臺灣博碩士論文加值系統

　　本研究利用CO2雷射對固態反應法製備之摻鈰釔鋁石榴石進行雷射加工，於表面形成溝槽及孔洞等圖案，藉由表面圖案使光的入射角產生變化進而改善發光效率；由於雷射能量密度高，在加工時會形成熱影響區及熱裂紋，影響樣品的完整性，為了提升加工品質因此本實驗分為空氣下及水下雷射，比較兩者對於雷射加工的影響。以3D全角度光學顯微鏡分析水下雷射樣品，發現雷射加工後樣品的表面形貌特殊，並沒有正常加工會出現的凹口或山谷形貌，而是呈現凸出的火山坑形貌，空氣下雷射最高凸出約7.71　μm，而經過水深3 mm雷射後可形成平均孔深約24.29 μm的孔洞，可達到打孔目的，證實水下雷射可通過水中氣泡協助驅散熔融材料，提升加工品質。進一步以粗度儀進行表面形貌分析，發現樣品高低變化與雷射順序有關，雷射後會對加工處周圍產生預熱效果，因此雷射先後順序會影響加工深度。
　　由X光繞射分析可知，經過空氣下及水下雷射後，扣除SSR的訊號放大YAG(420)訊號觀察其結晶性，可發現除了SSR的訊號外可再分峰出多個訊號，推測分峰出的訊號為偏移後的YAG(420)，雷射能量的高斯分布讓材料受熱的區域有不同程度的結晶變化，也讓YAG晶體有不同程度的拉伸、壓縮應力出現，使XRD訊號出現偏移。
　　與空氣下雷射相比，水深2 mm時加工面積衰減約4.7 %，水深3 mm衰減約37.0 %，水深4 mm衰減約74.9 %；雷射打點的部分，水深2 mm時加工面積衰減約23.6 %，水深3 mm衰減約43.8 %，水深4 mm衰減約30.9 %，水深越深雷射受氣泡及水影響越大，使雷射離焦能量衰減，大幅降低加工能量，由實驗可知，雷射掃描及打點若能搭配合適的雷射參數，以水作為介質可提升加工品質，減少材料破碎，也能維持適量加工面積，水深2 mm能量密度2.514 J/mm2的雷射掃描即是如此。
　　與商用DLP進行光學性質比較，空氣下1.01 J/mm2雷射掃描之PL強度最強，空氣下19.94 J/mm2打孔強度與水下雷射相近，其餘空氣下雷射樣品PL皆低於水下雷射樣品，而商用DLP發光強度遠高於雷射後其他樣品，推測商用樣品之所以PL數值較高且無明顯熱淬滅效應是由於YAG為薄片狀貼附於鋁塊上，使藍光可透過底部反射充分被YAG轉換為黃光，由於樣品為薄片，轉換後的黃光也可以迅速透出材料，不會因為在材料內部多次折射而損失或轉換為熱能耗損。

　　In this study, CO2 laser was used for laser processing of ceriodized alumina garnets prepared by solid-state reaction to form patterns of grooves and holes on the surface. In order to improve the processing quality, this experiment is divided into under air and underwater laser to compare the effects of both on laser processing. The 3D full-angle optical microscope was used to analyze the underwater laser samples, and it was found that the surface shape of the samples after laser processing was special. This proves that the underwater laser can help disperse the molten material through the air bubbles in the water and improve the processing quality. The surface topography was further analyzed by a roughness meter, and it was found that the variation of the sample height was related to the laser sequence, and the preheating effect was generated around the processing area after the laser.
　　From the X-ray winding analysis, it can be seen that after the air and underwater laser, the crystallinity of the YAG(420) signal can be observed by deducting the SSR signal and amplifying the YAG(420) signal, and it can be found that in addition to the SSR signal, multiple signals can be divided into peaks. The Gaussian distribution of laser energy causes different degrees of crystallization changes in the heated areas of the material, and also causes different degrees of stretching and compressing stresses in the YAG crystals, resulting in a shift of the XRD signal.
　　Compared with the laser under air, the processing area decreases by 4.7% at a water depth of 2 mm, 37.0% at a water depth of 3 mm, and 74.9% at a water depth of 4 mm; for the laser spotting part, the processing area decreases by 23.6% at a water depth of 2 mm, 43.8% at a water depth of 3 mm, and 30.9% at a water depth of 4 mm. The deeper the water depth, the more the laser is affected by air bubbles and water, which decreases the laser defocusing energy and significantly reduces the processing energy.
　　In comparison with the optical properties of commercial DLP, the PL intensity of 1.01 J/mm2 laser scan under air is the strongest, the perforation intensity of 19.94 J/mm2 under air is similar to that of underwater laser, and the PL intensity of other airborne laser samples is lower than that of underwater laser samples. The reason for the higher PL value and no significant thermal quenching effect is that the YAG is attached to the aluminum block in the form of a thin sheet, so that the blue light can be fully converted into yellow light by the YAG through the bottom reflection.

