臺灣博碩士論文加值系統

現況積層陶瓷電容器 (Multi-Layer Ceramic Capacitor, MLCC) 具有低廉價格及環境穩定性高優勢。但陶瓷材料的主結構容易受外在彎曲應力的影響導致破裂失效。
現今業界所發展出的軟端式積層陶瓷電容雖可藉由端電極中軟性高分子降低彎曲及震動應力的破壞，然而軟端式積層陶瓷電容大多是由銀金屬與高分子所組成導致其成本高昂，因此本論文將嘗試導入石墨烯材料於軟端式積層陶瓷電容並探討其對性能及價格的影響。
試驗結果顯示基本電性項目裡石墨烯軟端產品的電容值、散逸因子、絕緣電阻與破壞電壓數值皆與傳統式銅端頭/銀軟端產品無差異；在端電極的測試項目裡石墨烯軟端產品抗彎曲可靠度、耐溫度性、耐濕度性與黏合性皆與傳統式的銅端頭/銀軟端產品無差異；最後，石墨烯軟端的材料成本相較於銀軟端產品降低了80% 。

The current multilayer ceramic capacitor (MLCC) has the advantages of low price and high environmental stability. However, the main structure of ceramic materials is easily affected by external bending stress, resulting in crack failure.
Although the soft-terminal MLCC developed in the industry can effectively reduce the damage of bending and vibration stress through the soft polymer in the terminal electrode, most of the soft-terminal MLCC are composed of silver metal and polymer. The cost is high, so this paper will try to import graphene materials into soft-ended MLCC and discuss their impact on performance and price.
The test results show that basic electrical items, the capacitance value, dissipation factor, insulation resistance and breakdown voltage of the graphene soft terminal products are the same as those of the traditional copper terminal/silver soft terminal products; in the terminal electrode test items, the bending reliability, temperature resistance, humidity resistance and adhesion of the graphene soft terminal products are no different from the traditional copper terminal/silver soft terminal products; finally, the material cost of graphene soft end is 80% lower than that of silver soft end products.

摘要 iv
Abstract v
致謝 vi
目錄 vi
表目錄 xi
圖目錄 xii
符號說明 xvi
第一章 前言 1
1-1 研究動機與目的 1
1-2 研究內容 5
第二章 文獻回顧 6
2-1積層陶瓷電容器 6
2-2積層陶瓷電容器特性分類 8
2-2-1積層陶瓷電容器電容值規格 9
2-2-2積層陶瓷電性形成介紹 10
2-2-3石墨烯介紹 11
2-3 MLCC 製程介紹 13
2-3-1積層陶瓷電容製造流程 13
2-3-2粉體研磨 (Ball Milling) 14
2-3-3刮刀成型 (Foil Coating) 15
2-3-5薄帶印刷 (Screen Printing) 16
2-3-6薄帶堆疊 (Foil Stacking) 17
2-3-7均壓 (Lamination) 18
2-3-8生胚切割 (Cutting) 19
2-3-9黏結劑燒除 (Binder Burn Out) 20
2-3-10燒結 (Sintering) 21
2-3-11滾磨 (Tumbling) 22
2-3-12端電極沾附與燒附 (Termination Dipping & Curing) 23
2-3-13電鍍 (Plating) 24
2-3-14電性測試 (Sorting & Testing) 25
2-4 文獻回顧 26
2-4-1軟端BME與PME材料系統對於彎曲應力可靠度驗證 26
2-4-2不同端頭材料系統對於彎曲應力可靠度驗證 28
2-4-3 MLCC焊接於 PCB板上之應力分析 30
2-4-4不同端電極材料之大尺寸產品彎曲試驗 32
2-4-5軟性端電極產品對於焊接角度彎曲試驗 34
2-4-6 MLCC彎曲測試探討 37
2-4-7 MLCC彎曲測試失效原因探討 38
2-4-8金屬與高分子混合物物性探討 40
2-4-9石墨烯與高分子混合物物性探討 41
2-4-10文獻回顧整理與實驗計畫 42
第三章 實驗方法與流程 43
3-1實驗材料與樣品說明 43
3-1-1 實驗材料 43
3-1-2實驗說明 44
3-2實驗樣品製作流程 46
3-3實驗流程 48
3-4檢查儀器與方法 49
3-4-1電容值量測儀 (Capacitance) 49
3-4-2絕緣電阻量測儀(Resistance) 49
3-4-3破壞電壓量測儀(Break down voltage) 50
3-4-4掃描式電子顯微鏡 (Scanning electron microscope) 50
3-4-5溫度循環測試儀(Temperature cycle) 51
3-4-6濕熱測試儀(Damp heat) 51
3-4-7黏合性測試儀 (Adhesion) 52
3-4-8彎曲測試機(Bending) 52
第四章 結果與討論 53
4-1不同端頭材料對於產品基本電性的影響 53
4-1-1電容值之影響 53
4-1-2逸散因子之影響 54
4-1-3絕緣電阻之影響 55
4-1-4破壞電壓之影響 56
4-2不同端頭材料對於產品結構與成份分析 57
4-2-1 1206X7R105-copper產品結構與成份分析 57
4-2-2 1206X7R105-silver產品結構與成份分析 58
4-2-3 1206X7R105-graphene產品結構與成份分析 59
4-3不同端頭材料於熱循環的電容值變化影響 60
4-4 不同端頭材料對產品的耐候性測試的影響 61
4-5不同端頭材料於端頭黏合性的影響 64
4-6不同端頭材料對於抗彎曲性的影響 66
4-7材料成本計算 68
第五章 結論 69
5-1 結論 69
參考文獻 71

