[1]Hao-Han Hsu, and Dimitrios Peroulis, “A Micromachined High-Q Microstrip Line with a Broa dBand Microstrip-to-CPW Transistion”, IEEE Topical Meeting. San Diego. USA, pp. 1–4, Jan 2009.
[2]Jing Zhang, Xiaofeng Sun, Guidotti Daniel, Daquan Yu, Liqiang Cao, Lixi Wan, “Modeling and finite-element full-wave simulation of glass interposer with TGVs (through-glass-vias) for 3D packaging”, Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 12th International Conference, Shanghai, pp 1-4, 2011.
[3]Young Seek Cho and Rhonda R. Franklin, “Novel broa dBand through silicon via interconnect for three dimensional CPW transition”, 40th European Microwave Conference. Paris. France, pp. 113-116, Sep 2010.
[4]Hongyu Zhou, Farshid Aryanfar, “A novel through via for printed circuit boards at millimeter-wave frequencies”, Antennas and Propagation Society International Symposium (APSURSI), 2014 IEEE, Memphis, pp. 1698-1699, 2014.
[5]A. Benali, M. Bouya, M. Faqir, A. El Amrani, M. Ghogho, A. Benabdellah, “Through glass via thermomechanical analysis: Geometrical parameters effect on thermal stress”, Design and Test Symposium (IDT), 8th International, Marrakesh, pp. 1-5, 2013.
[6]Ralph Delmdahl, Rainer Paetzel, “Laser Drilling of High-Density Through Glass Vias of High-Density Through Glass Vias (TGVs) for 2.5D and 3D Packaging”, 2014, The Korean Microelectronics and Packaging Society, Soc., vol. 21, no. 2, pp. 53-57, 2014.
[7]I.D. Robertson and S. Lucyszyn, RFIC and MMIC Design and Technology,2001
[8]Andrey Mozharovskiy, Alexey Artemenko, Vladimir Ssorin, Roman Maslennikov, and Alexey Sevastyanov, “Wideband Tapered Antipodal Fin-Line Waveguide-to-Microstrip Transition for E-band Applications”, 43rd European Microwave Conference. Nuremberg. Germany, pp. 1187–1190, Oct 2013.
[9]Young-Gon Kim, Kang Wook Kim, and Young-Ki Cho, “An Ultra-wideband Microstrip-to-CPW Transition”, IEEE MTT-S International. Atlanta, pp. 1079–1082, Jun 2008.
[10]Qi Jiang, Calvin Domier, N. C. Luhmann, “A Ultra-Wideband Low Loss CBCPW-to-Microstrip Transition With Multiple Via Holes”, IEEE Microwave and Wireless Components Letters, pp. 751-753, 2014.
[11]Theodore S. Rappaport, Yunchou Xing, George R. MacCartney, Andreas F. Molisch, Evangelos Mellios, Jianhua Zhang, “Overview of Millimeter Wave Communications for Fifth-Generation (5G) Wireless Networks—With a Focus on Propagation Models”, IEEE Transactions on Antennas and Propagation, Vol.65, pp. 6213 - 6230, 2017
[12]Spartak Gevorgian, L.J. Peter Linner, Senior Member, “CAD Models for Shielded Multilayered CPW”, IEEE Transactions on Microwave Theory and Techniques, pp.772-779, 1995.
[13]Quan Xue, Leung Chiu, Hao-Tian Zhu, “A Transition of Microstrip Line to Dielectric Microstrip Line for Millimeter Wave Circuits”, Wireless Symposium (IWS), IEEE International, Beijing, pp. 1-4, 2013.
[14]K.C. Gupta, R. Garg, I. Bahl, and E Bhartis, Microstrip Lines and Slotlines, Second Edition, Artech House, Boston, 1996.
[15]D.M. Pozar, “Microwave Engineering”, 3rd edition, John Wiley & Sons,Inc., pp. 143-145, 2005.
[16]Schneider, M.V., “Microstrip lines for microwave integrated Circuit”, Bell system technical journal, pp. 1421-1444, 1969.
[17]Hammerstad, E.O., and F. Bekkadal, “Microstrip Han dBook ELAB report”, STF 44 A74169,university of Trondheim, Norway, 1975.
[18]Hammerstad, E., “Equations for microstrip circuit design”, European microwave conference., pp. 268-272, 1975.
[19]R. A. Pucel, D. j. Masse, and C.P. Hartwig, “Losses in microstrip”, IEEE Trans., Microwave theory tech., pp. 342-350, 1968.
[20]Schneider, M. V., “Dielectric loss in integrated microwave circuit”, Bell system technical Journal, vol.48, pp. 2325-2332, 1969.
