臺灣博碩士論文加值系統

摘 要 i
ABSTRACT ii
誌 謝 iv
目 錄 vi
表目錄 x
圖目錄 xi
第一章 緒論 1
1.1研究動機 1
1.2研究目的 1
1.3 論文架構 2
第二章 文獻回顧 3
第三章 焊接程序及設備與焊接缺陷檢驗 6
3.1 焊接程序 11
3.1.1進料檢驗 11
3.1.2火焰切割及鋼板銑邊開槽作業 11
3.1.3捲板製程 12
3.1.4縱向十字臂焊機內外焊 13
3.1.5縱線開槽(背鏟)機 14
3.1.6回圓製程 16
3.1.7剪力鍵焊接 16
3.1.8非破壞檢驗 18
3.1.9環狀組立成長與內部焊接 20
3.1.10環狀線背鏟作業與外部焊接 22
3.1.11 C-seam NDT環狀焊道非破壞檢驗 24
3.2 焊接線檢驗種類 25
3.2.1 VT目視檢驗 25
3.2.2 MT磁粉檢驗 25
3.2.3 UT超音波檢驗 25
3.2.4尺寸量測 26
3.2.5塗裝與標線 27
第四章 焊接缺陷成因分析 29
4.1 缺陷成因 29
4.1.1溫度控制 29
4.1.2焊芯矯直缺點 29
4.1.3接地設備設計缺陷 29
4.1.4開槽位置偏差 30
4.1.5焊接參數區間差異 31
4.1.6焊道狀態誤判及清除不徹底 31
4.1.7焊接交界層 31
4.1.8雷射追蹤設備不穩定 32
4.1.9單極雙極切換 32
4.2 改善與實際測量 33
4.2.1溫度控制探討 33
4.2.2焊芯繳直器整併送線系統探討 34
4.2.3接地設備與製程變更 40
4.2.4鋼板開槽參數調整及加工方式優化 41
4.2.5焊接參數鎖定及單雙極切換點 42
4.2.6焊道缺陷及交界層因應 42
4.2.7雷射追蹤系統改進 42
第五章 焊接參數分析 44
5.1 內焊參數分析 44
5.1.1電流比對 44
5.1.2電壓對比 46
5.1.3電流電壓對比 48
5.1.4焊接速度對比 50
5.1.5入熱量趨勢比對 52
5.2 外焊參數分析 53
5.2.1電流比對 53
5.2.2電壓比對 55
5.2.3電流電壓對比 57
5.2.4焊接速度比對 59
5.2.5入熱量趨勢比對 61
第六章 結論與未來展望 63
6.1結論 63
6.2未來展望 64
參考文獻 65
附錄一 目視檢測報告 67
附錄二 目視檢測報告 68
附錄三 磁粉探傷檢測報告 69
附錄四 磁粉探傷檢測報告 70
附錄五 超音波檢測報告 71
附錄六 超音波檢測報告 72

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