臺灣博碩士論文加值系統

絕緣金屬基板(IMS)廣泛運用於車用高功率散熱模組相關領域，集成電路體積日益縮減與眾多集成芯片聚集下，結構強度與散熱管理成為重視議題，業界便致力於研發高導熱膠片(TCP)，針對基板接合強度、導熱性及絕緣性優化改善。
本論文研究將針對多種不同高導熱膠片(TCP)與C1100板材熱壓成型後，進行平面接合強度、熱傳導、崩潰電壓性能探討，利用棕化微蝕系統(Brown oxidation) 進行C1100表面處理並設定參數範圍，探討不同參數對應的SEM觀測、粗糙度、蝕刻量與接著性結果找尋最佳參數，以此參數進行不同高導熱膠片(TCP)與C1100板材熱壓後的平面接合強度比較，並選用最佳高導熱膠片(TCP)進行不同厚度與層數疊層下的平面接合強度、熱傳導及崩潰電壓試驗進行趨勢分析，最後針對此高導熱膠片(TCP)熱壓參數優化並進行各樣試驗成果比較。
從實驗結果得知，C1100表面粗糙度及蝕刻量皆與棕化時間、棕化槽桶內溫度及H2O2濃度成正比，而表面粗糙度及棕化皮膜生成厚度不同之下，對於高導熱膠片(TCP)與C1100板材熱壓後的接著性存在著最佳區間，且在不同厚度熱壓的接著性來說，70μm(單層)皆比100μm(單層)及140μm(雙層)更有效含浸於表面微蝕後形成的孔洞，平面接合強度表現最佳、崩潰電壓性能也最為理想，熱傳導值則差異不大，而調整高導熱膠片(TCP)半固化狀態(B Stage) 持溫持壓時間進行含浸效果優化下，各項性能皆有所提升，尤其在厚度100μm(單層)及140μm (雙層)優化成長率最高，各項試驗成果部分，平面接合強度比較下，厚度70μm (單層)依然最佳；熱傳導性則隨著兩種優化參數下，厚度100μm(單層)及140μm (雙層)有不同成高長率趨勢；崩潰電壓性能在厚度140μm(雙層)成長率最為顯著，由本論文研究實驗得知，高導熱膠片(TCP)與C1100熱壓成型過程中，除了藉由控制膠片層數及厚度，進行接著性優化也能大幅提升平面接合強度、熱傳導、崩潰電壓性能，而本論文研究最終以穩定性與性能最佳化熱壓參數進行整合型產品製作。

Insulated metal substrates (IMS) are widely used in high-power heat dissipation modules for vehicles. With the shrinking of integrated circuits and the accumulation of many integrated chips, structural strength and heat dissipation management have become important issues. The industry is committed to the development of high thermal conductivity prepreg (TCP), optimized for substrate bonding strength, thermal conductivity and insulation.
In this study, various TCP films were bonded with C1100 copper sheets using hot-pressing process, and the tensile strength, heat conduction and breakdown voltage were measured. The surfaces of the copper sheet were treated by a brown oxidation process. The effect caused by the brown oxidation processes with different operating parameters on the roughness and etching amount of the copper sheet were investigated using SEM. Then, the optimal parameters used in the brown oxidation process was found to achieved to best adhesive property between TCP and cooper sheets. These parameters were used to compare the tensile strength of different thickness and type of TCP films, and find the optimum thickness and the best type of the TCP film. Finally, the hot-pressure parameter of the this TCP films were optimized and various test were compared.
According to the experimental result, the surface roughness and etching amount of the copper sheets are proportional to the time and temperature of brown oxidation process, and the H2O2 concentration. There is an optimal range for the adhesion property of the TCP and copper sheet due to difference of the surface roughness and the thickness of the browning film. The thickness of TCP film of 70μm (single layer) is more effective than 100μm (single layer) and 140μm (double layer) impregnated on the microstructure and holes of the surface after surface formed after etching. Besides, the used of the TCP film with 70μm in thickness has the optimal tensile strength, breakdown voltage, and with the difference of thermal conductivity value. Adjusting the semi-cured stage (B stage) of the TCP films, all performances have been improved, especially in the thickness of 100μm and 140μm. The value of breakdown voltage is increased significantly at the thickness of 140μm.

