本研究的焦點在於微機電氣體感測器封裝結構，將泛用之聚四氟乙烯 （鐵氟龍） 膜與塑膠蓋整合成單一的蓋體，目的是做出一個優於現有市售產品，具高效能與低成本的封裝體，提供實務應用的參考。首先透過文獻回顧與專利探勘，了解現有的科技發展現況，然後採用TRIZ方法與矛盾矩陣分析，找出可用之創新法則，再根據這些創新法則逐步做出微機電氣體感測器封裝結構之創新設計。再佐以個案研究方法，將創新設計確實實現；同時製作出有效模具，成功地將環氧樹脂與聚四氟乙烯膜嵌入模具，以一次成型做出預先成型的異質整合蓋體。接著，將微機電氣體感測器晶片經封裝製程，結合此一創新設計之蓋體，完成微機電氣體感測器個體封裝。最後，此一微機電氣體感測器封裝體經過初始特性測試後，再施以高加速應力測試，確認其電器特性功能穩定。並藉由電子顯微鏡觀察其斷面微結構，證實具多孔特性的PTFE與環氧樹脂在接合面產生機械互鎖接合，可以取代黏著劑的貼合，提供一種高效、低成本的解決方案。研究結果顯示此一微機電氣體感測器封裝體具有實務應用的價值，可以提供相關產業的參考。

This study focuses on the packaging structure of the MEMS gas sensors. This structure incorporates the commonly employed polytetrafluoroethylene film and plastic in the covering processes. A process outperforms the existing commercial processes and offers high performance and affordability.
This study first reviews literature and patents for comprehending the current landscape of technological advancements. The TRIZ method and the contradiction matrix analysis are then applied to find possible solutions. These principles serve as the foundation for the stepwise innovation of the packaging structure in the new MEMS gas sensor design.
Through case studies, the innovative design is translated into reality. This involves the production of a functional mold, embedding PTFE film within it, and forming a preformed heterogeneous integrated cover using epoxy resin molding. The MEMS gas sensor chip is seamlessly merged with this innovative cover, thus finalizing the packaging process. To validate stability, the MEMS gas sensor package undergoes a highly accelerated stress test following the initial characterization test. This rigorous examination ensures that its electrical attributes remain steadfast, functions are consistent, and reliability aligns with industry benchmarks.
Subsequently, the microstructure of the cross-section is examined via SEM. This analysis reveals that the porous PTFE bonding interface is effectively filled by the epoxy molding resin, culminating in a mechanical interlocking bonding structure. This structure supplants the conventional adhesive-based approach, delivering an efficient and cost-effective solution.
This study shows that this innovative MEMS gas sensor package has practical application value and can provide a reference for related industries.

中文摘要 --------------------------------------------------------------------------------i
英文摘要 --------------------------------------------------------------------------------ii
誌謝 ------------------------------------------------------------------------------------iv
目錄 ------------------------------------------------------------------------------------v
表目錄 ----------------------------------------------------------------------------------vii
圖目錄 ----------------------------------------------------------------------------------viii
一、 緒論 -------------------------------------------------------------------------------1
1.1 研究背景 --------------------------------------------------------------------------- 1
1.2 研究動機 --------------------------------------------------------------------------- 3
1.3 研究目的 --------------------------------------------------------------------------- 7
1.4 研究流程 --------------------------------------------------------------------------- 9
1.5 研究方法與限制 --------------------------------------------------------------------10
二、 文獻探討 --------------------------------------------------------------------------11
2.1 一般文獻 ---------------------------------------------------------------------------11
2.2 文件與專利探勘 --------------------------------------------------------------------16
2.3 文獻探討與專利技術探勘彙整--------------------------------------------------------25
三、 TRIZ理論 --------------------------------------------------------------------------27
3.1 TRIZ介紹 ---------------------------------------------------------------------------27
3.2 TRIZ的理論基礎 --------------------------------------------------------------------28
3.3 TRIZ的流程與方法 ------------------------------------------------------------------32
3.4 矛盾理論與發明原理 ----------------------------------------------------------------34
四、 研究案例設計與實施 ----------------------------------------------------------------41
4.1 塑膠蓋體之創新設計與實施 --------------------------------------------------------- 41
4.2 解決創新蓋體製造問題 -------------------------------------------------------------- 53
4.3 創新蓋體應用效能驗證-------------------------------------------------------------- 56
五、 結果分析 ---------------------------------------------------------------------------59
5.1 蓋體結構分析－設計與製作---------------------------------------------------------- 59
5.2 PTFE膜與蓋體接合強度------------------------------------------------------------- 61
5.3 移除黏著劑後的接合機制------------------------------------------------------------ 62
5.4 創新蓋體對惡化條件的改善---------------------------------------------------------- 63
5.5 高濕度穩定性驗證------------------------------------------------------------------- 66
5.6 高度加速壓力測試 ------------------------------------------------------------------ 67
六、 結論與建議 ------------------------------------------------------------------------ 69
6.1 結論 ------------------------------------------------------------------------------- 69
6.2 建議 ------------------------------------------------------------------------------- 70
參考文獻-------------------------------------------------------------------------------- 71
附錄一 TRIZ 39項工程參數------------------------------------------------------------ 77
附錄二 TRIZ 40創新原則與次原則------------------------------------------------------ 79
附錄三 TRIZ 矛盾矩陣(39x39)--------------------------------------------------------- 83
附錄四 無偏壓高加速溫濕度測試報告--------------------------------------------------- 87

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