臺灣博碩士論文加值系統

在封裝製程中，由於先進扇出型封裝中應用多種異質材料，且各材料之熱膨脹係數不匹配，因此會導致翹曲產生，使封裝材料產生熱應力，其應力常集中於界面處。此外，由於封裝材料中有易吸收濕氣之高分子材料，如應用於壓模灌膠之環氧樹脂、底部填充膠與再分布層之聚醯亞胺(Polymide, PI)等，使封裝體容易吸收環境中濕氣產生膨脹，並在熱製程時在相異材料接合處造成脫層或爆米花失效。為了降低上述問題之風險，本研究分為兩部分來探討封裝體在溫-濕環境下的脫層失效失效風險。
第一部分為透過雙懸臂樑測試探討在不同溫-濕條件下再分布層中Cu/PI之界面接合強度，並將實驗數據結合理論公式求解張裂型破壞之臨界應變能釋放率，以觀察溫-濕條件對其界面強度之影響；第二部分則以扇出型覆晶晶片尺寸封裝作為分析載體，建立其有限元素模型，並與陰影疊紋量測之實際封裝翹曲進行驗證，以確保有元素分析模型之適用性。後續將此模型應用於探討封裝載體在後熟化製程後再經溫-濕度環境測試所產生之失效風險。採用虛擬裂紋閉合技術探討再分布層中銅和PI裂紋尖端之張裂型能量釋放率，進而評估其界面產生脫層之風險。最後以田口實驗設計法評估幾何結構設計與材料選用對裂紋尖端應變能釋放率與翹曲值之影響。
1.試片之界面強度會受溫-濕條件影響：最大臨界力顯著下降。
2.由濕氣擴散模擬分析結果可以得知，FO-FCCSP在85℃/85%RH環境168小時後內部結構濕度已達到飽和。
3.從ANOVA分析結果得知，晶片厚度為顯著影響翹曲的因素，其貢獻率為 85.7%；而在G1方面，PI厚度之貢獻率為 75.8%為顯著影響G1之因子。
4.從田口灰關聯度分析的結果來看，當使用設計參數為EMC厚度130mm、晶片厚度689mm、PI厚度為10mm、RDL2銅覆蓋率為69%、選用G311-A-C為EMC材料時，與原始設計相比，能夠同時降低翹曲與G1，分別降低了45.7%與60.2%。

Advanced Fan-Out packaging is susceptible to thermally induced warpage caused by the mismatch in coefficients of thermal expansion (CTE) between different materials. And thermal-induced stresses are often concentrated at the interfaces. Moreover, some materials, such as molding compound, underfill, and polyimide, tend to absorb environmental moisture, causing expansion too. This can lead to delamination or popcorn failures at the interfaces during thermal processes. To mitigate these risks, this study is divided into two parts. The first part investigates the interface strength of the RDL layer under temperature-humidity conditions. Double cantilever beam testing was conducted on bi-material specimens under temperature-humidity preconditions to explore the interfacial strength between copper and polyimide. and observe the influence of MSL test conditions. The experimental data is combined with analytical formulas to determine the mode I critical strain energy release rate and observe the effect of different temperature-humidity conditions on interface strength. In the second section, a Fan-Out wafer-level chip scale packaging is used as a test vehicle and modeling by finite element method, validated with actual packaging warpage measured by shadow moiré. Subsequently, this model is applied to discuss coupled stress under hygro-thermal environment and combined with virtual crack closure technique to discuss the energy of opening mode at the crack tip of the interface between copper /polymide, thereby, evaluating the risk of interfacial delamination after post-mold curing processes and MSL test. evaluating the risk of interface delamination. Finally, the Taguchi experimental design method is employed to assess the impact of geometric design and material selection on the strain energy release rate at the crack tips.
1.The specimens' critical strain energy release rate is affected by temperature and humidity conditions: the maximum critical force decreases significantly.
2.The moisture diffusion simulation analysis results show that the FO-FCCSP does reach saturation after the MSL1 test.
3.From the ANOVA analysis results, it is known that the chip thickness is a significant factor affecting warpage, with a contribution rate of 85.7%, while in terms of G1, the PI thickness has a contribution rate of 75.8%, making it a significant factor affecting G1.
4.According to the Taguchi grey relational analysis results show that the design parameters are： EMC thickness of 130mm, chip thickness of 689mm, PI thickness of 10mm, RDL2 copper coverage rate of 69%, and G311-A-C as the EMC material, compared to the original design, both warpage and G1 can be reduced, with reductions of 45.7% and 60.2%, respectively.

中文摘要.....i
Abstract.....ii
誌謝.....iv
目錄.....v
表目錄.....vii
圖目錄.....viii
符號說明.....x
第一章 緒論.....1
1.1 前言.....1
1.2 文獻回顧.....2
1.2.1 雙材料界面強度量測實驗.....2
1.2.2 電子封裝脫層失效分析.....6
1.3 研究動機與目的.....9
1.4 研究流程.....9
第二章 扇出型封裝概論.....11
2.1 先進扇出型封裝與超越摩爾定律.....11
2.1.1 晶片優先扇出型封裝.....12
2.1.2 RDL優先扇出型封裝.....12
2.2 FO-FCCSP封裝製程概論.....13
第三章 模擬理論基礎與實驗.....19
3.1 濕氣擴散理論.....19
3.2 破壞力學理論.....20
3.3 虛擬裂紋閉合技術.....24
3.4 JEDEC測試標準.....25
3.5 田口實驗設計方法.....26
第四章 材料特性量測試驗.....27
4.1 吸濕擴散實驗.....27
4.2 界面強度量測.....28
4.2.1 實驗試片製作.....29
4.2.2 方法與步驟.....30
4.3 實驗結果與討論.....33
第五章 FO-FCCSP濕-熱耦合裂紋分析.....35
5.1 FO-FCCSP有限元素模型建立.....35
5.2 FO-FCCSP有限元素模型驗證.....38
5.3 FO-FCCSP封裝結構之吸濕擴散分析.....38
5.4 濕-熱耦合效應裂紋分析.....40
第六章 FO-FCCSP優化設計分析.....41
6.1 優化分析方法.....41
6.2 控制因子與參數設計.....42
6.3 FO-FCCSP優化結果與討論.....43
6.3.1 因子顯著性分析.....45
6.3.2 田口灰關聯分析.....46
第七章 結論與未來展望.....49
7.1 結論.....49
7.2 未來展望.....50
參考文獻.....51
Extended Abstract.....55

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