1.梁文恆，”國內外電容器市場之現況與未來”，工業材料，120, 29-48, 2001。
2.黃建程，研磨條件對薄層化積層陶瓷電容特性之研究，國立高雄應用科技大學化學工程與材料工程系研究所，碩士論文，2017。
3.董宗霖，黏結劑對薄層化積層陶瓷電容生胚層裂之研究，國立高雄應用科技大學化學工程與材料工程系研究所，碩士論文，2016。
4.吳朗，”電子陶瓷-介電陶瓷”，全新科技圖書，54，1994 。
5.陳光福，”陶瓷電容介電材料”，精密陶瓷科技入門，2, 22, 1990。
6.黃義閔，施體、受體離子在X7R陶瓷電容介電溫度穩定性質上扮演的角色，成功大學材料科學及工程科學研究所，碩士論文，2000。
7.洪偉修教授. 世界上最薄的材料--石墨烯 (PDF). 98康熹化學報報 (康熹文化事業股份有限公司). 2009-11, 11月號 。
8.陳聰文，”積層陶瓷電容器製程簡介”，工業材料，108, 73-75, 1995。
9.周嘉駿，薄層化積層陶瓷電容器製程條件之研究，國立高雄應用科技大學化學工程與材料工程系研究所，碩士論文，2011。
10. M. keimasi. (2007). Flex Cracking and Temperature humidity-Bias Effects on Reliability of Multilayer Ceramic Capacitors. Master Thesis, University of Maryland– College Park in partial fulfillment of the requirements for the degree of Doctor of Philosophy, Maryland, USA, 2007.
11. G. R. Brock Jr. (2009). The Effects Of Environmental Stress On The Reliability Of Flexible And Standard Termination Multilayer Ceramic Capactors. Master Thesis, University of Maryland– College Park in partial fulfillment of the requirements for the degree of Doctor of Philosophy, Maryland, USA, 2007.
12.C.H. Lee (2021). Design and Fem Analysis of Multilayer Ceramic Capacitors with Improved Bending and Thermal Shock Crack Performance. Journal of Electrical Engineering & Technology, 16, 2141–2148.
13.N. Blattau, P. Gormally, Vincenzo Iannaccone, L. Harvilchuck, C. Hillman (2005). Robustness of Surface Mount Multilayer Ceramic Capacitors Assembled with Pb-Free Solder, DfR Solutions.
14.G. Vogel (2015). Avoiding Flex Cracks in Ceramic Capacitors: Analytical Tool for a Reliable Failure Analysis and Guideline for Positioning Cercaps on PCBs. Microelectronics Reliability, 55(9-10), 2159-2164.
15.M. Stewart (2005), “A soft termination MLCC solution to guard against capacitor crack failures,” CARTS 2005, Palm Springs, California, USA, p. 219-224.
16.M. Keimasi, M. Azarian, M. Pecht (2008), “Flex Cracking of Multilayer Ceramic Capacitors Assembled with Lead-Free and Tin-Lead Solders,” IEEE Transactions on Device and Materials Reliability, Vol. 8, Issue 1, p. 182-192.
17.D. Galpaya, M.C. Wang, M. Liu, N. Motta, E. Waclawik, C. Yan* (2012). Recent advances in fabrication and characterization of graphene-polymer nanocomposites. Graphene, 1(2), 30-49.
18. J.R. Potts , D.R. Dreyer, C.W. Bielawski , R.S. Ruoff(2011). Graphene-Based Polymer Nanocomposites. Polymer, 52(1), 5–25.
19. 李佳安，薄層化積層陶瓷電容器黏結劑燒除製程條件之研究，國立高雄應用科技大學化學工程與材料工程系研究所，碩士論文，2021。