodeposition as efficient electrocatalytic electrode, Prog. Nat. Sci., 30 (2020) 461–468.
[45] C. Liu, F. Su, J. Liang, Producing cobalt–graphene composite coating by pulseelectrodeposition with excellent wear and corrosion resistance, Appl. Surf. Sci., 351 (2015) 889–896.
[46] H. C. Chuang, G. W. Jiang, J. Sanchez, Study on the changes of ultrasonic parameters over supercritical Ni-Co electroplating process, Ultrason Sonochem, 60 (2020) 104805.
[47] K. C. Wu, J. Y. Tseng, W. J. Chen, Electroplated Ru and RuCo films as a copper diffusion barrier, Appl. Surf. Sci., 516 (2020) 146139.
[48] Gouws, Shawn, Voltammetric characterization methods for the PEM evaluation of catalysts, Electrolysis. IntechOpen, 2012.
[49] Sekar, Narendran, R. P. Ramasamy, Electrochemical impedance spectroscopy for microbial fuel cell characterization, J Microb Biochem Technol S, 6.2 (2013) 1-14.
[50] B. Y. Chang, S. M. Park, Electrochemical Impedance Spectroscopy, Annu Rev Anal Chem, 3.1 (2010) 207.
[51] F. Ciucci, Modeling electrochemical impedance spectroscopy, Curr Opin Electrochem, 13 (2019) 132-139.
[52] Y. Deo, R. Ghosh, A. Nag, D. V. Kumar, R. Mondal, A. Banerjee, Direct and pulsed current electrodeposition of Zn-Mn coatings from additive-free chloride electrolytes for improved corrosion resistance, Electrochim. Acta, 399 (2021) 139379.
[53] M. Bučko, J. Rogan, S.I. Stevanović, S. Stanković, J.B. Bajat, The influence of anion type in electrolyte on the properties of electrodeposited Zn Mn alloy coatings, Surf. Coat. Technol., 228 (2013) 221–228.
[54] T. Jiang, M. J. C. Brym, G. Dubé, A. Lasia, G. M. Brisard, Electrodeposition of aluminium from ionic liquids: Part I—electrodeposition and surface morphology of aluminium from aluminium chloride (AlCl3)–1-ethyl-3-methylimidazolium chloride ([EMIm]Cl) ionic liquids, Surf. Coat. Technol., 201 (2006) 1 – 9.
[55] M. Bučko, J. Rogan, B. Jokić, M. Mitrić, U. Lačnjevac J. B. Bajat, Electrodeposition of Zn–Mn alloys at high current densities from chloride electrolyte, J Solid State Electrochem, 17 (2013) 1409–1419.
[56] E. Rudnik, The influence of sulfate ions on the electrodeposition of Ni–Sn alloys from acidic chloride–gluconate baths, J. Electroanal. Chem., 726 (2014) 97–106.
[57] G. A. Hope, R. Woods, Transient Adsorption of Sulfate Ions during Copper Electrodeposition, J. Electrochem. Soc., 151.9 (2004) C550.
[58] Y. B. Amor, L. Bousselmi, M. C. Bernard, B. Tribollet, Nucleation-growth process of calcium carbonate electrodeposition in artificial water—Influence of the sulfate ions, J. Cryst. Growth, 320.1 (2011) 69-77.
[59] J.S. Santos, R. Matos, F. Trivinho-Strixino, E.C. Pereira, Effect of temperature on Co electrodeposition in the presence of boric acid, Electrochim. Acta, 53 (2007) 644–649.
[60] S. Vivegnis, M. Krid, J. Delhalle, Z. Mekhalif, F.U. Renner, Use of pyrophosphate and boric acid additives in the copper-zinc alloy electrodeposition and chemical dealloying, J. Electroanal. Chem., 848 (2019) 113310.
[61] Lee, J. Min, K. K. Jung, J. S. Ko, Formation of nickel microcones by using an electrodeposition solution containing H3BO3, Curr Appl Phys, 16.3 (2016) 261-266.
[62] S. Varvara, L. Muresan, A. Nicoara, G. Maurin, I. C. Popescu, Kinetic and morphological investigation of copper electrodeposition from sulfate electrolytes in the presence of an additive based on ethoxyacetic alcohol and triethyl-benzyl-ammonium chloride, Mater. Chem. Phys., 72 (2001) 332–336.