摘要....................................i
Abstract................................iv
致謝.....................................vi
目錄.....................................vii
表目錄...................................x
圖目錄...................................xi
第一章 緒論..............................1
1.1前言..................................1
1.2研究動機與目標.........................1
第二章 理論基礎與文獻回顧..................2
2.1螢光材料簡介...........................2
2.1.1 螢光材料種類與應用.................2
2.1.2 無機螢光材料之發光機制.............3
2.1.3 YAG晶體結構.......................4
2.1.4 固態反應法........................5
2.1.5 斯托克位移(Stokes shift)..........5
2.1.6 溫度淬滅..........................5
2.2 雷射燒結..........................6
2.2.1 雷射切割..........................7
2.2.2 雷射鑽孔..........................8
2.2.3 超音波鑽孔........................10
2.2.4 液體輔助雷射......................11
2.2.5 雷射熱影響........................15
2.2.7 表面圖案對光學影響.................20
2.3 YAG熱傳導.........................25
2.4 折射率............................26
2.5 X射線繞射儀(X-ray diffractometer，XRD)....................26
2.6 掃描式電子顯微鏡(Scanning Electron Microscope，SEM)........26
2.7 光致發光(Photoluminescence，PL)...........................27
2.8 數位光學處理技術(Digital Light Processing, DLP)............27
2.9 色輪..............................27
第三章　實驗方法與步驟......................29
3.1 實驗藥品...........................29
3.2 實驗製備與分析設備..................29
3.3 實驗流程...........................33
3.3.1 固態反應法燒結YAG:Ce................34
3.3.1.1 前驅物粉末製備......................34
3.3.1.2 固態反應法實驗流程...................34
3.3.2 樣品表面前處理......................34
3.3.3 雷射表面圖案........................35
3.3.3.1 田字型表面形貌......................35
3.3.3.2 矩陣打孔表面形貌....................35
3.3.4 水下雷射............................35
第四章 結果與討論............................37
4.1 空氣下對摻鈰釔鋁石榴石雷射圖案化.......37
4.1.1 雷射加工表面形貌......................37
4.1.2 不同能量密度對於材料成分及微結構分析....42
4.1.3 不同能量密度對於光學性質之影響..........46
4.2 水下雷射對摻鈰釔鋁石榴石雷射圖案化結果...49
4.2.1 水下雷射加工表面形貌....................50
4.2.2 不同水深對於材料成分及微結構分析.........56
4.2.3 不同水深對於光學性質之影響...............61
4.2.4 雷射後有效面積..........................64
4.2.5 與商用DLP之光學性質比較.................65
第五章 結論....................................67
參考文獻.......................................69
附錄...........................................73
Extended Abstract..............................75
Abstract.......................................75
1. Introduction...........................75
2. Experiment.............................76
2.1 Solid-state reaction method sintering process..76
2.2 Laser processing process.......................76
2.3 Analytical instruments.........................76
3. Result and discussion..........................77
3.1 Analysis by OM and Roughness Tester............77
3.2 XRD analysis...................................78
3.3 SEM analysis...................................78
4. Conclusions....................................79
References.............................................80

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