臺灣博碩士論文加值系統

目的：本研究結合影像辨識、光纖雷射、遠心鏡頭與線性馬達定位平台建構虛擬同軸來達到影像定位溢膠後可直接傳遞位置至光纖雷射系統進行除膠流程。並藉由二代自動雷射除膠機(ADMFM II)與第三代自動雷射除膠實驗機(ADMFM III)的差異進行研究，取得優化虛擬同軸的關鍵因素，藉以改善半導體封裝製程良率。
材料與方法：本研究實驗設備採用ADMFM II (宜樺科技有限公司，中華民國)與ADMFM III，QFN 4B 10 • 10為實驗材料。設備組件選用流程如下：一、進行目標尺寸範圍選定。二、影像取得選用1200萬畫素電荷耦合元件 (CCD)搭配遠心鏡頭(0.09X)與外同軸光源(100 •100 mm)。三、雷射採用光纖雷射(20W)搭配德製振鏡與聚焦鏡頭(ADMFM II：Fθ鏡頭；ADMFM III：遠心鏡頭)進行除膠。四、運動控制採用NI-7390運動控制卡搭配十字線性馬達定位平台。五、軟體之主流程控制為 NI LabVIEWTM (version 2013; National Instruments Corporation, TX, USA) ，影像處理為NI VisionTM (version 2013; National Instruments Corporation, TX, USA)與NI IMAQTM (version 2013; National Instruments Corporation, TX, USA)，雷射控制軟體為MarkingMate及其 OCX函式庫(版本2.7a；興誠科技股份有限公司，中華民國)。
虛擬同軸建構方法如下：一、採用傳統手法各自校正影像、雷射系統與線馬平台。二、借助線馬平台的高再現性(0.001mm)將影像、雷射建構虛擬同軸。三、雷射進行33•33定位點雷雕。四、影像分析各點偏移量並轉換座標系統與單位。五、回饋偏移量至雷射系統。六、重複步驟三至步驟五確認校正結果，直到最大偏移量達到0.01mm以下。
實驗方法：設備校正完成，進行實驗取得ADMFM II與ADMFM III 各600筆偏移量原始數據，並進行資料統計分析。

結果：根據實驗結果本研究所採用的的虛擬同軸可降低雷射除膠之偏移量50%，
角落最大平均偏移量由II_Cn.μ_24=0.0468 mm降至III_Cn.μ_3=0.0227 mm，中心最大平均偏移量由II_Ct.μ_25=0.0437 mm降至III_Ct.μ_5=0.0235 mm。
結論：本研究的結果表明，採用影像遠心鏡頭可有效降低對於邊緣影像扭曲的影響，而雷射遠心鏡頭亦可針對在對邊緣除膠降低Z軸變化導致的XY平面位移的偏移量。而本研究的虛擬同軸整合影像、雷射與線馬平台系統，對系統自動校正速度亦有明顯助益。

Purpose: This study adopted the techniques: image recognition, fiber optic laser, telecentric lens and linear motor positioning platform to construct virtual coaxial, which could directly transfer position of overflow glue, detected by image positioning, to fiber optic laser system for de-glue process. In addition, the study also compared the ADMFM II and ADMFM III, the second and third generation of automatic de-mold flash machine, to identify the critical factors of optimizing virtual coaxial and improve the yield rate of the semiconductor encapsulation process.
Materials and methods: ADMFM II(I-Hwa Technology .Ltd., , ROC) and ADMFM III, were the experimental equipment, while the experimental material was QFN 4B 10•10. There were five steps of selecting equipment components: 1. Assure the size of the target; 2. Use 12 million pixel CCD along with telecentric lens(0.09X) plus external coaxial light source(100•100 mm); 3. Assemble 20W fiber laser with German galvanometer and Focusing lens (ADMFM II: Fθ lens; ADMFM III: telecentric lens) for glue removal; 4. Adopt NI-7390 motion control card (National Instruments Corporation, TX, USA) with cross linear motor positioning platform for motion control; 5.Implement NI LabVIEW TM (version 2013; National Instruments Corporation, TX, USA) as the software for main process control, while NI VisionTM (version 2013; National Instruments Corporation, TX, USA) and NI IMAQTM (version 2013; National Instruments Corporation, TX, USA) are used for image processing, and MarkingMate(version 2.7a; EASTERN LOGIC INC., , ROC) and its OCX are the laser control software.
The following steps explains how the virtual coaxial was constructed. At first, the traditional calibration was respectively scheduled for the image, the laser system and the linear motor platform, followed by creating the preliminary coaxial with image and the laser based on the high reproducibility of the linear motor platform (0.001 mm). The third step performed 33 • 33 positioning points laser engraving, while the next step conducted image analysis of the offset for each point and converted the coordinate system and unit. The fifth step was providing feedback of the offset to the laser system. At last, repeated step 3 to step 5 to confirm the correction until the maximum offset reached 0.01 mm or less.
Experiment method: while the equipment was calibrated, retrieved 600 entries of offset respectively from ADMFM II and ADMFM III, and analyzed the data.
Results: The experimental findings indicated that the virtual coaxial used in this study could reduce up to 50% offset of laser glue removal. The maximum of average deviation of the periphery decreased from II_Cn.μ_24=0.0468 mm to III_Cn.μ_3=0.0227 mm, while the maximum of average deviation of the center decreased from II_Ct.μ_25=0.0437 mm to III_Ct.μ_5=0.0235 mm.
Conclusions: According to the study findings, it showed that using image telecentric lens could effectively reduce the impact on edging image distortion; In addition, laser telecentric lens could also reduce the offset of the XY planar displacement caused by the change of the Z axis when removing the glue on the edge. Furthermore, the study proved that virtual coaxial which integrated the techniques: image recognition, fiber optic laser, and linear motor platform system could benefit the automatic calibrating rate.

