臺灣博碩士論文加值系統

電子封裝由多種材料集合而成，因熱膨脹係數不匹配在熱負載下造成相異材料界面產生脫層，而脫層可能產生線路訊號中斷或電源短路現象，都會造成封裝功能損壞。而封膠環氧樹脂之材料擁有吸濕特性，當內部發生細微脫層之時水分將滲入於此，受到製程高溫環境或使用時功能轉換產生的熱能，使得脫層間水分蒸氣化，最為嚴重之情況將會發生元件鼓脹和爆裂，導致封裝嚴重損壞。
本研究主要分成兩部分，第一部分為使用雙懸臂樑實驗作為雙材料之界面強度量測與探討，進而建立有效與符合實際封裝材料的界面強度量測方法，研究中以銅導線架與環氧樹脂封膠之界面為探討對象，量測其界面結合強度。此外，實驗中亦透過架構影像量測系統藉以即時量測裂紋擴展時之裂紋長度，並將其與雙懸臂樑實驗模擬分析之裂紋長度結果比對驗證，結果顯示兩者誤差小於10%以內，因此可藉由雙懸臂樑模擬分析之方法，求得裂紋長度減少重複實驗之需求，並進一步將其帶入解析解與模擬分析中求得應變能量釋放率，結果顯示數值分析與模擬分析誤差小於13%以內，進而驗證模擬分析之可行性。再者以實際產品之超薄四方平面無引腳封裝作為分析載具，探討後熟化製程熱負載影響之翹曲行為下，結構中銅導線架與環氧樹脂封膠之界面強度，以結構設計為目標，分析封裝體在不同幾何設計下產生脫層損傷之風險，此分析模型結合實驗設計與反應曲面法求其影響界面結合強度之因子，主要探討因子為環氧樹脂封膠厚度、晶片厚度、晶片尺寸與黏晶膠厚度變化下對裂紋尖端能量之影響。結果顯示:
1.熱負載影響下，應力集中於晶片外圍四周，與實際封裝生產脫層處相同，顯示脫層一般發生在應力集中處。
2.黏晶膠厚度與晶片厚度為影響界面強度之主要因子，增加黏晶膠厚度以及降低晶片厚度可有效降低裂紋尖端之應變能量釋放率，減少裂紋擴展之損傷風險。
3.反應曲面分析結果顯示，封裝幾何優化設計參數為，封膠厚度765μm、晶片厚度180μm、晶片2尺寸4480*1630μm以及黏晶膠厚度15μm，此組合裂紋應變能釋放率與原尺寸設計相比，下降了11%。

Electronic packaging is composed of a variety of materials, due to thermal expansion coefficient mismatch in the thermal load caused by the dissociation of the material interface to produce delamination, and delamination may produce line signal interruption or power short circuit phenomenon, will cause damage to the package function. The material of the encapsulant epoxy resin has moisture absorption characteristics, when the internal fine delamination occurs, the moisture will penetrate here, by the process of high-temperature environment or the thermal energy generated by the use of functional conversion, so that the water vaporization between the delamination, the most serious situation will occur component swelling and bursting, resulting in serious damage to the package, so the delamination phenomenon is resolutely important.
This research has been divided primarily into two sections. Using the double cantilever experiment, the interfacial strength of two materials is measured and discussed in the first section. Additionally, it has created a practical and efficient method for measuring the interface strength of the packaging material. The research object is the interface between the copper lead- frame and epoxy resin encapsulation, and its die bonding strength is examined. In addition, an image measurement system was adopted to measure the crack length in real-time throughout the experiment, and the results have been compared to the crack length results of the experimental simulation analysis of the double cantilever beam. The data has indicated that the difference between the two is less than 10%. Therefore, it might be replaced by the simulation analysis of a double cantilever beam to lessen the complexity of determining the fracture length and to incorporate it into the analytical solution and simulation analysis for determining the energy release rate. The results have demonstrated that numerical analysis and simulation analysis between the is less than 13%, and the feasibility of the simulation has been confirmed. Moreover, the very very-thin quad flat no-lead package of the actual product is used as the analysis vehicle to discuss the interfacial strength between the copper lead-frame and the epoxy resin encapsulation in the structure under the thermal loading of warpage of the post molding curing process in an effort to design the structure. It is planned to assess the risk of delamination damage to packaging under various geometric designs. This optimization analysis model has combined the design of experiment and the response surface methodology to identify the factors that influence the interface bonding strength. The influence of epoxy resin encapsulation thickness, die thickness, die size, and die-bond thickness on crack tip energy is explored in detail. The results have indicated:
1.Under the influence of thermal load, the stress is concentrated around the periphery of the die, which is the same as the actual package production delamination, indicating that the delamination generally occurs at the stress concentration.
