臺灣博碩士論文加值系統

本研究結合(a)六個標準差(b)實驗設計法，建立一套完整的管理專案及最佳化實驗的方法。
工程師面對任何機械或工程問題時，必須要有完整的規劃，有效率的執行且持續的追蹤，最終得到結果並驗證其準確性。透過六個標準差的定義、量測、分析、改善、驗證與控制6個階段來執行專案。
現今的業界中，大部分的改善測試實驗，皆以試誤法進行，且會因組裝方式不同、供應商品質不一與環境因素等，導致雜訊比過高實驗數據不準確。故本研究使用實驗設計法，管控供應商、固定組裝方式並調整相關參數以量化指標去分析 判斷最佳化結果，最終得出一組最佳的參數。
在競爭激烈的自動化設備產業中，機台的精度與穩定性成為了該企業競爭力的關鍵因素。PCB裁板磨邊機為捷惠自動公司的主要產品，而裁板磨邊在PCB電路板的製程中屬於前端製程，經由鑽靶機鑽孔定位後，PCB板經由送板機進入到裁板磨邊機完成裁切及磨邊兩個製程，裁磨完成之PCB板經由輸送滾輪進入到圓角機磨圓角，視客戶需求後續可能有水洗、烘烤等製程，故裁板磨邊必須確保板邊平整且沒有分層產生，否則容易板邊產生撕裂，進而使PCB複合板間產生縫隙，使後續製程容易有水分或粉塵進入板子，成為了必須要解決的問題。
經由工程師設計出一新型裁刀組，可根據不同板厚去調整上下裁刀組之間隙及裁板中心位置，但因相關切削參數過去皆以經驗為參考依據，固本研究針對不同的板厚，調整參數，以應對現在客戶PCB板厚度多樣且極端化之趨勢。
量測方式為(a)將加工完成之PCB板以雷射測距儀量測板材厚度 (b)使用三次元量測機量測精度量測PCB之。以(a)(b)兩者結果為判斷標準，修改裁刀組切削參數以得到最佳之切削參數。

This paper combines (a) Six Sigma (b) Experimental Analysis and Optimization methods to establish a complete set of management projects and methods for optimizing experiments.
When facing any mechanical or engineering problems, engineers must have complete planning, efficient execution and continuous tracking, and finally get the results and verify their accuracy. The project is executed through six stages of definition, measurement, analysis, improvement, verification and control of six standard deviations.
In the industry, most of the improvement test experiments are conducted by trial and error, and the experimental data will be inaccurate due to different assembly methods, different supplier quality and environmental factors. Therefore, this study uses an experimental design method to control suppliers, fix assembly methods and adjust relevant parameters to quantify indicators to analyze and judge the optimized results, and finally get a set of optimal parameters.
In the automation equipment industry, the accuracy and stability of the machine have become the key factors for the competitiveness of the enterprise. PCB sheets cutting machine is the main product of Jiehui Automatic Company, and sheets cutting is a front-end process in the PCB circuit board process. After drilling and positioning through the drilling target machine, the PCB board enters the cutting board through the board feeder The edging machine completes the two processes of cutting and edging. The PCB board after the completion of the grinding enters the rounding machine through the conveying roller to grind the corners. Depending on customer needs, there may be subsequent processes such as washing and baking. Ensure that the edges of the board are flat and there are no gaps. Otherwise, the edges of the board are likely to be torn, which will cause gaps between the PCB composite boards, making it easy for moisture or dust to enter the board in the subsequent process, which has become a problem that must be solved.Engineers have designed a new cutting tool set, which can adjust the gap between the upper and lower cutting tool sets and the center position of the cutting plate according to different plate thicknesses. However, because the relevant cutting parameters used to be based on experience in the past, this study focuses on different plate thicknesses , Adjust the parameters to cope with the trend of customers' PCB board thickness and extreme.
The measurement method is: (a) use the laser distance meter to measure the thickness of the processed PCB board; (b) use a three-dimensional measuring machine to measure the accuracy of the PCB. Taking the results of (a) and (b) as the judgment criteria, modify the cutting parameters of the cutter set to obtain the best cutting parameters.

中文摘要.......................................................i
英文摘要......................................................ii
誌謝..........................................................iv
目錄...........................................................v
表目錄.........................................................vii
圖目錄.......................................................ix
第一章 緒論....................................................1
1.1 研究動機...................................................1
第二章 理論基礎................................................2
2.1 切削原理...................................................2
2.2 PCB板尺寸精度規範..........................................6
2.3 六個標準差.................................................8
第三章 定義階段...............................................15
3.1 SIPOC.....................................................15
3.2 甘特圖....................................................16
第四章 量測階段...............................................17
4.1 設備介紹..................................................17
4.2 魚骨圖....................................................24
4.3 實驗規劃..................................................26
4.4 量測系統分析..............................................28
第五章 分析階段...............................................40
5.1 穩定性分析................................................40
第六章 改善階段...............................................46
6.1 實驗設計流程..............................................46
6.2 定義問題..................................................47
6.3 選擇分析方式..............................................47
6.4 ANOVA分析.................................................52
6.5 殘差分析..................................................58
6.6 影響度分析................................................67
6.7 實驗數據與結果............................................73
第七章 控制階段...............................................75
7.1 風險管理..................................................75
第八章 Design-Expert分析流程..................................82
8.1 結論......................................................82
8.2 未來展望..................................................82
參考文獻......................................................83

[1]謝傑任，2011，”六個標準差的品質管制”，全華圖書
[2]傑惠自動公司
[3]Douglas C. Montgomery，2017，”實驗設計與分析”，高立圖書
[4]Minitab電子型錄，昊青股份有限公司
[5]Design-Expert，全傑科技
[6]雷射測距儀電子型錄，台灣基恩斯
[7]洪良德，2016，”切削刀具學”，全華圖書