臺灣博碩士論文加值系統

探針卡是晶圓測試中不可或缺的重要工具，而多層懸臂式探針卡是為了因應高引腳針位的測試需求所開發的產品，如此高密度的探針進行排列，衍生出探針之間相互干涉之疑慮，於此同時，各層探針因幾何參數的設計差異，對銲墊產生相異的接觸力及刮痕大小，也對實務上進行晶圓測試時帶來困擾。
為了有效改善上述之問題，本研究分為三部分，第一部分針對鎢（W）、錸鎢（ReW）及P7（Paliney 7）三種材料之探針進行機械性質之探討，探討其在熱室中模擬不同針測環境與速度條件下的影響。第二部分利用卡氏第二定理（Castigliano's Second Theorem）對多層懸臂式探針進行干涉預測，取得各項幾何參數的不干涉參數設計區間。第三部分帶入實驗所得之探針機械性質，建立有限元素模型進行多層懸臂式探針卡探針刮痕分析，並結合反應曲面分析（Response Surface Method, RSM）與多目標基因遺傳演算法（Multi-Objective Genetic Algorithm, MOGA），以各層探針對銲墊造成之刮痕大小一致為目標，對幾何參數進行優化設計。由各項研究結果顯示：
1. 三種材料的探針中，錸鎢探針強度最高，鎢探針次之，P7探針則強度最低；鎢針延展性最佳，錸鎢探針次之，P7探針延展性最差。
2. 探針會因應變率效應（Strain Rate Effect），隨著應變率的提升而產生應變硬化。
3. 運用卡氏定第二定理可以預測懸臂式探針卡之運動行為及各層探針之間的干涉，同時提選出不干涉的幾何參數設計區間。
4. 在懸臂式探針中，改變探針之彎折角度（Bending Angle）及射出角度（Insert Angle），可控制探針對銲墊所造成之刮痕大小，當中以改變彎折角度之效果更為顯著，而改變探針之蝕刻長度（Taper Length），可控制探針對銲墊所造成之接觸力大小。
5. 結合反應曲面法及多目標基因遺傳演算法，對各層懸臂式探針之彎折角度及蝕刻長度進行調整，可有效提升各層探針刮痕之一致性，與初始設計相比其差異值減少達53%

Probe cards are essential tools in wafer testing, and multi-layer cantilever probe cards have been developed to meet the high pin-count testing requirements. The high-density arrangement of probe needle raises concerns about mutual interference among probes. Simultaneously, the different geometric parameter designs of probe card in various layers result in varying contact forces and probe mark sizes on the pads, causing actual issues during wafer testing.
To effectively address the aforementioned problems, this research is divided into three parts. The first part investigates the mechanical properties of probe needle made from three materials: tungsten (W), rhenium-tungsten (ReW), and Paliney 7 (P7). This examination simulates different probing environments and speed conditions in a thermal chamber. The second part utilizes Castigliano's Second Theorem to predict interference in multi-layer cantilever probe card, establishing non-interference parameter design intervals for various geometric parameters. The third part incorporates the experimentally obtained mechanical properties of the probe needle, establishing a Finite Element Model to analyze the probe mark characteristics of multi-layer cantilever probe cards. Combining Response Surface Method and Multi-Objective Genetic Algorithm, this part aims to optimize the geometric parameters to achieve consistent probe mark sizes across different layers of probe card on the pads. The result have illustrated:
1. Among the three materials, ReW probe needle have the highest strength, followed by W, with P7 probe needle having the lowest strength. W probe needle exhibit the best ductility, followed by ReW, with Paliney 7 probe needle having the poorest ductility.
2. Probe needle exhibit strain hardening with the increase in strain rate due to the Strain Rate Effect.
3. Using Castigliano's Second Theorem can predict the motion behavior of cantilever probe card and the interference between various layers, while simultaneously identifying geometric parameter design intervals that avoid interference.
4. In cantilever probe needle, adjusting the Bending Angle and Insert Angle of the probe needle can control the probe mark size on the pads, with changes in the Bending Angle having a more significant effect. Adjusting the Taper Length of the probe needle can control the contact force exerted on the pads.
5. Combining Response Surface Method and Multi-Objective Genetic Algorithm to adjust the Bending Angle and Taper Length of each layer of cantilever probe needle effectively improves the consistency of probe mark sizes across different layers of probe card. Compared to the initial design, the variation in probe mark sizes is reduced by 53%.

中文摘要 ...i
英文摘要 ...ii
誌謝 ...iv
目錄 ...v
表目錄 ...vii
圖目錄 ...viii
符號說明 ...xii
第一章 緒論 ...1
1.1 前言 ...1
1.2 研究動機 ...2
1.3 文獻回顧 ...4
1.3.1 探針特性量測與實驗數據分析 ...4
1.3.2 探針刮痕對銲墊損傷分析 ...5
1.3.3 探針幾何影響之機械行為與干涉預測 ...6
1.3.4 文獻回顧總結 ...9
1.4 研究方法與流程 ...10
第二章 探針卡概述 ...11
2.1 探針卡之發展歷程 ...11
2.2 探針卡之種類 ...12
2.2.1 懸臂式探針卡（Cantilever Probe Card） ...12
2.2.2 刀片式探針卡（Bland Probe Card） ...13
2.2.3 垂直式探針卡（Vertical Probe Card） ...14
2.2.4 薄膜式探針卡（Membrane Probe Card） ...15
2.2.5 微彈簧式探針卡（Microspring Probe Card） ...16
2.2.6 微機電式探針卡（MEMS Probe Card） ...17
2.3 探針卡之發展困境與挑戰 ...18
第三章 探針拉伸實驗 ...19
3.1 實驗設備與架構 ...19
3.2 試片製作 ...19
3.3 實驗方法與步驟 ...21
3.4 實驗結果與討論 ...22
第四章 懸臂式探針之解析模型 ...28
4.1 懸臂式探針之幾何參數 ...28
4.2 定義懸臂式探針之模型 ...29
4.2.1 懸臂式探針的自由體圖 ...29
4.2.1 懸臂式探針的各段彎矩 ...29
4.3 卡氏定理解析 ...31
4.4 多層懸臂式探針干涉檢查 ...33
第五章 多層懸臂式探針卡針測模擬分析 ...37
5.1 有限元素模型建立 ...37
5.2 有限元素模型驗證 ...39
5.3 模擬結果與討論 ...41
第六章 多層懸臂式探針卡優化設計分析 ...43
6.1 定義控制因子之不干涉參數設計區間 ...43
6.2 顯著性因子分析 ...44
6.3 優化分析方法 ...47
6.3.1 反應曲面法 ...47
6.3.2 多目標基因遺傳演算法 ...57
6.4 優化結果與討論 ...59
第七章 結論與未來展望 ...62
7.1 結論 ...62
7.2 未來展望 ...63
參考文獻 ...64
Extended Abstract ...67

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