臺灣博碩士論文加值系統

雷射熔覆(Laser Cladding, LC)是一種利用高功率雷射作為加熱源的加工製程，將金屬粉末熔化並覆於工件表面。此技術可改善材料表面特性，例如提高耐磨性、耐腐蝕性，並增加工件使用壽命。因此，雷射熔覆適用於需要維修、翻新和增強機械性質之零組件，例如航空業、工業模具和鐵軌等相關產業。
熔覆製程中，加工過程的回授控制非常關鍵。如果沒有適當的回授控制，持續的高功率雷射加熱會使得金屬熔池的溫度持續上升，進而導致雷射熔覆的堆積過程發生塌陷。因此，為了維持穩定的高功率雷射熔覆過程，本文提出了一種基於機器視覺的溫度控制系統，在加工過程中使用機器視覺即時監控熔池狀態。
本文的溫度控制系統主要基於CMOS影像處理技術，透過熔池影像計算其熔池範圍內平均溫度與熔池寬度，採用工業中常用PID控制方法，使用抓取到的兩種熔池參數作為回授控制參數，進而實現對雷射熔覆過程中熔池溫度和寬度的精確控制，並比較兩種回授參數的優缺點使製程的品質可以達到有效的提升。

Laser cladding (LC) is a processing technique that uses high-power lasers as a heat source to melt metal powder and fuse it onto the surface of a workpiece. This technique can improve surface properties of materials, such as increasing wear and corrosion resistance, and can extend the lifespan of the workpiece. Therefore, laser cladding is suitable for repairing, refurbishing, and enhancing mechanical components in industries such as aerospace, industrial molds, and railways.
However, feedback control during the LC process is critical. Without proper feedback control, continuous high-power laser heating can cause the temperature of the metal pool to keep rising, leading to collapse of the LC stacking process. To maintain a stable high-power laser cladding process, this paper proposes a machine vision-based temperature control system.
The temperature control system in this paper is mainly based on CMOS image acquisition technology, which calculates the temperature and area of the melting pool through image acquisition, achieving precise control of the melting pool temperature and area during the laser cladding process. In this paper, we use commonly used fuzzy control and PID control methods in the industry to achieve precise and stable melting pool control, and compare the advantages and disadvantages of the two algorithms to effectively improve the quality of the process.

摘要....i
Abstract....ii
誌謝....iii
目錄....iv
表目錄....vi
圖目錄....vii
符號說明....x
第一章 緒論....1
1.1 研究動機與目的....1
1.2 研究方法....1
1.3 論文架構....2
第二章 文獻探討....3
2.1 文獻回顧....3
2.2 影像測溫系統....4
2.2.1 機器視覺(Machine Vision)....4
2.2.2 輻射測溫原理....4
2.3 雷射熔覆....6
2.4 影像處理....7
2.4.1 Open CV Sharp....8
2.5 回授控制(Feedback Control)....9
2.5.1 比例積分微分控制器(PID Control)....9
2.6 Robot Studio....9
2.7 IoT Gateway概述....10
2.8 Socket通訊概述....10
2.9 Modbus協議....10
2.9.1 Modbus RTU概述....11
2.9.2 Modbus TCP概述....12
2.10 OPC UA概述....12
2.10.1 OPC 與OPC UA 比較....12
2.11 PWM脈衝寬度調變....13
第三章 系統架構....14
3.1 系統架構....14
3.1.1 熔覆控制系統架構....15
3.1.2 熔覆控制系統介面架構....16
3.1.3 手臂控制系統架構....17
3.1.4 影像採集架構....18
第四章 系統實作....19
4.1 實驗場域....19
4.2 硬體設備....20
4.2.1 雷射機....20
4.2.2 機械手臂與熔覆頭....21
4.2.3 送粉機....22
4.2.4 PLC可程式控制器....23
4.2.5 工業攝影機....24
4.2.6 電腦....25
4.3 介面實作....26
4.3.1 登錄介面....26
4.3.2 主要控制介面....27
4.3.3 設定介面....30
4.3.4 圖表介面....32
4.4 系統流程....33
4.4.1 加工流程....33
4.4.2 回授控制流程....34
4.4.3 影像處理流程....35
4.5 影像採集....36
4.5.2 影像溫度演算法實驗設計....37
4.5.3 影像距離校正....38
第五章 系統實測....39
5.1 實驗規劃....39
5.1.1 熔覆路徑規劃....39
5.1.2 成品量測....40
5.2 實驗結果....41
5.2.1 單道熔覆實驗....41
5.2.2 熔覆堆疊實驗-固定雷射功率樣品....43
5.2.3 熔覆堆疊實驗-溫度PID控制....49
5.2.4 熔覆堆疊實驗-寬度PID控制....52
5.3 小結....57
5.4 PID參數影響....59
第六章 結論與未來展望....62
6.1 結論與未來展望....62
參考文獻....63
Extended Abstract....65

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