臺灣博碩士論文加值系統

摘要
電子設備無論用於汽車或航空產業，都同時受到振動和熱環境負荷之影響。而這些電子產品的可靠度測試往往是熱和振動測試分別進行，其測試結果顯然與真實負載情況有別，因為未考慮溫度與振動之間的相互影響。高加速壽命測試（Highly Accelerated Life Test , HALT）試驗機的發展，可同時結合熱和振動進行測試，更接近真實的應用環境。
本研究的重點為經由一系列測試，包括熱循環，振動和HALT測試，研究覆晶球柵陣列電子元件（FCBGA）受力最大之角落錫球的應力與應變在這些測試條件下之變化，以做為可靠度研究之基礎，並同步以商業軟體ANSYS進行相關之有限元素分析(FEA)。
研究結果顯示，在不同溫度下進行振動試驗，因為溫度所產生的熱應力會導致錫球的楊氏係數改變，進而會影響其振動測試結果。本研究以有限元分析將溫度所產生的熱應力作為一個預應力當初始條件代入模型，然後再加入振動求解，而當我們在溫度循環(-55℃~150℃)加入30G振動時，其應變會較單獨溫度循環之應變高170μstrain。另一項則是探討不同溫度下其自然頻率會隨溫度增加而略為上升。透過本研究，能了解不同溫度及振動值對於錫球、自然頻率以及應變造成影響。其結果，有助於提高電子產品的壽命估計的準確性。
關鍵詞：FCBGA、HALT、壽命、可靠度、熱循環、振動

Abstract
The electronic devices such as those used in automotive or avionic industries, all subjected to vibration and thermal environmental loadings. These electronics were tested for their reliabilities with thermal and vibration test conducted separately in the past. These kinds of test were considered as not precise enough since they didn’t consider the mutual effects between these two loadings. Thanks to the development of Highly Accelerated Life Test (HALT) test machine, it is possible to conduct test closer to the real world applications by combining both thermal and vibration test simultaneously.
This study focuses on examining the resulting stresses of the most vulnerable to damage corner solder ball of today’s sophisticated flip chip ball grid array components (FCBGA) through a series of tests including thermal cycling, vibration, and HALT tests. Meanwhile, the finite element analysis (FEA) with the commercial ANSYS software was also performed for all the foregoing test conditions. It is then feasible to investigate the coupling effects between individual thermal and vibration tests by checking with results from the HALT test.
The results showed that if conducting vibration test under the temperature other than room temperature, the generated thermal stress will cause the dynamic properties of the test vehicle as well as the Young's modulus of the solder balls be changed. Similar results were verified though the FEA by finding the thermal stress firstly, and put them as an initial stress on a pre-stressed model to compare with the experimental data. When we add 30Grms vibration into -55~150℃thermal cycling test ,it adds another 170 μstrain(about 15% more strain and can’t be ignored. )Both of these two methods were then varied for the test temperature to explore the effects on the vibration testing results. It was found that with the increase of temperature, the natural frequency also increases too. However, with elevated temperature that softens the solder balls, the observation then differs a bit. Through this study, some of the unexplored data in the dynamic performance and life of the today’s advanced electronic components under combined dynamic loading environments were revealed. The corresponding results were helpful in improving the life estimation accuracy of electronic products.

Keywords: FCBGA, HALT, Life, Reliability, Thermal Cycling, Vibration

目錄
摘要 ii
Abstract iv
表目錄 x
圖目錄 xi
第一章 緒論 1
1.1 前言 1
1.2 研究目的 3
1.3 文獻回顧 3
1.4 研究流程及方法 7
1.5 論文架構 7
第二章 理論架構 9
2.1 疲勞理論 9
2.2 加速壽命測試因子 10
2.3 振動加速壽命之數學模式 10
2.4 溫度加速壽命之數學模式 11
2.5 溫度加振動之壽命理論 12
2.6 韋伯分析 13
第三章 實驗方法 16
3.1 試片介紹 16
3.2 測試規範介紹 17
3.3 高加速壽命機台介紹 18
3.4 高加速壽命試驗機試片溫度與環境溫度貼合情況 20
3.5 實驗步驟與目的 21
第四章 有限元素分析 27
4.1 有限元素分析之程序 27
4.2 溫度加振動之有限元素分析設定 29
4.3 固定溫度40℃施加10、20、30G之振動分析 31
4.4 固定60℃時施加10、20、30G振動值分析結果 45
4.5 固定80℃時施加10、20、30G振動值分析結果 58
4.6 總結各溫度施加10、20、30G振動值分析結果 71
第五章 高加速應力實驗 75
5.1 溫度及振動實驗設定 75
5.2 PCB於不同溫度下改變其振動值 76
5.3 有無殘留應力PCB之30G振動比較 80
5.4 PCB在含溫度效應自然頻率驗證 94
5.5 單純熱循環與HALT試驗之比較 97
第六章 結果討論 100
6.1 不同溫度下其自然頻率之改變 100
6.2 定溫下改變其振動值 105
6.3 熱循環應變與熱循環加上30G振動比較 106
6.4 結論及未來工作 107
參考文獻

