臺灣博碩士論文加值系統

Ni-Cu具有優良的強度及特性，廣泛用於混合開關、智能系統、巨磁阻傳感器(GMR)、電子產業及建材的表面塗層等。在製程中容易產生孔隙缺陷和不均勻性，因此本文主要採用準連續法探討異質界面Ni-Cu在負載下的強度及裂紋擴展的斷裂特性。在單軸拉伸載荷條件下，分析Ni-Cu在不同晶體取向與不同裂紋深度下的裂縫成長，並計算其應力集中因子。模擬結果顯示在雙邊拉伸條件下，Cu內部比Ni較易生長內部變形，因此Cu基板的頸縮現象較為嚴重。在裂紋較深的情況下，材料的極限強度明顯下降，但應力集中因子增加。原子排列在不同取向下因內部變形的影響，裂紋生長過程有顯著的差異性；在相同原子取向的情況，Ni-Cu與Cu相比下極限強度有提升的情況。在方向較為緊密堆積排列上，裂紋尖端易產生變形，且內部變形較為嚴重。

The Ni-Cu has excellent strength and properties and is widely used in hybrid switches, intelligent systems, giant magnetoresistance sensors (GMR), electronics industry and surface coatings in the building materials, but it is prone to void defects and inhomogeneity in the process. Therefore, this paper mainly uses the quasi-continuum method based on the embedded atomic method (EAM) potential to discuss the strength of the heterogeneous interface Ni-Cu under load and the fracture characteristics of crack propagation. The crack growth of Ni-Cu in different crystal orientations, different crack depths and the influence of stress concentration factors were discussed under the uniaxial tensile load conditions. The simulation results showed that the interior of Cu is more likely grow internal deformation than Ni, therefore, the necking phenomenon of the Cu substrate is more serious. And the crack length of Ni-Cu is deep, the yield strength apparently decreased and the stress intensity factor increased. However, at different crystal orientations, the crack growth produced apparently differences due to internal crystal deformation. In the same crystal orientation, Ni-Cu had greater compression strength. In the close-packed crystal structure, the crack growth is extremely small, but the internal crystal deformation and dislocation are greatly affected.

摘要 ii
Abstract iii
誌謝 iv
符號表 v
目錄 vii
表目錄 ix
圖目錄 x
第1章 緒論 1
1.1前言 1
1.2研究動機與目的 2
1.3本文架構 4
第2章 文獻回顧 5
2.1準連續法文獻回顧 5
2.2界面材料文獻回顧 7
2.3裂紋斷裂特性文獻回顧 8
第3章 模擬方法 12
3.1準連續方法基本理論 12
3.2局部區域建立與計算 16
3.3非局部區域能量計算 17
3.4局部與非局部區的耦合 19
3.5局部與非局部區域的判別 19
3.6網格自適應方法 20
3.7模擬之物理模型 21
第4章 異質界面材料之拉伸特性 24
4.1不同異質界面材料的強度分析 24
4.2不同異質界面材料的裂紋成長分析 28
4.3不同異質界面材料強度及斷裂特性結論 32
第5章 Ni-Cu界面材料之拉伸特性 34
5.1 Ni-Cu在不同單位步階的影響 34
5.2 Ni-Cu在不同邊緣裂紋下斷裂特性分析 36
5.3 Ni-Cu在不同晶體取向下裂紋成長分析 44
5.4 Ni-Cu在不同中心裂紋下斷裂特性分析 53
5.5 Ni-Cu在循環負載下裂紋界面分析 62
5.6 Ni-Cu之裂紋成長及斷裂特性結論 71
第6章 結論與未來展望 74
6.1結論 74
6.2未來展望 75
參考文獻 76
個人簡歷 84

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