1. Q. J. Yang, H. L. J. Pang, Z. P. Wang, G. H. Lim, F. F. Yap,
and R. M. Lin, “Vibration Reliability Characterization of
PBGA Assembly”, Microelectronics Reliability, Vol. 16, May
1999
2. Q. J. Yang, G. H. Lim, H. L. J. Pang and Z. P. Wang,
“Vibration Reliability Test of PBGA Assembly”, IEEE
Electronics Packaging Technology Conference, 1998
3. Q. J. Yang, Z. P. Wang, G. H. Lim, John H. L. Pang, F. F.
Yap and R. M. Lin, “Reliability of PBGA Assemblies Under
Out-of-Plane Vibration Excitations”, Transactions on
Components and Packaging Technologies, Vol. 25, No. 2, June
2002
4. T. E. Wong, F. W. Palmieri and H. S. Fenger, “Under-Filled
BGA Solder Joint Vibration Fatigue Damage”, IEEE Society
Conference on Thermal Phenomena, 2002
5. T. E. Wong, B. A. Reed, H. M. Cohen and D. W. Chu,
“Development of BGA Solder Joints Vibration Fatigue Life
Prediction Model”, IEEE Electronic Components and
Technology Conference, 1999
6. T. E. Wong, F. W. Palmieri, B. A. Reed, H. S. Fenger, H. M.
Cohen and K. T. Teshiba, “Durability/Reliability of BGA
Solder Joints under Vibration Environment”, IEEE
Electronic Components and Technology Conference, 2000
7. Sidharth and D. B. Barker, “Vibration Induced Fatigue Life
Estimation of Corner Leads of Peripheral Leaded
Components”, Journal of Electronic Packaging, Vol. 118,
pp. 244-249, December 1996
8. S. J. Ham and S. B. Lee, “Experimental Study for
Reliability of Electronic Packaging under Vibration”,
Experimental Mechanics, Vol. 36, No. 4, pp. 339-344, 1999
9. S. Russell, R. Caroselli, J. Mason and M. Shah, “A
Conjectectured Solder Fatigue Law Based on Nonlinear
Dynamics”, Journal of Electronic Packaging, Vol. 114, pp.
122-127, 1992
10. H. S. Blank, “Accelerated Vibration Fatigue Life Testing
of Leads and Soldered Joints”, Microelectronics and
Reliability, Vol. 15, pp. 213-219, 1979
11. S. S. Manson, “Fatigue: A Complex Subject-Some Simple
Approximations”, Experimental Mechanics, Vol. 5, No. 7,
pp.193-226, July 1965
12. Curtis F. Gerald, Patrick O. Wheatley, “Applied Numerical
Analysis”, Fifth Edition, Addison-Wesley Publishing
Company, Inc., New York, 1994
13. William H. Press, Saul A. Teukolsky, William T. Vetterling
and Brian P. Flannery, “Numerical Recipes in C” Second
Edition, Cambridge University, New York, 1992
14. Joe D. Hoffman, “Numerical Methods for Engineers and
Scientists” McGraw-Hill, Inc., New York, 1992
15. Donald B. Barker, Abhijit Dasgupta and Michael G. Pecht,
“PWB Solder Joint Life Calculations Under Thermal and
Vibrational Loading”, IEEE Proceedings Annual Reliability
and Maintainability Symposium, pp. 451-459, 1991
16. Qizhou Yao, Jianmin Qu and Sean X. Wu, “Estimate the
Thermomechanical Fatigue Life of Two Chip Scale Packages”,
IEEE Electronic Components and Technology Conference, 1999
17. Dave S. Steinberg, “Vibration Analysis for Electronic
Equipment”, Second Edition, John Wiley & Sons, New York,
1988
18. Dave S. Steinberg, “Vibration Analysis for Electronic
Equipment”, Third Edition, John Wiley & Sons, New York,
2000
19. Shi-Wei Ricky Lee and Ben Hoi Wai Lui, “Evaluation of
Board Level Reliability of Pb-free PBGA Solder Joints”,
IEEE 8th International Symposium on Advanced Packaging
Materials, pp. 82-89, 2002
20. J. Lau, K. Gratalo, E. Schneider, T. Marcotte and T. Baker,
“Solder Joint Reliability of Large Plastic Ball Grid Array
Assemblies Under Bending, Twisting, and Vibration
Conditions”, Circuit World, Vol. 22, No. 1, pp. 27-32, 1995
21. G. Bartlett, and W. Yacovitch, “Ruggedizing the BGA for
High Vibration”, Mercury Computer Systems, Inc.,
Chelmsford, Mass., Electronic Packaging & Production, pp.
84-91, October 1997
22. Bryan Dodson, “Weibull Analysis”, ASQC Quality Press,
Wisconsin, 1994
23. Vander Weil, S. A. and Meeker W. Q., “Accuracy of Approx
Confidence Bounds Using Censored Weibull Regression Data
from Accelerated Life Tests”, IEEE Transactions on
Reliability, Vol. 39, pp. 346-351, 1990
24. Patrick D. T. O’Connor, “Practical Reliability
Engineering”, Third Edition Revised, John Wiley & Sons,
New York, 1996
25. Peter M. Hall, “Forces, Moments, and Displacements During
Thermal Chamber Cycling of Leadless Ceramic Chip Carriers
Soldered to Printed Boards”, IEEE transactions on
Components, Hybrids, and Manufacturing Technology, Vol.