2.The interface strength is affected by the thickness of the die bonding and the thickness of the die. Increasing the thickness of the die bonding and decreasing the thickness of the die can effectively lower the energy release rate at the crack tip and the propagation damage risk.
3.The Response Surface Methodology analysis results show that the optimization design parameters of the package geometry are 765μm compound thickness, 180μm die thickness, die2 size 4480*1630μm and die bonding thickness 15μm, and the combined crack strain energy release rate is reduced by 11% compared with the original size design.

中文摘要......i
英文摘要......ii
誌謝......iv
目錄......v
表目錄......vii
圖目錄......viii
首字母縮略詞......xii
符號說明......xiv
第一章 緒論......1
1.1 前言......1
1.2 文獻回顧......1
1.2.1 相異材料之界面強度量測實驗......2
1.2.2 電子封裝脫層分析......4
1.3 研究目的與動機......6
1.4 研究流程......7
第二章 電子封裝介紹......9
2.1 封裝發展趨勢與種類......9
2.1.1 金屬導線架封裝......10
2.1.2 塑膠載板封裝......11
2.2 QFN封裝製程概述......13
2.2.1 晶圓檢驗......13
2.2.2 晶圓背面研磨......13
2.2.3 晶圓黏片......14
2.2.4 晶圓切割......15
2.2.5 黏晶粒與黏晶膠烘烤......15
2.2.6 電漿清洗......16
2.2.7 銲線......16
2.2.8 封膠......17
2.2.9 後熟化烘烤......18
2.2.10 蓋印......18
2.2.11 電鍍......19
2.2.12 封裝切割......19
2.2.13 封裝檢測與包裝......20
第三章 異質材料界面脫層理論分析......21
3.1 破壞力學理論......21
3.2 虛擬裂紋閉合法......26
第四章 DCB界面強度量測實驗......31
4.1 雙材料銅與EMC試片......32
4.1.1 雙材料樣品製作......32
4.1.2 實驗樣品切割......34
4.2 雙懸臂樑拉伸實驗方式與步驟......35
4.2.1 DCB實驗治具設計......35
4.2.2 DCB實驗試片夾持......36
4.2.3 DCB實驗設備與安裝架設......38
4.3 實驗結果與討論......40
4.4 DCB實驗模擬分析......43
4.5 臨界應變能釋放率......45
第五章 WQFN封裝脫層模擬分析......48
5.1 封裝結構模型......48
5.2 封裝材料參數......49
5.3 模型邊界設定......49
5.4 WQFN封裝分析結果驗證與熱應力分析......50
5.4.1 分析結果驗證......50
5.4.2 封裝結構之熱應力分析......51
5.5 裂紋脫層分析方法之驗證......52
5.6 WQFN封裝銅與EMC之界面脫層分析......55
第六章 WQFN封裝優化設計與分析......57
6.1 實驗設計與分析方法......57
6.1.1 反應曲面法......57
6.2 反應曲面分析結果與討論......60
6.2.1 中央合成設計之DOE......60
6.2.2 迴歸模型檢定與因子顯著性分析......63
6.2.3 反應曲面分析......64
6.2.4 反應曲面優化分析結果......65
第七章 結論與未來展望......67
7.1 結論......67
7.2 未來展望......68
參考文獻......69
Extended Abstract......71

[1]W. D. van Driel, M. A. J. van Gils, R. B. R. van Silfhout, G. Q. Zhang, "Prediction of Delamination Related IC & Packaging Reliability Problems", Microelectronics Reliability, pp. 1633-1638, 2005.
[2]蕭献賦 著，2015，實用IC封裝，五南圖書出版,，台北市。
[3]鐘文仁，陳佑任 著，2021，IC封裝製程與CAE應用，全華圖書出版，四版，新北市。
[4]B. Blackman, J. P. Dear, A. J. Kinloch, S. Osiyemi, " The calculation of adhesive fracture energies from double-cantilever beam test specimens", Journal of Materials Science Letters, Vol. 10, pp. 253-256, 1991.
[5]W. O. Soboyejo, G. -Y. Lu, S. Chengalva, J. Zhang, V. Kenner, "A Modified Mixed-Mode Bending Specimen for the Interfacial Fracture Testing of Dissimilar Materials", Fatigue Fract Eng Mater Struct, Vol. 22, pp. 799-810, 1999.
[6]W. D. van Driel, C. J. Lin, G. Q. Zhang, J. H. J Janssen, R.B.R. van Silfhout, M.A.J. van Gils, L.J. Ernst, "Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods", Microelectronics Reliability, 2004.
