臺灣博碩士論文加值系統

在這項研究中，將碳纖維與錫膏、銀膠以及環氧樹脂混合而成形成複合材料。這是透過調整短纖維的比例分別混合到錫膏與環氧樹脂中，然後將這些混合好的複合材料塗抹在15mm*15mm*0.5mm之矽基板上進行烘烤形成薄膜。實驗中，在矽基板下方放置了一TEC致冷晶片，經由TEC所產生的溫度震盪波，透過兩支熱電偶和溫度轉換器量測薄膜與基板之間的相位差關係，且將溫度控制在30℃、相對濕度則維持在60%R.H.環境中進行。量測完畢後藉由MATLAB程式對震盪波做餘弦擬合。藉由相位差會隨著頻率改變而變化，可以根據相位差的改變來計算熱擴散係數。最後，透過此方法來量測先前製備的碳纖維複合材料之薄膜。藉由短纖維摻雜的比例增加，Epoxy短纖維複合材料薄膜從1.75x10^-9成長到2.42x10^-8 m^2/s；錫膏複合材料薄膜從2.36x10^-6成長到7.17x10^-6 m^2/s，再藉由觀察摻雜長纖維之後的熱擴散係數。Epoxy長纖維複合材料薄膜熱擴散係數從4.98x10^-8成長到1.10x10^-7 m^2/s；錫膏長纖維複合材料薄膜熱擴散係數從6.55x10^-7成長到2.19x10^-6 m^2/s。從摻雜短纖維到長纖維的實驗中，皆能看到摻雜後熱擴散係數有成長的效果。

In this study, carbon fiber was mixed with solder paste, silver glue, and epoxy resin to form a composite material. This was achieved by adjusting the proportion of short fibers and incorporating them into solder paste and epoxy resin, respectively. The resulting composite materials were then applied to a 15mm x 15mm x 0.5mm silicon substrate and baked to form a thin film. During the experiment, a TEC cooling chip was placed under the silicon substrate. The phase difference relationship between the film and the substrate was measured using two thermocouples and a temperature converter, and the temperature was controlled in an environment at 30℃ and a relative humidity of 60%.
After completing the measurements, a MATLAB program was used to perform cosine fitting of the oscillation wave. Since the phase difference changes with frequency, the thermal diffusion coefficient was calculated based on the phase difference variation. Finally, the previously prepared carbon fiber composite film was measured using this method. By increasing the proportion of short fiber doping, the thermal diffusion coefficient of the Epoxy short fiber composite film increased from 1.75x10^-9 to 2.42x10^-8 m²/s, and the solder paste composite film increased from 2.36x10^-6 to 7.17x10^-6 m²/s. Subsequently, the thermal diffusion coefficient after doping long fibers was observed. The thermal diffusion coefficient of the Epoxy long fiber composite film increased from 4.98x10^-8 to 1.10x10^-7 m²/s, and the thermal diffusion coefficient of the solder paste long fiber composite film increased from 6.55x10^-7 to 2.19x10^-6 m²/s.
From the experiments involving short fiber doping to long fibers, it can be observed that the thermal diffusion coefficient increases after doping.

摘要 ...................i
Abstract ...................ii
誌謝 ...................iii
目錄 ...................iv
表目錄 ...................vi
圖目錄 ...................vii
第一章 緒論 ...................1
1.1 前言 ...................1
1.2 複合材料 ...................2
1.3 研究動機 ...................3
第二章 理論與設備介紹 ...................5
2.1 文獻探討 ...................5
2.1.1 材料與特性 ...................5
2.1.2 微觀熱傳導 ...................5
2.1.3 介面熱阻抗 ...................6
2.1.4 溫度對熱傳導的影響 ...................6
2.1.5 相關係數 ...................7
2.1.6 實驗理論 ...................7
2.1.7 文獻回顧 ...................9
2.2 實驗設備 ...................10
2.2.1 SerialPlot ...................10
2.2.2 精密烘箱 ...................10
2.2.3 致冷晶片 ...................10
第三章 實驗流程及方法 ...................16
3.1 實驗流程 ...................16
3.2 樣品製備與清洗 ...................16
3.3 薄膜製備 ...................17
3.4 熱擴散係數量測 ...................18
第四章 結果與討論 ...................23
4.1 基板清洗比較 ...................23
4.2 基本相位的探討 ...................24
4.3 環氧樹脂摻雜碳纖維的比較 ...................25
4.3.1 Epoxy摻雜不同厚度之短纖維複合材料對熱擴散的影響 ...................25
4.3.2 Epoxy摻雜不同比例之短纖維複合材料對熱擴散的影響 ...................25
4.3 錫膏摻雜短纖維複合材料的比較 ...................26
4.4 Epoxy摻雜連續纖維之複合材料對熱擴散的影響 ...................27
第五章 結論 ...................35
參考文獻 ...................36
附錄一 ...................37
Extended Abstract ...................38

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