Chmt-7, No. 4, December 1984
26. D. Barker, J. Vodzak, A. Dasgupta and M. Pecht, “Combined
Vibrational and Thermal Solder Joint Fatigue—A Generalized
Strain Versus Life Approach”, Journal of Electronic
Packaging, Vol. 112, pp. 129-134, June 1990
27. Norman E. Dowling, “Mechanical Behavior of Materials”,
Second Edition, Prentice-Hall, New Jersey, 1999
28. 謝明峰, “閥製品加速壽命試驗法數學模式之研究”, 國立中央大
學, 碩士論文, 中華民國89年6月
29. 陳右昇, “ADC12壓鑄鋁合金共振疲勞壽命之可靠度分析”, 國立
成功大學, 碩士論文, 中華民國88年6月
30. Howard W. Markstein and Western Editor, “Dealing With
Vibration in Electronics”, Electronic Packaging &
Production, pp. 30-34, June 1989
31. Jeff Schutt, “Vibration Testing of Electronic
Assemblies ”, Trace Laboratories, Chicago, Ill, Electronic
Packaging & Production, pp. 20-26, December 1996
32. 李正彬, “一個新的神經網路學習法-蟻窩演算法”, 私立元智大
學, 碩士論文, 中華民國91年6月
33. Wan-Lee Yin, “Thermal Stress and Free-Edge Effects in
Laminated Beams:A Variational Approach Using Stress
Functions”, Journal of Electronic Packaging, Vol. 113, pp.
68-75, 1991
34. W. L. Yin, “Refined Variational Solutions of the
Interfacial Thermal Stresses in a Laminated Beam”, Journal
of Electronic Packaging, Vol. 114, pp. 193-198, 1992
35. Howard W. Markstein, and Western Editor, “Designing
Electronics for High Vibration and Shock”, Electronic
Packaging & Production, pp. 40-43, April 1987
36. J. Lau, T. Marcotte, J. Severine, A. Lee, S. Erasmus, T.
Baker, J. Moldaschel, M. Sporer and G. Burward-Hoy,
“Solder Joint Reliability of Surface Mount Connectors”,
Journal of Electronic Packaging, Vol. 115, June 1993
37. G. H. Lim, J. H. Ong and J. E. T. Penny, “Effect of Edge
and Internal Point Support of a Printed Circuit Board Under
Vibration”, Journal of Electronic Packaging, Vol. 121,
June 1999
38. Edward Jin and Wayne Jung, “Vibrational Fatigue of Surface
Mount Solder Joints”, IEEE Intersociety Conference on
Thermal Phenomena, 1998
39. 蕭名男, “可靠度加速壽命測試模式之比較分析” , 國立成功大
學, 碩士論文, 中華民國87年6月
40. 馮克林, ”可靠度加速度測試概觀”, 工業材料151期, pp. 169-176, 1999
41. Edward Koen, Farzad Pourahmadi and Stephen Terry, “A
Multilayer Ceramic Package for Silicon Micromachined
Accelerometers”, The 8th international Conference on Solid-
State Sensors and Actuator, pp. 273-276, June 1995
42. 蘇朝墩、陳麗妃、彭鴻霖, “高可靠度產品壽命預估-以發光二極體
為例” , 品質學報, 第五捲第一期, pp. 27-51,中華民國87年6
月
43. 徐自強, ”產品的保固期與可靠度”, 品質管制月刊, 第二十九卷第十期, pp. 33-36,中華民國82年10月
44. 吳俊諭, “溫度循環對於電容及通訊模組之破壞效應研究”, 國立
中央大學, 機械研究所碩士論文, 中華民國90年7月
45. 沈盈志, “金屬材料疲勞累積效應與可靠度關係之探討”, 國立中
央大學, 機械研究所博士論文, 中華民國86年6月
46. 石逸群、柏恆仁、王國雄、沈盈志, “累積失效可靠度退化模式與
韋伯模式之比較”, 國立中央大學, 國科會計畫, 中華民國89年
47. 吳明霞, “高可靠度產品之逐步應力加速衰變實驗”, 國立清華大
學, 統計研究所碩士論文, 中華民國89年6月
48. 郭榮洲, “複合疊層板受應力譜作用之加速壽命試驗研究”, 國立
成功大學, 航空太空工程研究所碩士論文, 中華民國90年7月
49. U. Daya Perera, “Evaluation of reliability of solder
joints through twisting and bending”, Microelectronics
Reliability, Vol. 39, pp. 391-399, 1999
50. 張士田, “隨機負荷下機件疲勞動態可靠度退化模式之探討”, 國
立中央大學, 機械研究所碩士論文, 中華民國83年6月
51. 徐國峻, “不同可靠度模式下之R-S-N曲線的建立與比較”, 國立
成功大學, 機械研究所碩士論文, 中華民國89年6月
52. Dave S. Steinberg, “Tougher Tests for Military
Electronics”, Machine Design, Vol. 25, May 1989
53. Tin-Lup Wong, Karl K. Stevens and Gang Wang, “Experimental
Modal Analysis and Dynamic Response Prediction of PC Boards
With Surface Mount Electronic Components”, Journal of
Electronic Packaging, Vol. 113, pp. 244-249, September 1991