目錄
摘要 i
Abstract iii
致謝 vi
目錄 vii
表目錄 x
圖目錄 xi
符號縮寫 xiii
符號說明 xiv
第一章 緒論 1
1.1 動機 1
1.2 目的 3
1.3 相關文獻探討 5
1.3.1 封裝溢膠的除膠方法 5
1.3.2 實體同軸與虛擬同軸 6
1.3.3 虛擬同軸於QFN封裝除膠之應用 8
1.3.4 實體同軸之應用 9
1.3.5 封裝製程溢膠 10
1.3.6 其他相關文獻 10
第二章 材料與方法 12
2.1 前言 12
2.2 設備校正 15
2.3 原始樣本 16
2.4 影像系統組成 17
2.4.1 QFN IC影像定位 18
2.4.2 QFN IC 腳位影像定位 22
2.4.3 QFN IC溢膠判定 26
2.5 光纖雷射除膠 28
2.5.1 雷射設定與運作方式 29
2.5.2 雷射除膠流程 31
2.6 遠心鏡頭 32
2.7 線性馬達定位平台 33
2.8 線外尺寸量測設備 34
2.9 雷射除膠偏移量測 35
2.10 虛擬同軸之影像坐標系轉換 36
2.11 虛擬同軸之影像與雷射坐標系位移計算 37
第三章 結果 38
3.1 前言 38
3.2 ADMFM II結果分析 40
3.3 ADMFM III結果分析 42
3.4 ADMFM II與ADMFM III綜合分析 43
3.5 ADMFM II與ADMFM III偏移量獨立t檢定 46
3.6 ADMFM II與ADMFM III效益分析 47
第四章 討論 48
4.1 前言 48
4.2 研發過程-確認目標的重要性 48
4.3 研發過程-準確性、速度與穩定性的平衡 49
4.4 研發過程-找出問題是克服問題的關鍵 51
4.5 研發過程-搜尋可能的選項並加以驗證 52
4.6 研發過程-校正流程自動化 53
4.7 ADMFM II與ADMFM III中心平均偏移值比較 54
4.8 ADMFM II與ADMFM III角落平均偏移值比較 55
4.9 ADMFM II與ADMFM III中心標準差比較 56
4.10 ADMFM II與ADMFM III角落標準差比較 57
4.11 虛擬同軸與實體同軸比較 58
4.12 雷射遠心鏡頭與雷射Fθ鏡頭比較 59
4.13 系統分析與規劃 59
第五章 結論 60
5.1 前言 60
5.2 未來展望-虛擬同軸應用-QFN 62
5.3 未來展望-虛擬同軸應用-LQFP 63
5.4 未來展望-虛擬同軸應用-BGA 64
5.5 未來展望-虛擬同軸應用-微型電阻量測 65
參考文獻 66
附錄一：原始數據-ADMFM II 71
附錄二：原始數據-ADMFM III 72
附錄三：單片曲線圖-ADMFM II VS ADMFM III 73
附錄四：原始圖檔-ADMFM II 81
附錄五：原始圖檔-ADMFM III 96
Publications List Since 2019 111
專利：虛擬同軸系統 113

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