為提高OLED元件壽命，使用有機材料將OLED進行封裝，其中PDMS(聚二甲基矽氧烷)因具有良好的疏水性、耐熱性、透光性等優點被選為封裝的材料。
將SYLGARD 184 A(主體溶液)與SYLGARD 184 B(固化劑)以重量5:1混合可調配出PDMS溶液，PDMS溶液使用刮塗技術在充滿氮氣的手套箱中刮塗OLED元件，調配的PDMS溶液具有熱固化性質，利用加熱平台可將元件上的有機薄膜快速固化形成保護膜。
實驗中發現以60℃的溫度加熱OLED元件可以在快速固化薄膜的同時避免元件因為熱損壞導致元件性能下降，藉由增加頂部加熱源能使PDMS薄膜更加完整固化，固化完成的有機薄膜封裝元件壽命和未封裝的元件相比可提升161倍。
使用PDMS和SiO2製作有機/無機材料堆疊的多層膜封裝，SiO2使用化學氣相沉積系統(PECVD)進行沉積，無機層可有效保護有機層不受外力影響，複合封裝完成的OLED可撓元件與單純以PDMS薄膜封裝的元件相比可提升9.5倍的壽命，而PDMS/玻璃蓋板封裝的元件壽命和單純以玻璃蓋板封裝的元件相比可提升11.8倍的壽命。

In order to improve the lifetime of OLED components, organic materials are used to encapsulate OLEDs, and PDMS (polydimethylsiloxane) is selected as the encapsulation material because of its good hydrophobicity, heat resistance, and light transmission.

Mix SYLGARD 184 A (main solution) and SYLGARD 184 B (curing agent) at a weight of 5:1 to prepare a PDMS solution. The PDMS solution is scraped coated with OLED elements in a nitrogen-filled glove box using scrape coating. The prepared PDMS solution With thermal curing properties, the organic film on the element can be quickly cured to form a protective film by using a heating platform.

In the experiment, it was found that heating the OLED element at a temperature of 60°C can quickly cure the film while avoiding the degradation of the element's performance due to thermal damage. By adding the top heating source, the PDMS film can be cured more completely, and the life of the cured organic film packaged element Compared with unpackaged components, it can be improved by 161 times.

Use PDMS and SiO2 to make organic/inorganic material stacked multilayer film packaging. SiO2 is deposited using a chemical vapor deposition system (PECVD). The inorganic layer can effectively protect the organic layer from external forces. Compared with components encapsulated with PDMS film, the lifetime can be increased by 9.5 times, while the lifetime of components encapsulated with PDMS/glass cover can be increased by 11.8 times compared with components encapsulated only with glass cover.

摘要……………………………………………………………………………………i
Abstract………………………………………………………………………ii
誌謝………………………………………………………………………………iii
目錄…………………………………………………………………………………iv
表目錄……………………………………………………………………………vi
圖目錄…………………………………………………………………………vii
第一章、緒論…………………………………………………………………1
1.1有機發光二極體簡介…………………………………………1
1.2研究動機…………………………………………………………………2
1.3文獻探討…………………………………………………………………3
第二章、有機發光二極體原理………………………………5
2.1有機發光二極體原理…………………………………………5
2.1.1有機發光二極體發光機制……………………………5
2.1.2電流注入理論……………………………………………………7
2.1.3有機發光二極體各層結構介紹…………………8
2.2 熱活化延遲螢光材料………………………………………10
第三章、實驗方法與步驟………………………………………11
3.1實驗流程…………………………………………………………………11
3.2有機薄膜封裝材料備製……………………………………12
3.2.1有機薄膜封裝材料應用………………………………12
3.2.2有機封裝材料調配…………………………………………13
3.2.3有機封裝材料脫氣處理………………………………15
3.3基板備製…………………………………………………………………16
3.3.1基板規格定義…………………………………………………16
3.3.2基板清洗……………………………………………………………17
3.4手套箱系統與傳送………………………………………………19
3.5元件刮塗封裝…………………………………………………………21
3.6封裝薄膜熱固化製程…………………………………………22
3.7有機薄膜材料與蓋板材料複合封裝製程……23
3.8無機薄膜/有機薄膜複合封裝製程………………24
3.9特性量測…………………………………………………………………25
3.9.1薄膜厚度量測:………………………………………………25
3.9.2薄膜水氧穿透率量測……………………………………26
3.9.3封裝元件特性量測…………………………………………27
3.9.4封裝元件壽命量測…………………………………………29
第四章、結果與討論…………………………………………………30
4.1有機薄膜封裝製程…………………………………………………30
4.1.1溫度對封裝材料與元件之影響……………………30
4.1.2熱固化時間對有機薄膜之影響……………………33
4.1.3改善加熱源對元件壽命之影響……………………38
4.2複合式封裝對OLED元件之影響…………………………41
4.2.1有機薄膜/無機薄膜複合封裝………………………41
4.2.2有機薄膜/玻璃蓋板複合封裝………………………46
第五章、結論……………………………………………………………………50
參考文獻………………………………………………………………………………51
Extended Abstract……………………………………………………53