[1]Harry McLean and Mike Silverman , “From HALT Results to An Accurate Field MTBF Estimate,” Advanced Energy Inc, IEEE, 2010.
[2]Harry McLean, “HALT, HASS, and HASA Explained”,ASQ Quality Press, 2009.
[3]吳亮東，「高加速壽命試驗溫度與震動失效模式檢測分析」，碩士論文，國立清華大學工程與系統科學所，台灣，2009。
[4]Y. Zhao, C. Basaran, A. Carwright, and T. Dishongh, “Inelastic Behavior of Microelectronics Solder Joints Under Concurrent Vibration and Thermal Cycling,” IEEE Inter Society Conference on Thermal Phenomena, pp. 174-180, 2000.
[5]蘇仁章，「電子元件在含溫度校應之動態負載下的可靠度研究」，碩士論文，元智大學機械工程所，台灣，2005。
[6]J. de Vries “Solder-Joint Reliability of HVQFN-Packages Subjected to Thermal Cycling”, Microelecron. Rel., vol. 49, p.331 , 2009.
[7]Bor-Tsuen Wang, Fu-Xiang Hsu, Xiu-Wei Liang, and Chen-Hsiung Hung, “Response Prediction and Verification for PCB with Package due to Thermal and Random Vibration Coupling Effects,” IEEE International Microsystems Packaging , pp. 401-404, 2009.
[8]許富翔，「具封裝體PCB於熱效應及振動複合試驗之響應預測」，碩士論文，國立屏東科技大學機械工程所，台灣，2009。
[9]梁秀瑋，「隨機振動與熱效應複合負載下之封裝體錫球應力預測分析」，碩士論文，國立屏東科技大學機械工程所，台灣，2010。
[10]李建，溫振複合載荷作用下多層殼結構隨機振動響應有限元素分 析，中國工程物理研究院，中國，2009。
[11]F.X. Che, John H.L. Pang, “Vibration Reliability Test and Finite Element Analysis for Flip Chip Solder Joints,” Microelectronics Reliability, pp. 754–760, 2009.
[12]林清仁，「具隨機參數印刷電路板隨機振動分析」，碩士論文，中央大學機械工程研究所，台灣，2009。
[13]D. Yu, A. Al-Yafawi, T.T. Nguyen, S. Park, and S. Chung “High-cycle fatigue life prediction for Pb-free BGA under random vibration loading,” Microelectronics Reliability, 2010.
[14]Chunyue Huang, “Thermal Fatigue Life Analysis and Forecast of PBGA Solder Joints On the Flexible PCB Based on Finite Element Analysis,”Electronic Packaging Technology &; High Density Packaging, IEEE Electronic Packaging Technology &; High Density Packaging, 2000.
[15]J. H. Norris, and A. H. Landzberg, IBM Journal of Research and Development, pp. 266-271, 1969.
[16]黃俊仁，「溫度循環對於電子產品之破壞校應評估」，碩士論文，中央大學機械工程研究所，台灣，2000。
[17]黃乾怡，DOM 產品可靠度試驗，中華民國品質學會第42屆年會暨第12 屆全國品質管理研討會，台灣，2006。
[18]黃子容，電子元件溫度循環測試之力學分析與替代性機械測試之改進研究，碩士論文，元智大學機械工程所，台灣，2010。
[19]郭昱綸，「覆晶球柵陣列電子封裝體在溫度循環下的熱應力與熱應變分析」，碩士論文，中山大學機械與機電工程所，台灣，2002。
[20]莊毓仁，「應用步進式高加速壽命試驗於高電壓積層式陶瓷電容之可靠性研究」，碩士論文，國立彰化師範大學機電工程所，台灣，2009。
[21]亞博納希，“新韋伯分析手冊”，鼎茂出版，台灣，2007。
[22]Gyu-Ho Kim, Hongbing Lu, “Accelerated Fatigue Life Testing of Polycarbonate at Low Frequency under Isothermal Condition”, Polymer Testing 27,September 2007.
[23]黃東鴻、賴逸少、王靜君，「疊合封裝結構受功率與溫度耦合循環測試之熱傳特性與疲勞可靠度評估」，台灣半導體產業協會，No42 p1-8，2007。
[24]張偉倫、林根源、薛欽鐸、張榮明，環境振動試驗規格設計與可靠度分析，財團法人車輛研究測試中心，2009。
[25]S. S. Manson, “Thermal Stress and Low Cycle Fatigue” , McGraw-Hill, New York,1996.
[26]MIL-STD-810 Committee, “EnvironmentalTest Methods and Engineering Guides”, MIL-STD-810F, January 2000.
[27]Barker, D. B., Vodzak, J., Dasgupta, A., and Pecht, M., “PWB Solder Joint Life Calculations Under Thermal and Vibrational Loading”, Journal of the IES, Vol. 35 (1), pp. 17-25, February 1992.
[28]JEDEC, “ Vibration, Vibration Frequency, ” JEDEC Standard JESD22-B103-B, Solid State Technology Association, 2002.
[29]JEDEC, “Monotonic Bend Characterization of Board-Level Interconnects” , JEDEC Standard IPC/JESD-9702, Solid State Technology Association, 2004