臺灣博碩士論文加值系統

高功率脈衝磁控濺射 (High Power Impulse Magnetron Sputtering, HIPIMS) 為近年最受矚目的薄膜沉積技術。利用極高脈衝功率密度形成的放電條件可獲得與陰極電弧放電相似的薄膜品質且完全避免微粒的出現。本研究主要利用脈衝電源與直流電源組合而成的複合濺鍍系統沉積氮化鈦薄膜。
本研究以碳鋼與M41高速鋼作為基材，固定製程參數對有、無熱處理的基材沉積氮化鈦薄膜，結果顯示基材硬度影響薄膜硬度；基材經淬火與回火熱處理後的硬度由HRC 35度提升到HRC 66度，而其上沉積的TiN薄膜呈現結晶質。試片表面硬度則由350 Hv提升到995Hv。以VDI3198進行附著力定性量測顯示附著等即為HF2，以刮痕試驗機進行附著力定量分析，最大附著力為130N。

Recent years, high power impulse magnetron sputtering (HIPIMS) technology has gained significant attention among researchers from different fields. By utilizing high pulsed power density, discharged plasma in the chamber is able to form thin film which is similar to film deposited by cathodic arc deposition but avoided the formation of droplet on the surface of thin film completely. Throughout this work, we combined HiPIMS and direct current (DC) sputtering power source formed a complex sputtering deposition system to produce titanium nitride (TiN) coatings.
In this work, we used carbon steel and M41 high speed steel as substrates. Crystalline TiN coatings were deposited on substrates, which went under heat treatment and without heat treatment, with fixed deposition condition and results showed that the hardness of thin film was influenced by the hardness of substrate. Hardness of the substrate which went under heat treatment process such as quenching and tempering increased from HRC 35 to HRC 66 while the surface hardness of TiN-deposited substrate raised from 350 HV to 995 HV. By carrying out qualitative test VDI 3198, adhesion of coating exhibited HF1. Meanwhile, quantitative analysis of adhesion of TiN coating were determined using scratch adhesion testing, exhibited highest critical load of 130N.

摘要............................i
Abstract............................ii
誌謝............................iii
目錄............................iv
表目錄............................v
圖目錄............................vi
第一章　緒論............................1
1.1前言............................1
1.2 研究目的............................2
第二章　理論分析與文獻回顧 3
2.1濺鍍原理............................3
2.2輝光放電............................4
2.2.1直流輝光放電............................4
2.2.2暗區放電............................5
2.2.3輝光放電............................5
2.2.4電弧放電............................6
2.3脈衝磁控濺鍍(Pulsed magnetron sputtering, PMS).....7
2.4高功率脈衝磁控濺鍍(High Power Impulse Magnetron Sputtering, HIPIMS)..8
2.5 氮化鈦薄膜文獻回顧(Review of Titanium Nitride Thin Films)..........10
第三章　研究方法與流程............................18
3.1 實驗流程............................18
3.2 實驗材料............................18
3.3 鍍膜沉積............................19
3.4 分析與測試............................19
第四章　結果與討論............................23
4.1 TiN鍍膜結構............................23
4.2 TiN鍍膜工具鋼機械性質............................24
4.3 TiN鍍膜端銑刀切削性能............................26
第五章　結論............................27
參考文獻............................28
Extended Abstract............................30

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