臺灣博碩士論文加值系統

Ni/Co在室溫下具有鐵磁性，且具有極佳的耐腐蝕性、延展性及高強度特性，Ti因其化學性質，具有抗腐蝕、抗高低溫、高強度低密度特性，良好的生物相容性，可應用在醫學、光學、化學還有電學上。因此選擇這三種材材料，透過奈米多層膜的方式去探討Ni/Co/Ti多層膜的電性研究。
本實驗是探討低溫快速退火對不同膜厚Ni/Co/Ti 奈米多層膜之影響，研究三種鍍膜膜厚對奈米多層膜快速退火前後相變化及物理性質之影響。本實驗使用碳化矽(SiC)，矽基板(Si)及玻璃基板(Glass)做為基板蒸鍍。三種基板經過試片前處理後以真空電子束蒸鍍機鍍膜，Ni/Co/Ti 以相同週期數、不同膜厚進行鍍膜，比例分別採用 1:1:2、2:2:4、4:4:8。本研究以三種不同膜厚的 Ni/Co/Ti 奈米多層膜，在三種不同退火溫度(320℃、350℃、380℃)通氬氣下進行快速退火 10 分鐘，使 Ni 層、Co 層和 Ti 層相互反應產生相變化及物理性質改變。運用原子力顯微鏡(AFM)和三維表面輪廓分析儀觀察退火前後的奈米多層膜的表面粗糙度變化，以掃描式電子顯微鏡(SEM)觀察退火前後奈米多層膜表面形貌變化，通過EDS分析奈米多層膜退火後元素成分，以 X-射線繞射分析(XRD)分析奈米多層膜之間的結晶性，使用四點探針觀察退火前後對奈米多層膜之電性之影響。

Ni/Co is ferromagnetic at room temperature, and has excellent corrosion resistance, ductility and high strength characteristics. Due to its chemical properties, Ti has the characteristics of corrosion resistance, high and low temperature resistance, high strength and low density, and has good biological properties. Compatibility, can be applied to medicine, optics, chemistry and electricity. Therefore, these three materials were selected to explore the electrical properties of Ni/Co/Ti multilayer films through nano multilayer films.
This experiment is to explore the effect of low-temperature rapid annealing on Ni/Co/Ti nano-multilayer films with different film thicknesses, and to study the effects of three coating film thicknesses on the phase changes and physical properties of nano-multilayer films before and after rapid annealing. In this experiment, silicon carbide (SiC), silicon substrate (Si) and glass substrate (Glass) were used as substrates for evaporation. The three substrates were pre-treated with the test piece and then coated with a vacuum electron beam evaporator. Ni/Co/Ti were coated with the same number of cycles and different film thicknesses. The ratios were 1:1:2, 2:2:4, and 4: 4:8. In this study, three Ni/Co/Ti nano multilayer films with different film thicknesses were subjected to rapid annealing for 10 minutes at three different annealing temperatures (320℃, 350℃, 380℃) under argon gas to make the Ni layer, Co layer and The Ti layer reacts with each other to produce phase changes and changes in physical properties. Use atomic force microscope (AFM) and three-dimensional surface profile analyzer to observe the surface roughness changes of nano-multilayer films before and after annealing, and use scanning electron microscope (SEM) to observe the surface morphology changes of nano-multilayer films before and after annealing. The element composition of the nano-multilayer film after annealing was analyzed by X-ray diffraction analysis (XRD) to analyze the crystallinity between the nano-multilayer films, and the four-point probe was used to observe the influence on the electrical properties of the nano-multilayer film before and after annealing.

摘要 ..................................................i
Abstract ..................................................iii
誌謝 ..................................................v
目錄 ..................................................vi
表目錄 ..................................................x
圖目錄 ..................................................xi
第一章 緒論 ..................................................1
1.1前言 ..................................................1
1.2研究動機與目的..................................................2
第二章 文獻回顧 ..................................................4
2.1 Skyrmion粒子簡介...............................................4
2.2以鎳鈷鈦多層膜製備Skyrmion粒子...................................6
2.3物理氣相沉積 ..................................................7
2.3.1 平均自由徑 ..................................................8
2.3.2 沉積原理 ..................................................10
2.3.3 電子束蒸鍍簡介................................................12
2.3.4 電子束蒸鍍原理...............................................12
2.4非線性電阻 ..................................................14
2.5蒸鍍靶材與基板材料及其性質.......................................15
2.5.1碳化矽基板 ..................................................15
2.5.2單晶矽基板 ..................................................16
2.5.3玻璃基板 ..................................................17
2.5.3鎳靶 ..................................................18
2.5.4鈷靶 ..................................................18
2.5.5鈦靶 ..................................................18
2.6快速退火快速升溫之熱輻射原理 18
2.7四點探針 ..................................................20
2.7.1四點探針原理 21
第三章 實驗方法與步驟 22
3.1 實驗參數 ..................................................22
3.1.1膜厚參數 ..................................................22
3.1.2退火參數 ..................................................23
3.2實驗材料 ..................................................23
3.3實驗流程 ..................................................24
3.4實驗設備 ..................................................26
3.4.1 實驗設備 ..................................................26
3.4.2後加工、量測及分析等其他設備 26
第四章 結果與討論..................................................32
4.1 碳化矽基板、矽基板及玻璃基板鍍不同膜厚鎳鈷鈦多層膜退火 前後之實際膜厚、表面形貌與粗糙度分析 ..................................................32
4.1.1不同基板鍍膜前之表面粗糙度分析.................................32
4.1.2以AFM分析鎳鈷鈦多層膜實際膜厚...................................34
4.1.3碳化基板鍍不同膜厚多層膜退火前後之SEM表面形貌.....................36
4.1.3 矽基板鍍不同膜厚多層膜退火前後之SEM表面形貌.....................38
4.1.4玻璃基板鍍不同膜厚多層膜退火前後之SEM表面形貌.....................40
4.1.5碳化矽基板鍍不同膜厚多層膜退火前後之AFM表面形貌...................42
4.2 不同基板鍍鎳鈷鈦多層膜退火前後之成分分析...........................44
4.2.1 碳化矽基板、矽基板及玻璃基板鍍多層膜退火前EDS分析................45
4.2.2 碳化矽基板鍍鎳鈷鈦多層膜之XRD結構成分分析 ....................48
4.3 不同基版鍍鎳鈷鈦多層膜退火前後之電性分析 ....................50
4.3.1碳化矽基板鍍不同膜厚多層膜退火前後之I-V曲線 ....................50
4.3.2矽基板鍍不同膜厚多層膜退火前後之I-V曲線 ....................52
4.3.3玻璃基板鍍不同膜厚多層膜退火前後之I-V曲線 ....................54
4.3.4碳化矽基板鍍不同膜厚多層膜退火前後之微分電阻 ....................56
4.3.5矽基板鍍不同膜厚多層膜退火前後之微分電阻 ....................59
4.3.6玻璃基板鍍不同膜厚多層膜退火前後之微分電阻 ....................61
第五章 結論 ....................................................63
參考文獻 ....................................................64

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