[1] Zhongbin Wu, and Dongge Ma,“Recent advances in white organic light-emitting diodes”, Materials Science and Engineering: R: Reports, vol. 107, pp. 1-42, 2016.
[2] S. Feng-Bo et al., “Fabrication of tunable [Al2O3:Alucone] thin-film encapsulations for top-emitting organic light-emitting diodes with high performance optical and barrier properties,” Organic Electronics, vol. 15, no. 10, pp. 2546–2552, 2014.
[3] A. R. Cho, E. H. Kim, S. Y. Park, and L. S. Park, “Flexible OLED encapsulated with gas barrier film and adhesive gasket,” Synthetic Metals, vol. 193, pp. 77–80, 2014.
[4] S. Majee et al., “Flexible organic–inorganic hybrid layer encapsulation for organic opto-electronic devices,” Progress in Organic Coatings, vol. 80, pp. 27–32, 2015.
[5] E. G. Jeong, Y. C. Han, H.-G. Im, B.-S. Bae, and K. C. Choi, “Highly reliable hybrid nano-stratified moisture barrier for encapsulating flexible OLEDs,” Organic Electronics, vol. 33, pp. 150–155, 2016.
[6] Y. Duan et al., “High-performance barrier using a dual-layer inorganic/organic hybrid thin-film encapsulation for organic light-emitting diodes,” Organic Electronics, vol. 15, no. 9, pp. 1936–1941, 2014.
[7] S. Park, W. M. Yun, L. H. Kim, S. Park, S. H. Kim, and C. E. Park, “Inorganic/organic multilayer passivation incorporating alternating stacks of organic/inorganic multilayers for long-term air-stable organic light-emitting diodes,” Organic Electronics, vol. 14, no. 12, pp. 3385–3391, 2013.
[8] L. Prager et al., “Photochemical approach to high-barrier films for the encapsulation of flexible laminary electronic devices,” Thin Solid Films, vol. 570, pp. 87–95, 2014.
[9] L. Sun et al., “Solution processing of alternating PDMS/SiOx multilayer for encapsulation of organic light emitting diodes,” Organic Electronics, vol. 64, pp. 176–180, 2019.
[10] N.T. Kalyani, S. J. Dhoble, Renew. Sustain. Energy Rev. 16, pp.2696-2723, 2012.
[11] A. Jablonski “Über den Mechanismus der Photolumineszenz von Farbstoffphosphoren.” Z. Phys., 94, pp. 38-44, 1935.
[12] 黃孝文、陳金鑫 “有機電激發光材料與元件”，五南圖書出版社，pp. 34-36, 2005。
[13] H. Fujimoto, T. Nakamura, K. Nagayoshi, K. Harada, H. Miyazaki, T. Kurata, J. Kiyota, C. Adachi, “Killer impurities in vacuum chamber that affect the lifetime of organic light-emitting diodes”, Applied Physics Letters, vol. 116, p. 33401, 2020.
[14] Z. L Yang, C. Cheng, X. D. Pan, F. Pan, F. Wang, M. Y. Tian, “Effects of hole injection layer on performance of green OLEDs based on flexible ITO”, Materials Chemistry and Physics, vol. 239, Article 121828 pp.1-7, 2020
[15] Y. L. Wu, C. Y. Chen, Y. H. Huang, Y. J. Lu, C. H. Chou, C. C. Wu, “Highly efficient tandem organic light-emitting devices utilizing the connecting structure based on n-doped electron-transport layer/HATCN/hole-transport layer”, Appl Opt., vol. 53, pp. E1-6, 2014