[21]H.A Wheeler, “Formulas for the Skin effect”, Proc. IRE, vol.30, pp. 412-426. 1942.
[22]簡業達, “微小化共面波導濾波器之設計、模擬與製作”, 國立交通大學機械工程學系碩士論文, 民國94年.[23]Fuliang Wang, Zhipeng Zhao, Nantian Nie, Feng Wang, Wenhui Zhu, “Dynamic through-silicon-via filling process using copper electrochemical deposition at different current densities”, Scientific Reports, Vol.7,pp. 1-9, 2017.
[24]賴啟章, “構裝材料之電氣特性萃取技術”, 國立高雄大學電機工程學系碩士論文, 民國97年.
[25]Wei-Cheng Wu, Li-Han Hsu, Edward Yi Chang, Camilla Karnfelt, Herbert Zirath, J. Piotr Starski, Yun-Chi Wu, “60 GHz Broa dBand MS-to-CPW”, IEEE Microwave and Wireless Components Letters, Vol.17(11),pp. 784-786, 2007.
[26]Umer Shah, Jessica Liljeholm, James Campion, Thorbjörn Ebefors, Joachim Oberhammer, “Low-Loss, High-Linearity RF Interposers”, IEEE Microwave and Wireless Components Letters, Vol.28(11),pp. 960-962, 2018.
[27]Amin Enayati, Guy A. E. Vandenbosch, Walter De Raedt, “CPW-to-CPW Via-Connected Vertical Transition for Millimeter Wave”, 2010 IEEE Antennas and Propagation Society International Symposium, Canada, 2010.
[28]Xin Chen, Yiping Wu, “Thermal Analysis for COB Based on Glass Substrate”, International Conference on Electronic Packaging Technology, Chengdu, pp.775-777, 2014.
[29]Min Liang, Xiaoju yu, Corey Shemelya, Eric MacDonald and Hao Xin, “3D printed multilayer microstrip line structure with vertical transition toward integrated systems”, Microwave Symposium (IMS), IEEE MTT-S International, Phoenix, pp. 1-4, 2015.
[30]S.C. Lin, R-F. Huang and C.H. Chin, “Investigation of Thermally Conductive Ceramic Substrates for High-Power LED Application”, Microsystems, Packaging, Assembly and Circuits Technology conference, Taipei, pp. 589-592, 2009.
[31]詹朝富, “30 GHz高頻共平面波導結合微帶線電路於鑽孔玻璃基板之研製”, 國立高雄應用科技大學電子工程系碩士論文, 民國106年.[32]A Delcorte, S Befahy, C Poleunis, M Troosters, P. Bertrand, “Improvement of metal adhesion to silicon films A Tof-SIMS study”, Adhesion Aspects of Thin Films, Vol. 2, pp. 1–12, 2004.
[33]林展頡, “提升寬頻隔離度效果之多重輸入輸出雷達天線設計”, 國立中山大學通訊工程學系碩士論文, 民國102年.[34]蕭宏, “半導體製程技術導論(第三版) ”, 全華圖書館股份有限公司, 民國103年.
[35]Yong-Da Chiu, Wei-Ping Dow, Jing-Yuan Lin, Shi-Min Lin, “An alternate of MPS and SPS collocated with dimensionally stable anode (DSA) for Cu fill of microvia and TSV”, 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, pp.1-3, 2010.
[36]Yongfu Liu, Daowei Wu, “Copper filling by electroplating for high aspect ratio TSV”, 2013 14th International Conference on Electronic Packaging Technology, pp. 1271-1275, 2013.
[37]王炯鑫, “以電鍍法製備高頻覆晶封裝用錫-銅击塊之研究”, 國立交通大學材料科學與工程學系碩士論文, 民國96年.[38]田民波, “材料學概論”, 清華大學出版社, 2015.
[39]Yunhui Zhu, Yuan Bian, Xin Sun, Shenglin Ma, Qinghu Cui, Xiao Zhong, Jing Chen, Min Miao, Yufeng Jin, “Effect of additives on copper electroplating profile for TSV filling”, 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging, pp. 56-59, 2012.
[40]Shigeo Onitake, Kotoku Inoue, Masatoshi Takayama, Takashi Kozuka, Satoru Kuramochi, Hobie Yun, “TGV (Thru-Glass Via) Metallization by Direct Cu Plating on Glass”, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), pp. 1316-1321, 2016.
[41]Gilho Hwang, Ravanethran Kalaiselvan, Hilmi B Mohamed Yusoff, “Development of bottom-up Cu electroplating process and overburden reduction for through silicon via (TSV) application”, 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), pp. 57-60, 2016.