臺灣博碩士論文加值系統

快速原型(Rapid prototyping，RP)與快速模具(Rapid tooling，RT)發展相輔相成，一些快速模具由於材料與真正的鋼模不同，使用在射出成型時必須面對熱的問題，石膏製作成模仁被使用在射出成型已被初步驗證是可行，但石膏材質本身為熱的不良導體，對於熔膠進入模具的熱若無法排除，將造成射出產品品質的不良影響。如何改善此現象便是本論文的目標，在射出成型過程中，高溫的熔膠會讓模具溫度逐漸上升，為了維持穩定的生產條件，模具必須要有溫度控制的功能，一般模具使用的材質皆為模具鋼，其溫度控制的方式是模具鑽冷卻水孔，再導入特定溫度的冷卻液於冷卻水孔中循環來達到降溫的效果。
快速模具材料的熱傳導性質不如傳統的模具鋼，例如樹脂模、矽膠模、石膏模等，由於這些材料的熱傳導性質不如傳統的模具鋼，容易在射出成型時聚集熱量在石膏模具表面，造成模具壽命降低以及射出產品的缺陷。
為了改善這些問題，本研究使用熱傳導係數較高的鋁材製作散熱片(Heat sink)，於石膏模仁製作過程中埋入，增加石膏模仁的熱傳導性，從熱傳學中可知道熱量傳遞的熱阻抗概念與電路學的電阻抗概念是相類似的，本研究利用熱迴路(Thermal circuit)概念進行石膏模仁與散熱片的串並聯理論設計，結果顯示理論分析與實驗結果相似，與純石膏模仁(無散熱片)相比，使用串並聯散熱片時，其降溫效果可達到1-2度 ，但在相同厚度不同埋設方式，並聯的設計方式比串聯的降溫效果多4-5度。

Rapid prototyping and rapid tooling complement each other, some rapid tooling material are different from real steel molds, having to handle heat during injection molding, gypsum made into mold is used to injection molding has been initially verified is feasible, but gypsum material is a poor conductor of heat, for hot melt into mold can not be ruled out, will affect the quality of the product, how to improve the phenomenon is the goal of paper, in the injection molding process, high temperature melt will make the mold temperature rise gradually, in order to maintain stable production conditions, mold must have temperature control, the materials used for general molds are all steel mold, temperature control method is drilling cooling water hole, coolant with specific temperature is circulated through cooling water hole to achieve cooling effect.
The heat transfer properties of rapid mold materials are not as good as those of traditional mold steels, such as resin molds, silicone molds, plaster molds, etc. Since these materials have lower heat transfer properties than conventional mold steels, it is easy to collect heat on the gypsum mold surface during injection molding, resulting in reduced mold life. And the defects of the shot product.
In order to improve these problems, this study uses a high heat transfer coefficient of aluminum to make a heat sink, buried in the gypsum mold production process, increase the thermal conductivity of the plaster mold kernel, heat transfer can be known from heat transfer The concept of thermal impedance is similar to the electrical impedance concept of circuit science. This study uses the thermal circuit concept to design the series-parallel connection between gypsum mold and heat sink. The results show that the theoretical analysis is similar to the experimental results. Compared with the plaster mold core (no heat sink), when the series-parallel heat sink is used, the cooling effect can reach 1-2 degrees, but in the same thickness and different embedding modes, the parallel design method is 4-5 degrees more than the series cooling effect.

摘要...i
ABSTRACT...ii
誌謝...iv
目錄...v
表目錄...vii
圖目錄...viii
第一章 緒論...1
1.1研究背景...1
1.2文獻回顧...2
1.3研究動機與目的...5
第二章 理論基礎...6
2.1石膏材料介紹...6
2.1.1石膏漿的製作...6
2.2模具溫度變化與射出成型...7
2.2.1模具溫度對石膏模具之影響...8
2.3熱傳遞原理...10
2.3.1複合壁...11
第三章 實驗規劃...15
3.1實驗流程...15
3.2 散熱片(Heat sink)之材質...16
3.2.1串聯散熱片...16
3.2.2並聯散熱片...17
3.3石膏模仁製作...18
3.4溫度量測實驗...20
第四章 結果與討論...25
4.1理論模溫數值分析...25
4.1.1 散熱片的深度對模溫的影響(串聯)...25
4.1.2 散熱片的厚度對模溫的影響(串聯)...29
4.1.3 散熱片的數量對模溫的影響(串聯)...31
4.1.4 散熱片的厚度對模溫的影響(並聯)...32
4.1.5 散熱片的數量對模溫的影響(並聯)...34
4.2加熱實驗-溫度量測結果...36
4.2.1定量熱源的模溫量測結果...36
4.2.2溫度固定的熱源模溫量測結果...38
4.2.3週期性熱源的模溫量測結果...40
4.2.4 散熱片串聯與並聯的實驗結果...43
第五章 結論與未來展望...45
5.1結論...45
5.2未來展望...46
參考文獻...47
附錄A...48
EXTENDED ABSTRACT...49
ABSTRACT...49

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