臺灣博碩士論文加值系統

在半導體封裝製程中，打線製程是利用金屬線材將各式的晶片訊號和半導體元件相互連接，在近年來，銅線製程在打線封裝中已被廣泛利用，相較於金線、銀線，銅線具有較好的熱傳導率、較好的機械性質及擁有較低的成本優勢。
在本文中，選用了新型的銅線-金鈀銅線(AuPd-Cu)作為本次打線實驗的線材，利用田口實驗方法望大品質特性，選擇可以直接影響銲線品質的四個控制因子為作業溫度、超音波功率輸出、壓合時間、壓合力量，並配合L_9(3^4)直交表，來探討銅線製程第一銲點拉力最佳參數設計。品質驗證方式，首先將打線後的樣品至顯微鏡下觀察確定合乎外觀品質標準，在利用DAGE-4000推拉力測試機取得銅線第一銲點拉力值及推力值，並以田口法望大品質特性之訊號雜訊比分析得出銅線第一銲點拉力最佳化參數組合。
在本次研究中，利用田口實驗方法得出的最佳化參數相較於對照組參數，第一銲點平均拉力由原本的4.6 g提升到5.9 g，平均拉力增加1.3 g，整體拉力值提升28%，實驗得到的最佳組參數S/N比優於對照組參數S/N比，從13.21 db提升到15.40 db，增加2.19 db，整體提升16%。而第一銲點平均推球值從原本的13.57 g提升14.80 g，平均推力增加1.23 g，整體推力值提升9%，最佳化參數實驗結果，平均拉力值及平均推球值提高，證明第一銲點的銲接強度有明顯增加。

In the semiconductor packaging process, the wire bonding process is making signal interconnection between IC chip and semiconductor device by using metal wire. In recent years, copper wire has been widely used in wire bonding packaging. Compared to gold or silver wire, copper wire has advantage on better thermal conductivity, better mechanical properties and lower cost.
In this study, new type of copper wire (AuPd-Cu) has been chosen as the metal wire of this experiment. To optimize first bond parameter design, there are four control factors, bonding temperature, ultrasonic power current, bonding time and bonding force, which can affect bonding quality by using Taguchi Method with L_9(3^4) Orthogonal Arrays. Quality verification start with checking the sample of standard appearance quality under microscope. Then, using DAGE-4000 test machine to collect the experiment data of first bond wire pull and ball shear. Based on the analysis of Taguchi method with S/N ratios for large the better characteristics to obtain the optimization of first bond wire pull of parameter design.
The experiment results show that compare original parameter to optimal parameter which used Taguchi method, the first bond wire pull increased from 4.6 g to 5.9 g, and the overall wire pull increased 28%. The S/N ratio of optimal parameter was also higher than the original parameter which increased from 13.21 db to 15.40 db, and the overall S/N ratio increased 16%. Also, the ball shear of first bond increased from 13.57 g to 14.80 g, the average of ball shear increased 9%. The experiment results of optimal parameter showed that both wire pull and ball shear were increased, which proved the strength of first bond increased significantly.

目 錄

摘 要 --------------------------------------------------------------- i
ABSTRACT--------------------------------------------------------------- ii
誌 謝 --------------------------------------------------------------- iv
目 錄 --------------------------------------------------------------- v
表 目 錄 --------------------------------------------------------------- vii
圖 目 錄 --------------------------------------------------------------- viii
符 號 說 明 ------------------------------------------------------- x
第一章 緒論 ------------------------------------------------------- 1
1.1 研究動機----------------------------------------------------------- 1
1.2 文獻回顧----------------------------------------------------------- 3
1.2.1 田口方法------------------------------------------------------- 3
1.2.2 銅銲線封裝發展探討---------------------------------------------- 4
1.3 研究方法----------------------------------------------------------- 6
1.4 研究流程----------------------------------------------------------- 7
第二章 銲線封裝製程原理與品質檢驗介紹------------------------------------- 8
2.1 半導體銲線封裝製程介紹---------------------------------------------- 8
2.2 銲線接合技術介紹--------------------------------------------------- 8
2.2.1 熱壓接合------------------------------------------------------- 10
2.2.2 超音波接合----------------------------------------------------- 10
2.2.3 熱超音波接合--------------------------------------------------- 10
2.3 銲線封裝接合流程介紹------------------------------------------------ 11
2.4 銲針介紹(Capillary)------------------------------------------------ 13
2.5 封裝機台介紹------------------------------------------------------- 16
2.6 銲線封裝產品品質檢驗方法介紹----------------------------------------- 19
2.6.1 銲線封裝球型量測----------------------------------------------- 19
2.6.2 銲線拉力測試(Wire Pull test)------------------------------------21
2.6.3 銲線推球測試(Ball Shear test)---------------------------------- 26
2.6.4 介面金屬共化物(Intermetallic Compound)------------------------- 28
2.7 銲線介紹----------------------------------------------------------- 29
2.8 氮氫混合氣體介紹--------------------------------------------------- 31
第三章 研究方法之最佳化參數實驗設計--------------------------------------- 32
3.1 田口品質工程------------------------------------------------------- 32
3.1.1 信號雜訊比與品質特性-------------------------------------------- 32
3.1.2 實驗因子定義與選擇---------------------------------------------- 36
3.1.3 魚骨圖(要因分析圖)--------------------------------------------- 38
3.1.4 田口式直交表--------------------------------------------------- 39
3.1.5 因子反應表與因子反應圖------------------------------------------ 40
3.1.6 田口方法確認實驗----------------------------------------------- 42
3.2 參數最佳化實驗研究方法---------------------------------------------- 43
3.2.1 研究架構------------------------------------------------------- 45
3.2.2 銲接參數選用--------------------------------------------------- 46
3.2.3 實驗打線材料--------------------------------------------------- 48
3.2.4 銲針選用------------------------------------------------------- 49
3.2.5 品質驗證標準----------------------------------------------------50
第四章 實驗結果與討論---------------------------------------------------- 51
4.1 田口實驗結果與第一銲點數據------------------------------------------ 51
4.2 第一銲點最佳參數分析------------------------------------------------ 54
4.3 影響第一銲點拉力因子之變異數分析------------------------------------- 58
4.4 實驗結果分析與驗證-------------------------------------------------- 59
第五章 結論與未來展望---------------------------------------------------- 62
5.1 結論-------------------------------------------------------------- 62
5.2 未來研究展望------------------------------------------------------- 63
參考文獻---------------------------------------------------------------- 64

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