臺灣博碩士論文加值系統

網路通訊需求大量增加的現在，與過去截然不同，目前的需求與科技成長速度越來越快，不斷縮短電子類各項產品世代交替的時間，相對的，所需的零件規格也越來越嚴苛，當中，為通訊設備、車用電子、3C產品提供穩定輸出頻率與時脈控制的石英振盪器，便是微小，但又不可或缺的存在。石英是非等向性材料，因此頻率與溫度的關係，根據石英切割角度以及切割型式不同，所得到溫度隨時間改變時，頻率變化的曲線特性亦不同，再利用電壓控制、溫度補償、溫度控制等方法，降低外在溫度所造成的頻率偏移，讓產品能提供穩定的輸出頻率，其中，使用溫度控制的恆溫式石英晶體振盪器(Oven Controlled Crystal Oscillator, OCXO)為目前穩定性最高的一種。將溫度控制在頻率偏差較小的溫度點上，因此熱模型的設計相當重要，將會直接影響頻率穩定性、功率消耗程度、熱機時間長短以及是否可以微小化。

本文研究利用SolidWorks 2014以及AutoCAD建立主要模型，再匯入COMSOL Multiphysics 5.3a軟體中進行分析，由於主要研究模型熱傳遞以及各零件受熱之溫度變化，因此部分電子零件造成的影響忽略不計，模型尺寸與產品實際測試由實習公司所提供，切型為SC切、中心頻率為10.169 MHz的NK-Type OCXO。觀察流場型式對於恆溫式石英晶體振盪器造成的影響以及溫度感知器在不同位置時，反應石英晶體溫度的準確性，與實際產品溫箱測試後的資料作比對，驗證軟體，並從分析軟體中更改感知器設計。加熱的時間長短以及瓦數大小，會影響晶體恆溫時間、達工作溫度時間以及各零件承受熱的多寡。

Nowadays, the demand for network communication has increased significantly, which is very different from the past. The current demand and technology are growing faster and faster, and the time for the generation of various electronic products has been continuously shortened. Quartz oscillators that provide stable output frequency and clock control for communications equipment, automotive electronics, and 3C products are small but indispensable. Quartz is an anisotropic material, so the relationship between frequency and temperature is different according to the quartz cutting angle and cutting type. When the temperature obtained changes with time, the curve characteristics of the frequency change are also different. Use voltage control, temperature compensation, temperature control, and other methods To reduce the frequency offset caused by the external temperature, so that the product can provide a stable output frequency. Among them, the temperature-controlled constant temperature quartz crystal oscillator is one of the highest stability. The temperature is controlled at a temperature point where the frequency deviation is small, so the design of the thermal model is very important, which will directly affect the frequency stability, power consumption, the length of the heat engine, and whether it can be miniaturized.
This article studies the use of SolidWorks 2014 and AutoCAD to build the main model and then imports into COMSOL Multiphysics 5.3a software for analysis. Because the main research model heat transfer and the temperature change of each part are heated, so the impact of some electronic parts is ignored, the model size The actual test with the product is provided by Taitien Corporation, the NK-Type with SC cut and center frequency of 10.169 MHz. Observe the influence of the flow field type on the constant temperature quartz crystal oscillator and the accuracy of the quartz crystal temperature when the temperature sensor is in different positions. Compare with the actual product thermostat test data, verify the software, and by analysis software change the design of the temperature sensor. The heating time and the wattage will affect the constant temperature of the crystal, the time to reach the working temperature, and the amount of heat the parts will withstand.

摘要.............................i
Abstract........................ii
誌謝............................iv
目錄............................v
表目錄...........................vii
圖目錄...........................viii
符號說明...........................x
第一章 緒論...........................1
1.1 研究動機...........................1
1.2 文獻回顧...........................2
1.3 文章簡介...........................2
第二章 產品特性與有限元素模型...........................3
2.1切型不同之頻率溫度曲線...........................3
2.2改善溫度與頻率穩定性之方法...........................7
2.3有限元素熱模型邊界設定...........................8
2.4 OCXO基礎控溫方法...........................9
第三章 OCXO NK-Type有限元素分析...........................11
3.1模型設定...........................11
3.1.1模型與材料設定...........................11
3.1.2對流...........................13
3.1.3收斂分析...........................13
3.2對流型式不同之比較...........................15
3.3固定加熱時間更改瓦數之分析...........................19
3.3.1 10秒切換加熱功率...........................19
3.3.2 15秒切換加熱功率...........................21
3.3.3 20秒切換加熱功率...........................23
3.4固定加熱功率更改切換秒數之分析...........................25
3.4.1 加熱功率2.3 W...........................25
3.4.2 加熱功率3.1 W...........................27
3.4.3 加熱功率4.5 W...........................28
第四章 溫度感知器反應分析...........................29
4.1 感知器位置分析...........................29
4.1.1 固定感知器(TM1)溫度...........................30
4.1.2 固定感知器(TM2)溫度...........................31
4.2 NK-Type感知器實測數據...........................32
4.2.1 實測數據推算晶體溫度...........................32
4.2.2 未補償產品溫箱測試...........................35
4.3感知器更改設計之分析...........................36
4.3.1 原分析與實際溫測數據比對...........................36
4.3.2 溫度感知器(TM2)更改設計之分析...........................37
第五章 未來展望與結論...........................39
參考文獻...........................40
簡歷...........................43

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