|
[1]G. Harman, Wire bonding in microelectronics. McGraw-Hill Education, 2010. [2]W. D. van Driel, R. B. R. van Silfhout, and G. Q. Zhang, "Reliability of wirebonds in micro-electronic packages," Microelectronics international, vol. 25, no. 2, pp. 15-22, 2008, doi: 10.1108/13565360810875967. [3]R. Batorfi and Z. Illyefalvi-Vitez, "Mechanical properties of thermosonic thin gold wire bonds," in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE), 11-15 May 2011 2011, pp. 112-117, doi: 10.1109/ISSE.2011.6053561. [4]R. Batorfi and Z. Illyefalvi-Vitez, "Defect analysis of ultrasonic al wire bonds on Ni-plated package leads," in 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME), 20-23 Oct. 2011 2011, pp. 137-140, doi: 10.1109/SIITME.2011.6102704. [5]C. Wang and R. Sun, "The quality test of wire bonding," Modern Applied Science, vol. 3, no. 12, pp. 50-56, 2009. [6]M. N. Ayuni, M. F. Lin, and L. Q. Zhe, "Deep Learning-Based Classification Approach for Wire Bonding Defects Inspection," in 2023 IEEE 8th International Conference On Software Engineering and Computer Systems (ICSECS), 25-27 Aug. 2023 2023, pp. 286-290, doi: 10.1109/ICSECS58457.2023.10256336. [7]S. Yu and H. Li, "Prediction of Microwave Characteristic Parameters Based on MMIC Gold Wire Bonding," Applied Sciences (2076-3417), Article vol. 13, no. 17, p. 9631, 09// 2023, doi: 10.3390/app13179631. [8]D.-B. Perng, C.-C. Chou, and S.-M. Lee, "Design and development of a new machine vision wire bonding inspection system," The International Journal of Advanced Manufacturing Technology, vol. 34, pp. 323-334, 2007. [9]D.-B. Perng, C.-C. Chou, and S.-M. Lee, "Illumination system for wire bonding inspection," Applied optics, vol. 46, no. 6, pp. 845-854, 2007. [10]C. Huabin, H. Jun, J. Ling, and J. Yingliang, "Defect analysis of copper ball bonding," in 2008 International Conference on Electronic Packaging Technology & High Density Packaging, 28-31 July 2008 2008, pp. 1-3, doi: 10.1109/ICEPT.2008.4607063. [11]F. Xue et al., "AOI Pattern Detection Study for Fine Pitch Advanced Substrate," in 2023 International Conference on Electronics Packaging (ICEP), 19-22 April 2023 2023, pp. 3-4, doi: 10.23919/ICEP58572.2023.10129720. [12]Y. Shih, C.-C. Kuo, and C.-H. Lee, "Low-Cost Real-Time Automated Optical Inspection Using Deep Learning and Attention Map," Intelligent Automation & Soft Computing, vol. 35, no. 2, 2023. [13]Y. M. Chang, T. L. Lin, H. C. Chi, and W. K. Lin, "Deep Learning-based AOI System for Detecting Component Marks," in 2023 IEEE International Conference on Big Data and Smart Computing (BigComp), 13-16 Feb. 2023 2023, pp. 243-247, doi: 10.1109/BigComp57234.2023.00046. [14]P. Dollár, Tu, Z., Perona, P., & Belongie, S., "Integral channel features," 2009. [15]N. Dalal and B. Triggs, "Histograms of oriented gradients for human detection," in 2005 IEEE Computer Society Conference on Computer Vision and Pattern Recognition (CVPR'05), 20-25 June 2005 2005, vol. 1, pp. 886-893 vol. 1, doi: 10.1109/CVPR.2005.177. [16]R. Girshick, J. Donahue, T. Darrell, and J. Malik, "Region-based convolutional networks for accurate object detection and segmentation," IEEE transactions on pattern analysis and machine intelligence, vol. 38, no. 1, pp. 142-158, 2015. [17]R. Girshick, "Fast r-cnn," in Proceedings of the IEEE international conference on computer vision, 2015, pp. 1440-1448. x [18]S. Ren, K. He, R. Girshick, and