[63] X. Wang, K. Wang, J. Xu, J. Li, J. Lv, M. Zhao, L. Wang, Quinacridone skeleton as a promising efficient leveler for smooth and conformal copper electrodeposition, Dyes Pigm., 181 (2020) 108594.
[64] K. R. Hebert, Analysis of Current-Potential Hysteresis during Electrodeposition of Copper with Additives, J. Electrochem. Soc., 148.11 (2001) C726.
[65] M. Hasegawa, Y. Negishi, T. Nakanishi, Tetsuya Osaka, Effects of additives on copper electrodeposition in submicrometer trenches, J. Electrochem. Soc., 152.4 (2005) C221.
[66] Pasquale, M. A., L. M. Gassa, A. J. Arvia, Copper electrodeposition from an acidic plating bath containing accelerating and inhibiting organic additives, Electrochim. Acta, 53.20 (2008) 5891-5904.
[67] Watanabe, Atsuya, Y. Takigawa, Reducing sulfur to improve thermal embrittlement in electrodeposited nickel using citric acid, Results in Surf. Interfaces, 1 (2020) 100001.
[68] Matsui, Isao, Y. Takigawa, K. Higashi, High tensile ductility in electrodeposited bulk nanocrystalline Ni–W alloys, Adv Mat Res., 922. (2014) 497-502.
[69] C. Qiang, J. Xu, S. Xiao, Y. Jiao, Z. Zhang, Y. Liu, L. Tian, Z. Zhou, The influence of pH and bath composition on the properties of Fe–Co alloy film electrodeposition, Appl. Surf. Sci., 257.5 (2010) 1371-1376.
[70] J. A. Koza, M. Uhlemann, A. Gebert, L. Schultz, The effect of a magnetic field on the pH value in front of the electrode surface during the electrodeposition of Co, Fe and CoFe alloys, J. Electroanal. Chem., 617.2 (2008) 194-202.
[71] Altiokka, Barış, A. K. Yildirim, Electrodeposition of CdS thin films at various pH values, J Korean Phys Soc, 72.6 (2018) 687-691.
[72] B. Scharifker, G. Hills, Theoretical and experimental studies of multiple nucleation, Electrochim. Acta, 28(7) (1983) 879-889.
[73] A. Bewick, M. Fleischmann, H. R. Thirsk, Kinetics of the electrocrystallization of thin films of calomel, Trans Faraday Soc, 58 (1962) 2200-2216.
[74] Z. Kang, Q. Liu, Y. Liu, Preparation and micro-tribological property of hydrophilic self-assembled monolayer on single crystal silicon surface, Wear, 303 (2013) 297–301.
[75] B. Subramanian, G. Theriault, J. Robichaud, N. Tchoukanova, Y. Djaoued, Large-area crack-free Au–SiO2 2D inverse opal composite films: Fabrication and SERS applications, Mater. Chem. Phys., 244 (2020) 122630.
[76] O. Penon, D. Siapkas, S. Novo, S. Durán, G. Oncins, A. Errachid, L. Barrios, Carme, Nogués, M. Duch, J. A. Plaza, L. P. García, Optimized immobilization of lectins using self-assembled monolayers on polysilicon encoded materials for cell tagging, Colloids Surf. B, 116 (2014) 104–113.
[77] M.R. Khelladi, L. Mentar, M. Boubatra, A. Azizi, A. Kahoul, Early stages of cobalt electrodeposition on FTO and n-type Si substrates in sulfate medium, Mater. Chem. Phys., 122 (2010) 449–453.
[78] Fang, Yiyun, Coaxial ultrathin Co1 − y Fey Ox nanosheet coating on carbon nanotubes for water oxidation with excellent activity, RSC Adv., 6.84 (2016) 80613-80620.
[79] W. Nabgan, T. A. T. Abdullah, R. Mat, B. Nabgan, A. A. Jalil, L. Firmansyah, Sugeng Triwahyono, Production of hydrogen via steam reforming of acetic acid over Ni and Co supported on La2O3 catalyst, Int. J. Hydrog. Energy, 42 (2017) 8975 – 8985.
[80] J.C. Ingersoll, N. Mani, J.C. Thenmozhiyal, A. Muthaiah, Catalytic hydrolysis of sodium borohydride by a novel nickel–cobalt–boride catalyst, J. Power Sources, 173 (2007) 450–457.
[81] Y. K. Ko, D. S. Park, B. S. Seo, H. J. Yang, H. J. Shin, J. Y. Kim, J. H. Lee, W. H. Lee, P. J. Reucroft, J. G. Lee, Studies of cobalt thin films deposited by sputtering and MOCVD, Mater. Chem. Phys., 80 (2003) 560-564.