[7]S. Park, Z. Tang, S. Chung, "Temperature Effect of Interfacial Fracture Toughness on Underfill for Pb-Free Flip Chip Packages", In 2007 Proceedings 57th Electronic Components and Technology Conference, Sparks, NV, USA: IEEE.
[8]B. Wunderle, M. Schulz, J. Keller, I. Maus, H. Pape, B. Michel, "Advanced Mixed-Mode Bending Test: A Rapid, Inexpensive and Accurate Method for Fracture-Mechanical Interface Characterisation", 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012.
[9]S. Akbari, A. Nourani, J. K. Spelt, "Cohesive Zone Modeling of Failure in Underfilled BGA-PCB Assemblies Under Bending", SMTA Proceedings, pp. 287-293, 2016.
[10]D. Samet, V. N. N. T. Rambhatla, A. Kwatra, S. K. Sitaraman, "A Fatigue Crack Propagation Model With Resistance Curve Effects for an Epoxy/Copper Interface", Engineering Fracture Mechanics, Vol. 180, 60-72, 2017.
[11]N. Pflügler, G. M. Reuther"Advanced Risk Analysis of Interface Delamination in Semiconductor Packages: A Novel Experimental Approach to Calibrating Cohesive Zone Elements for Finite Element Modelling", 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2018.
[12]Z. Chen, K. Zhou, X. Lu, Y. C. Lam, "A Review on the Mechanical Methods for Evaluating Coating Adhesion", Acta Mechanica, Vol. 12, pp. 431-452, 2014.
[13]T. Y. Tee, Z. Zhong, "Integrated Vapor Pressure, Hygroswelling, and Thermo-Mechanical Stress Modeling of QFN Package During Reflow With Interfacial Fracture Mechanics Analysis", Microelectronics Reliability, Vol. 44, pp. 105-114, 2004.
[14]Y. Gu, T. Nakamura, "Interfacial Delamination and Fatigue Life Estimation of 3D Solder Bumps in Flip-Chip Packages", Microelectronics Reliability, Vol. 44, pp. 471-483, 2004.
[15]C. J. Wu, M. C. Hsieh, C. C. Chiu, M. C. Yew, K. N. Chiang, "Interfacial Delamination Investigation Between Copper Bumps in 3D Chip Stacking Package by Using the Modified Virtual Crack Closure Technique", Microelectronic Engineering, Vol. 88, pp. 739-744, 2011.
[16]S. Gowthaman, U. Rahangdale, DerejeAgonafer, "Impact of Thermal Loading on The Structural Integrity of 3D TSV Package", SMTA Proceedings, pp. 63-68, 2016.
[17]C. K. Hsu, P. Y. Lin, W. Y. Lin, M. C. Yew, S. S. Yeh, K. C. Lee, J. H. Wang, P. C. Lai, C. C. Yang, S. P. Jeng, "Interfacial Strength Characterization and Simulation of the Stacked Copper-Polymer Structures in Fan-out Packages", In 2018 IEEE 68th Electronic Components and Technology Conference, San Diego, CA, USA: IEEE.
[18]N. R. E. G. Lim, A. T. Ubando, J. A. Gonzaga, R. R. N. Dimagiba, "Finite Element Analysis on the Factors Affecting Die Crack Propagation in BGA Under Thermo-Mechanical Loading", Engineering Failure Analysis, Vol. 116, 2020.
[19]李錚鴻, "去膠製程對四側無引腳扁平構裝產品(QFA)外露晶片座脫層之研究", 碩士, 化學工程與材料工程研究所, 國立高雄應用科技大學, 高雄市, 2011.
[20]莊東漢 著，2007，材料破損分析，五南圖書出版，台北市。
[21]岡村弘之 著，2009，線彈性破壞力學基礎，五南圖書出版，台北市。
[22]E. F. Rybicki, M. F. Kanninen, "A finite element calculation of stress intensity factors by a modified crack closure integral", Engineering Fracture Mechanics, Vol. 9, pp. 931-938, 1977.
[23]R. Krueger, "Virtual crack closure technique: History, approach, and applications", Applied Mechanics Reviews 57th, pp. 109-143, 2004.
[24]Douglas C. Montgomery 著，黎正中、唐麗英 編譯，2019，實驗設計與分析，高立圖書出版，新北市。
[25]ANSYS Inc, "DesignXplorer User's Guide", Release ANSYS 2021 R1.
[26]林煌鈞, "應用虛擬裂紋閉合法於三維界面裂紋問題", 碩士, 機械工程學系, 國立成功大學, 台南市, 2008.