J. Sun, "Faster r-cnn: Towards real-time object detection with region proposal networks," Advances in neural information processing systems, vol. 28, 2015. [19]J. Redmon, S. Divvala, R. Girshick, and A. Farhadi, "You only look once: Unified, real-time object detection," in Proceedings of the IEEE conference on computer vision and pattern recognition, 2016, pp. 779-788. [20]W. Liu et al., "Ssd: Single shot multibox detector," in Computer Vision–ECCV 2016: 14th European Conference, Amsterdam, The Netherlands, October 11–14, 2016, Proceedings, Part I 14, 2016: Springer, pp. 21-37. [21]J. Terven and D. Cordova-Esparza, "A comprehensive review of YOLO: From YOLOv1 to YOLOv8 and beyond," arXiv preprint arXiv:2304.00501, 2023. [22]H. Rau and C.-H. Wu, "Automatic optical inspection for detecting defects on printed circuit board inner layers," The International Journal of Advanced Manufacturing Technology, vol. 25, pp. 940-946, 2005. [23]D.-B. Perng, S.-M. Lee, and C.-C. Chou, "Automated bonding position inspection on multi-layered wire IC using machine vision," International journal of production research, vol. 48, no. 23, pp. 6977-7001, 2010. [24]Z. Zhong, "Overview of wire bonding using copper wire or insulated wire," Microelectronics Reliability, vol. 51, no. 1, pp. 4-12, 2011. [25]"Semikron checks DCBs with automatic wirebond AOI from Viscom," Microelectronics International, vol. 30, no. 3, 2013, doi: 10.1108/mi.2013.21830caa.008. [26]M. Janóczki, Á. Becker, L. Jakab, R. Gróf, and T. Takács, "Automatic optical inspection of soldering," Materials Science-Advanced Topics, pp. 2156-3950, 2013. [27]N. Cai, J. Lin, Q. Ye, H. Wang, S. Weng, and B. W.-K. Ling, "A new IC solder joint inspection method for an automatic optical inspection system based on an improved visual background extraction algorithm," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, no. 1, pp. 161-172, 2015. [28]H. Gu, M. Zhu, W. Zhang, H. Zhu, and L. Zhang, "Study on the touch risk of high density packaging bonding wire under mechanical shock condition," in 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 14-16 Dec. 2017 2017, pp. 1-4, doi: 10.1109/EDAPS.2017.8277023. [29]B. Zhu, L. Liu, Y. Zhang, J. Chen, X. Wang, and F. Zhao, "Failure Case Analysis and Failure Prevention Method of PhotoMOS Relay Bonding Defect," in 2019 20th International Conference on Electronic Packaging Technology(ICEPT), 12-15 Aug. 2019 2019, pp. 1-4, doi: 10.1109/ICEPT47577.2019.245194. [30]M. Abd Al Rahman and A. Mousavi, "A review and analysis of automatic optical inspection and quality monitoring methods in electronics industry," Ieee Access, vol. 8, pp. 183192-183271, 2020. [31]S. Gao, C. F. Cheung, and D. Li, "Autostereoscopic Measurement System for Rapid 3D Inspection of Wire Bonding," in 2021 International Conference of Optical Imaging and Measurement (ICOIM), 27-29 Aug. 2021 2021, pp. 145-148, doi: 10.1109/ICOIM52180.2021.9524422. [32]L. Alam and N. Kehtarnavaz, "A survey of detection methods for die attachment and wire bonding defects in integrated circuit manufacturing," IEEE Access, vol. 10, pp. 83826-83840, 2022. [33]X. Lin, Y. He, H. Li, and H. Wu, "Research on Wire Feeding Device of Wire Bonding Machine," in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 10-13 Aug. 2022 2022, pp. 1-3, doi: 10.1109/ICEPT56209.2022.9873245.
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