[82] E. Yoo, J. H. Moon, Y. S. Jeon, Y. Kim, J. P. Ahn, Y. K. Kim, Electrical resistivity and microstructural evolution of electrodeposited Co and Co-W nanowires, Mater Charact, 166 (2020) 110451.
[83] P. Guo, Y. X. Wu, W. M. Lau, H. Liu, L. M. Liu, Porous CoP nanosheet arrays grown on nickel foam as an excellent and stable catalyst for hydrogen evolution reaction, Int. J. Hydrog. Energy, 42 (2017) 26995 – 27003.
[84] X. Gao, K. Lu, J. Chen, J. Min, D. Zhu, M. Tan, NiCoPeCoP heterostructural nanowires grown on hierarchical Ni foam as a novel electrocatalyst for efficient hydrogen evolution reaction, Int. J. Hydrog. Energy, 46 (2021) 23205 – 23213.
[85] Z. Guo, L. Liu, J. Wang, Y. Cao, J. Tu, X. Zhang, L. Ding, Recent progress in CoP-based materials for electrochemical water splitting, Int. J. Hydrog. Energy, 46 (2021) 34194 – 34215.
[86] S. K. Donthu, S. Tripathy, D. Z. Chi, S. J. Chua, Raman scattering probe of anharmonic effects in NiSi, J. Raman Spectrosc, 35 (2004) 536–540.
[87] D.M. Herrera-Zamora, F.I. Lizama-Tzec, I. Santos-González, R.A. Rodríguez-Carvajal, O. García-Valladares, O. Arés-Muzio, G. Oskam, Electrodeposited black cobalt selective coatings for application in solar thermal collectors: Fabrication, characterization, and stability, Sol Energy, 207 (2020) 1132–1145.
[88] Y. Brik, M. Kacimi, M. Ziyad, F. Bozon-Verduraz, Titania-Supported Cobalt and Cobalt–Phosphorus Catalysts: Characterization and Performances in Ethane Oxidative Dehydrogenation, J Catal, 202 (2001) 118–128.
[89] D. Torres, L. Madriz, R. Vargas, . R. Scharifker, Electrochemical formation of copper phosphide from aqueous solutions of Cu(II) and hypophosphite ions, Electrochim. Acta, 354 (2020) 136705.
[90] J. S. Fang, Y. L. Wu, Y. L. Cheng, G. S. Chen, Synthesis of Dilute Phosphorous-Embedded Co Alloy Films on a NiSi Substrate with a Superior Gap-Filling Capability for Nanoscale Interconnects, J. Electrochem. Soc., 168 (2021) 042505.
[91] Y. S. Chen, C. C. Lin, T. S. Chin, J. Y. Chang, C. K. Sung, Residual stress analysis of electrodeposited thick CoMnP monolayers and CoMnP/Cu multilayers, Surf. Coat. Technol., 434 (2022) 128169.
[92] P. Bera, H. Seenivasan, K. S. Rajam, V. K. W. Grips, Characterization of amorphous Co–P alloy coatings electrodeposited with pulse current using gluconate bath, Appl. Surf. Sci., 258 (2012) 9544-9553.
[93] M. A. Sheikholeslam, M. H. Enayati, K. Raeissi, Characterization of nanocrystalline and amorphous cobalt–phosphorous electrodeposits, Mater. Lett., 62 (2008) 3629-3631.
[94] C. Guo, K. T. V. Rao, Z. Yuan, S. (Quan) He, S. Rohani, C. (Charles) Xu, Hydrodeoxygenation of fast pyrolysis oil with novel activated carbon-supported NiP and CoP catalysts, Chem. Eng. Sci., 178 (2018) 248–259.
[95] H. Li, Y. Zhu, K. Zhao, Q. Fu, K. Wang, Y. Wang, N. Wang, X. Lv, H. Jiang, L. Chen, Surface modification of coordination polymers to enable the construction of CoP/N, P-codoped carbon nanowires towards high-performance lithium storage, J. Colloid Interface Sci., 565 (2020) 503–512.
[96] M.g Deng, H. Yang, L. Peng, L. Zhang, L. Tan, G. He, M. Shao, L. Li, Z. Wei, Insight into the boosted activity of TiO2-CoP composites for hydrogen evolution reaction: Accelerated mass transfer, optimized interfacial water, and promoted intrinsic activity, J. Energy Chem., (2022).
