探針卡是半導體晶圓製造與平板顯示器製造測試不可或缺的重要物件，近年來產品的製造逐漸的往輕、薄、短、小的四大方向邁進時，隨著顯示面板的顯示越來越細緻化，玻璃基板上輸入訊號的電路也越來越細緻間距越來越小，在面板產品的針測PAD設計主要為周圍方式排列的設計產品，傳統的彈簧式探針已無法符合需求，故而選用懸臂式探針模組與刀針式探針模組，但此兩類探針卡成本高昂且不易維修，故而使業界越來越多使用產品的COF為替代之探針。
本研究主要為開發出高壽命的薄膜可撓式探針模組，應用微機電技術於軟性銅箔基板導線上長出堅硬薄膜凸塊，提高薄膜探針的使用壽命及使用週期。因造成薄膜探針壽命短的主要原因為Contact磨損導致薄膜電路損壞，若於軟性銅箔基板的導線上長出堅硬薄膜凸塊，使電路不易因磨損而損壞應可延展使用壽命，如此將可有效減少更換維護的人力成本及產線停機的產能減損問題。
研究中使用微機電製程長出薄膜凸塊，在實驗中也運用乾膜光阻搭配雷射鑽孔技術，以取代開光罩進行曝光、顯影、蝕刻之製程方式，做法為在軟性銅箔基板導線上貼附乾膜光阻，使用雷射在乾膜光阻進行鑽孔加工完成圖案化，做出預計電鍍成長的模型，後開始進行微機電製程於軟性銅箔基板導線上電鑄銅、硬質銅、鎳之研究。在本研究中結合了微機電製程、雷射加工與微電鑄技術來製作出耐磨耗之薄膜可撓式探針模組。

Probe cards are integral to the manufacturing and testing processes of semiconductor wafers and flat panel displays. In recent years, the manufacturing of products is progressively advancing towards the four aspects of lightweight, thinness, shortness, and compactness; as the displays of display panels continue to refine, the circuitry for inputting signals on glass substrates have also grown increasingly refined with reduced intervals. In panel products, PAD probe pin testing is primarily designed to be arranged in a peripheral manner. Therefore, traditional spring-type probes are no longer able to meet demands, resulting in the use of cantilever-type probe modules and blade-type probe modules, which are both costly and difficult to maintain, thereby prompting the industry in general to increasingly adopt COF products as alternative probes.
In this study, we aimed to develop a high life-span flexible membrane probe module by applying microelectromechanical systems (MEMS) technology to develop solid membrane modules on flexible copper clad laminate (FCCL) to extend the service life and life cycle of membrane probes. As the primary cause of the shorter service life of membrane probes is the damage to membrane circuits caused by contact wear, extending the service life of the FCCL can be achieved through the development of solid membrane modules on FCCL to ensure the minimization of circuit damage due to wear and tear, which can effectively reduce the labor cost for replacement and maintenance, as well as the loss of capacity due to production line downtime.
This study was conducted by utilizing a MEMS process to develop membrane modules. During experiments, dry film photoresist with laser drilling technology was applied as an alternative to open reticle exposure, development, and etching process. After applying dry film photoresist on the FCCL, laser-drilling on the dry film photoresist to achieve patterning, and modeling the expected development of the electroplating, the MEMS application of electroformed copper, hard copper, and nickel on the FCCL was then implemented. This study has integrated MEMS, laser processing and micro-electroforming technology for the fabrication of wear-resistant flexible membrane probe modules.

中文摘要 II
Abstract III
圖目錄 VIII
表目錄 XI
第一章 緒論 1
1-1 前言 1
1-2 研究動機 2
第二章 基礎理論與文獻回顧 3
2-1探針卡簡介 3
2-1-1 懸臂式探針卡 4
2-1-2 刀片式探針卡 4
2-1-3 垂直式探針卡 5
2-1-4 薄膜式探針卡 5
2-1-5 微彈簧式探針卡 6
2-1-6 微機電式探針卡 6
2-2文獻回顧 7
第三章 實驗流程與儀器 24
3-1實驗流程圖 24
3-2 研究方法 25
3-2-1探針結構設計與模擬分析 25
3-2-2軟性探針導線製作 26
3-2-3雷射加工進行乾膜光阻圖案化 26
3-2-4電鍍製程長出BUMP 27
3-2-5測試及觀察電鍍結果 28
3-3使用軟體與儀器 28
3-3-1 Solidworks 3D設計軟體 28
3-3-2 ANSYS模擬分析軟體 29
3-3-3 CT1雷射鑽孔機 29
3-3-4 KEYENCE VHX-5000 數位顯微鏡 29
3-3-5 超音波震盪機 30
3-3-6 磁石攪拌機 31
3-3-7 電源供應器 31
3-3-8 烘烤用烤箱 31
3-3-9 KEYENCE VK-X200 形狀分析雷射顯微鏡 32
3-3-10 探針測試平台 32
第四章 實驗結果與討論 52
4-1探針模組結構分析 52
4-2軟性探針導線製作 53
4-3不同電鍍參數下之電鍍銅BUMP成長測試 53
4-4利用雷射對乾膜光阻進行鑽孔圖案化試驗 55
4-5雷射鑽孔對BUMP成長的測試 56
4-6 銅電鍍之量測及扎針測試 57
4-7 硬質銅電鍍之量測及扎針測試 58
4-8電鍍鎳與扎針測試 59
第五章 結論 81
參考文獻 83

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