內容
口試審定書 i
口試協議書 ii
摘要 i
Abstract iii
致謝 v
目錄 vi
圖目錄 xi
第 1 章 緒論 1
1.1 研究動機與目的 1
1.2 文獻回顧 2
第 2 章 理論介紹 3
2.1 印刷電路板種類 3
2.1.1 印刷電路板(PCB) 3
2.1.2 直接鍵合銅基板(DBC) 5
2.1.3 絕緣金屬基板(IMS) 5
2.2 基板結構種類 6
2.2.1 單面板 (Single-Layer PCB) 6
2.2.2 雙面板 (Double-Layer PCB) 6
2.2.3 多層板 (Multi-Layer PCB) 7
2.3 高導熱高導熱膠片 8
2.4 金屬PCB板表面處理方法 9
2.4.1 噴砂 (Sandblast) 9
2.4.2 蝕刻 (Etching) 9
2.4.3 棕化 (Brown Oxidation) 10
第 3 章 實驗材料與設備 11
3.1 實驗金屬材料 11
3.1.1 C1100 紅銅相關材料 11
3.1.2 6061 鋁合金相關材料 13
3.2 TCP (Thermal Conductive Prepreg) 16
3.2.1 聚鼎科技 TCPC-10 16
3.2.2 TOYOCHEM LIOELM TSUTM 500 series 17
3.2.3 CREATIVE MATERIALS TCP 18
3.2.4 ADEKA BUR - 6201 19
3.3 實驗相關耗材 20
3.3.1 D.I. Water 20
3.3.2 Atotech 棕化表面處理液 20
3.3.3 Macdermid 棕化表面處理液 21
3.3.4 H2SO4 21
3.3.5 H2O2 22
3.3.6 HI-Clean 102 工業用脫脂劑 22
3.3.7 鋁蝕刻劑 SE113-A 23
3.3.8 剝膜液 NS-17A 23
3.3.9 3M DP-420 off white 環氧樹脂結構膠 24
3.3.10 3M 單液型環氧樹脂結構膠 2214 25
3.4 實驗設備 26
3.4.1 ELGA Micra 純水系統 26
3.4.2 數字型均溫加熱板 27
3.4.3 電子天秤 27
3.4.4 可程式熱風循環箱 28
3.4.5 表面粗度測定儀 29
3.4.6 掃描式電子顯微鏡 (Scanning Electron Microscope) 30
3.4.7 光學顯微鏡 (Optical Microscope) 31
3.4.8 CNC 銑床 32
3.4.9 高精密伺服馬達控制型熱壓機 33
3.4.10 自動砂輪切割機 34
3.4.11 研磨拋光機 35
3.4.12 拉伸試驗機 36
3.4.13 拉伸測試治具 37
3.4.14 熱導值測試設備 38
3.4.15 崩潰電壓測試設備 39
第 4 章 實驗程序與方法 40
4.1 實驗流程 40
4.2 C1100 入料品管 42
4.2.1 C1100 板材 42
4.2.2 C1100 Loading Block 42
4.3 C1100 表面前處理及量測 43
4.3.1 棕化處理 (Brown oxidation) 參數設定 43
4.3.2 棕化處理 (Brown oxidation) 流程與方法 45
4.3.3 蝕刻量測量 48
4.3.4 表面粗糙度測量 49
4.4 TCP熱壓貼合 51
4.4.1 聚鼎科技股份有限公司 TCPC-10 52
4.4.2 TOYOCHEM LIOELM TSUTM 500 series 52
4.4.3 CREATIVE MATERIALS TCP 53
4.4.4 ADEKA BUR – 6201 53
4.5 聚鼎科技 TCPC-10 厚度控制 54
4.6 實驗測試片製作 55
4.6.1 Loading Block 接合強度試塊製作 55
4.6.2 熱傳導 (Thermal Conductivity) 試片製作 57
4.6.3 崩潰電壓 (Breakdown Voltage) 試片製作 59
4.7 實驗試驗方法 60
4.7.1 Loading Block 接合強度測試步驟 60
4.7.2 熱傳導 (Thermal Conductivity) 測試步驟 62
4.7.3 崩潰電壓 (Breakdown Voltage) 測試步驟 64
4.8 聚鼎科技 TCPC-10 熱壓參數優化 65
4.9 整合型產品製作 66
4.9.1 整合型產品熱壓模具製作 66
4.9.2 整合型產品熱壓成型方法 67
第 5 章 實驗結果討論 70
5.1 棕化處理 71
5.1.1 ATOTECH 71
5.1.2 MACDERMID 78
5.1.3 ATOTECH SEM微結構觀察 85
5.2 C1100 – 不同TCP強度比較 93
5.3 C1100-TCPC-10疊層接合強度 94
5.3.1 Raw Data 94
5.3.2 Optimum Data_5 min 98
5.3.3 Optimum Data_20 min 102
5.4 C1100-TCPC-10疊層熱傳導 (Thermal Conductivity) 106
5.4.1 Raw Data 107
5.4.2 Optimum Data_5 min 107
5.4.3 Optimum Data_20 min 107
5.5 C1100-TCPC-10疊層崩潰電壓 (Breakdown Voltage) 108
5.5.1 Raw Data 109
5.5.2 Optimum Data_5 min 109
5.5.3 Optimum Data_20 min 109
5.6 延伸結果討論 110
5.6.1 C1100-各廠TCP疊層熱傳導 (Thermal Conductivity) 110
5.6.2 C1100-各廠TCP疊層崩潰電壓 (Breakdown Voltage) 111
5.6.3 6061表面酸性蝕刻與TCPC-10 接合強度試驗 112
5.6.4 6061表面陽極氧化與TCPC-10 接合強度試驗 114
第 6 章 結論 117
第 7 章 參考文獻 119

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