[97] M. Lu, L. Li, D. Chen, J. Li, N.I. Klyui, W. Han, MOF-derived nitrogen-doped CoO@CoP arrays as bifunctional electrocatalysts for efficient overall water splitting, Electrochim. Acta, 330 (2020) 135210.
[98] T. Li, D. Tang, C. Li, A high active hydrogen evolution reaction electrocatalyst from ionic liquids-originated cobalt phosphide/carbon nanotubes, Int. J. Hydrog. Energy, 42 (2017) 21786 – 21792.
[99] Y. Hao, H. Xue, J. Sun, N. Guo, T. Song, J. Sun, Q. Wang, Tuning the Electronic Structure of CoP Embedded in N‑Doped Porous Carbon Nanocubes Via Ru Doping for Efficient Hydrogen Evolution, ACS Appl. Mater. Interfaces, 13 (2021) 56035 – 56044.
[100] Y. Yao, Q. Li, X. Dai, P. Dai, D. Xu, A novel hierarchical CdS-DETA@CoP composite as highly stable photocatalyst for efficient H2 evolution from water splitting under visible light irradiation, Appl. Surf. Sci., 588 (2022) 152890.
[101] L, Zhang, G, Wang, X, Hao, Z, Jina, Y, Wang, MOFs-derived Cu3P@CoP p-n heterojunction for enhanced photocatalytic hydrogen evolution, Chem. Eng. J., 395 (2020) 125113.
[102] X. Xie, J. Liu, C. Gu, J. Li, Y. Zhao, C. Liu, Hierarchical structured CoP nanosheets/carbon nanofibers bifunctional eletrocatalyst for high-efficient overall water splitting, J. Energy Chem., 64 (2022) 503–510.
[103] T. Wang, Y. Jiang, Y. Zhou, Y. Du, C. Wang, In situ electrodeposition of CoP nanoparticles on carbon nanomaterial doped polyphenylene sulfide flexible electrode for electrochemical hydrogen evolution, Appl. Surf. Sci., 442 (2018) 1–11.
[104] F. Wang, Y. Zhou, J. Lv, B. Dong, X. Zhang, W. Yu, J. Chi, Z. Wu, L. Wang, Y. Chai, Nickel hydroxide armour promoted CoP nanowires for alkaline hydrogen evolution at large current density, Int. J. Hydrog. Energy, 47 (2022) 1016 – 1025.
[105] H. Feng, X. Sun, X. Guan, D. Zheng, W. Tian, C. Li, C. Li, M. Yan, Y. Yao, Construction of interfacial engineering on CoP nanowire arrays with CoFe-LDH nanosheets for enhanced oxygen evolution reaction, FlatChem, 26 (2021) 100225.
[106] A.M. Puziy, O.I. Poddubnaya, R.P. Socha, J. Gurgul, M. Wisniewski, XPS and NMR studies of phosphoric acid activated carbons, Carbon, 46 (2008) 2113 – 2123.
[107] X. Liu, J. Niu, S. Rajendran, Y. Lei, J. Qin, X. Zhang, Electrodeposition of the manganese-doped nickelphosphorus catalyst with enhanced hydrogen evolution reaction activity and durability, Int. J. Hydrog. Energy, (2021).
[108] Y. Wang, P. Liang, H. Yang, W. Li, Z. Wang, Z. Liu, J. Wang, X. Shen, Hollow CoP nanoparticles embedded in TwoeDimensional Nedoped carbon arrays enabling advanced LieSeS2 batteries with rapid kinetics, Mater. Today Energy, 17 (2020) 100423.
[109] P. Ji, X. Luo, D. Chen, H. Jin, Z. Pu, W. Zeng, J. He, H. Bai, Y. Liao, S. Mu, Significantly Improved Water Oxidation of CoP Catalysts by Electrochemical Activation, ACS Sustainable Chem. Eng, 8 (2020) 17851−17859.
[110] L. Zhang, X. Hao, J. Li, Y. Wang, Z. Jin, Unique synergistic effects of ZIF-9(Co)-derived cobalt phosphide and CeVO4 heterojunction for efficient hydrogen evolution, Chinese J. Catal., 41 (2020) 82–94.
[111] Y. Zou, C. Guo, X. Cao, L. Zhang, T. Chen, C. Guo, J. Wang, Synthesis of CdS/CoP hollow nanocages with improved photocatalytic water splitting performance for hydrogen evolution, J. Environ. Chem. Eng., 9 (2021) 106270.