本研究藉由機器視覺二維和三維檢測用於半導體塗層檢測系統，運用於半導
體元件及陶瓷基板。以往半導體機台檢測系統都使用二維(2D)做檢測，但科技日
新月異，許多元件精密度極高，所以需要更詳細且謹慎的檢測三維(3D)，避免未
察覺瑕疵品。這次實驗我們以 2D 取像二值化與 3D 智慧感測器做為量測及檢測
之工具。3D 雷射感測器可檢測運動目標，其解析度可達 1.5 μm 取樣速率最高可
達 35 kHz，且可一次性掃描生成 3D 點雲圖，可運用於機器人身上。2D 視覺無
法檢測一個物件的 3D 幾何資料，而 3D 檢測可提供物體形狀相關的空間幾何尺
寸資料。不論是印刷電路板(PCB)線上檢測或陶瓷基板封裝都能用於複雜量測的
表面資料。利用 3D 檢測可大幅增加良率藉此討論其機械性質與可靠度。再將 2D
檢測結果與 3D 量測數據做為依據的佐證資料。
關鍵字：三維、機器視覺檢測、感測器、印刷電路板、陶瓷基板、點雲圖

This study is applied to semiconductor components and ceramic substrates by 2D and 3D machine vision inspection systems. In the past, the semiconductor machine inspection system used 2D for testing, but the technology is changing with each passing day, and many components are extremely precise. Therefore, it is necessary to detect 3D in more detail and carefully, so as to avoid unawareness. In this experiment, we use 2D image binarization and 3D smart sensor as a tool for measurement and detection. 3D laser sensor can detect moving targets with resolution up to 1.5μm and sampling rate up to 35 kHz. The 3D point cloud map can be generated in one time and can be applied to the robot. 2D vision can not detect the 3D geometry of an object, and 3D detection can provide spatial geometry data related to the shape of the object. Whether it is printed circuit board (PCB) on-line inspection or ceramic substrate packaging can be used for surface measurement of complex measurements. The use of 3D inspection can greatly increase the yield by discussing its mechanical properties and reliability. The 2D test results and 3D measurement data are used as supporting evidence. Keywords: 3D, Mechanical vision, inspection Sensor, Printed circuit,
board Ceramic substrate, Point cloud

摘 要 i
ABSTRACT ii
誌 謝 iii
目 錄 iv
圖目錄 vii
表目錄 x
符號說明 xi
第一章 緒論 1
1.1 前言 1
1.2 研究動機與目的 1
1.3 3D 檢測發展與現況 2
1.4 文獻回顧 2
1.5 本文架構 7
第二章 基礎理論 8
2.1 2D與3D基礎理論 8
2.1.1 檢測定義與原理 8
2.1.2 2D檢測 12
2.1.3 3D檢測 17
2.1.4 2D二值化 19
2.1.5 3D點雲圖 20
第三章 實驗方法與實驗分析設備 21
3.1 實驗光源 21
3.2 實驗架構 21
3.3 實驗方法及步驟 21
3.3.1 2D取像 22
3.3.2 3D檢測 23
3.4 2D與3D實際量測效果比較 24
3.5 實驗製程儀器介紹 30
3.5.1 相機 30
3.5.2 鏡頭 31
3.5.3 雷射感測器 32
3.5.4 LED光源 33
3.6 實驗量測與分析儀器介紹 34
3.6.1 照度計 34
3.6.2 色溫(Color temperature) 35
3.6.3 相機軟體(Camera software) 35
3.6.4 雷射感測器軟體(LMI software) 36
第四章 檢測設備結構分析與應用 37
4.1 光源合成取像特性分析與應用 37
4.1.1 光源形式結構分析與應用 37
4.1.2 光源角度結構分析與應用 41
4.1.3 光源色溫結構分析與應用 42
4.2 工業鏡頭特性分析 43
4.2.1 光圈結構分析與應用 46
4.2.2焦段結構分析與應用 46
第五章 3D感測器結構分析與應用 47
5.1 3D檢測半導體元件特性分析 47
5.1.1實際精度結構分析 48
5.1.2重複經度結構分析 50
5.2 3D檢測半導體元件點雲圖特性分析 51
第六章 結論與未來展望 55
6.1 結論 55
6.2 未來展望 56
參考文獻 57

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