臺灣博碩士論文加值系統

過去在組裝次序的研究方面，幾乎都是考慮在單廠內組裝，最近十幾年來，由於產業分工越來越細以及為了增加產能，很多公司不斷地擴廠或是合併其他產能，所以原本單純的單廠問題衍生到複雜的多廠規劃系統。跨廠體系就是說某一成品需要一個廠房以上來進行作業，以組裝來說，每一廠房負責組裝成品的某一部份最後組裝成成品，因此，現在的生產模式、公司型態已不是一間工廠從頭做到尾，也不是一公司一工廠的情形，單廠組裝體制在現行的生產模式已不適用，所以在分工越來越細的情形之下，跨廠組裝次序的規劃是必行的。
對於跨廠組裝次序的規劃，本研究提出了兩階段的子組裝，第一階段的子組裝是在單廠內決定的，利用組裝狀態圖建立出組裝在先圖，進而找出子組裝；而第二階段的子組裝是在單元間來尋找，因此第二階段的子組裝就是併單元的動作，本研究是假設一開始的廠房數是未知的，最後會得到一個廠區圖，就會得到最佳的廠房數目。本研究中合併的動作是利用中心衛星體系的觀念來決定出合併的狀況，而選擇次序的原則是取決於最小時間成本，本研究會提出一操作成本函數(Operation Cost Function, OCF)來分析評估組件的組裝，並以階層組裝次序樹(SAST)來搜尋出所有的組裝次序，再決定出最佳的跨廠組裝次序。
本研究目的是針對電子產品中需要組裝的部分，在跨廠的體系之下，本研究會發展一套有系統的方法與成本評估指標，找出成本最低的跨廠組裝次序，使得組件的組裝操作成本為最低。

In the past, research related to assembling sequence planning has been based on individualized factories. Until recent years, for the purposes of industrial specification and production, many factories gradually build other sub-factories or merge with other resources that force individualized factories bypass their own problems onto complex multi-factorial planning systems. Thus, an interconnected multi-factorial model is formed. Within the model, a product needs at least more than one factory to process its parts until it is finally completed. In assembly, each factory is responsible for only one part of the product. Therefore, current production mode and company manner do not support individualized factories, neither do they comply with the past trend of one-company-one-factory principle. To summarize, individualized factory assembly model is not applicable in the current production mode. Under the current trend that more diversification and specification is in effect, planning of an interconnected multi-factorial assembling sequence must be considered.
Regarding the planning of an interconnected multi-factorial assembling sequence, the paper proposes two set of sub-assembly. The first set of sub-assembly is completed in an individualized factory, using an assembly status graph to establish an assembly precedence graph and determine the sub-assembly; the second set of sub-assembly is completed with several aggregated outcomes of chosen elements. One assumption is that the exact number of factories remains unknown until a factory sitemap is obtained that indicates the best solution. Also, the takeover action is determined by the concept of centralized satellite model which reveals the current status, and the choice sequence order is used to evaluate the minimum time cost. Then, several operation cost functions are developed to analyze parts that are about to be assembled, use SAST to search for all assembly sequence, and determine the best interconnected multi-factorial assembly sequence.
The paper aims specifically for electronic products that are in need of assembly. The objective is to develop a systematic method and cost analysis trend in order to find the minimum cost of interconnected multi-factorial assembly sequence, thus keeping the cost of assembling parts at minimum.

第一章 緒論…………………………………………………………………... 1
1.1 研究背景……………………………………………………………… 1
1.2 研究動機……………………………………………………………… 2
1.3 研究目的……………………………………………………………… 5
1.4 論文內容架構………………………………………………………… 7
第二章 文獻探討………………………………………………………………. 8
2.1 組裝次序規劃文獻………………………………………………...… 8
2.1.1 組裝名詞定義………………………………………………… 8
2.1.2 組裝資訊………………………………………………… ………..10
2.1.3 組裝模型類別……………………………………………………..11
2.1.4 組裝的限制………………………….…………………………….13
2.1.5 組裝次序的規劃…………………………………………………..16
2.1.5.1 組件的結合狀態分析……………………………….……..16
2.1.5.2 可行組裝次序的搜尋……………………………………...20
2.1.5.3 組裝次序的評估…………………………………………...23
2.2 跨廠供應鏈之中心衛星廠體系..………………………………………...26
2.2.1 上下游的供應鏈的關係…………………………………………..26
2.2.2 中心衛星廠的來由… …………………………………….……….27
2.2.3 中心衛星廠的意義………….…………………………………….28
2.2.4 中心衛星廠的合作理念…………………………………………..28
2.3 總結……………………………………………………………………….29
第三章 研究方法…………………………………………………………….…….31
3.1 研究假設……….…………………………………………………………31
3.2 規劃模式………………………………………………………………….31
3.3 產品組件結合狀態的分析….……………………………………………33
3.4 建立組裝在先關係圖…………………………………………………….35
3.5 建立第一階段子組裝…………………………………………………….40
3.6 單元與廠房的關係……………………………………………………….45
3.7 成本函數………………………………………………………………….47
3.7.1 以組裝為基的成本………………………………………………..48
3.7.2 以跨單元為基的成本……………………………………………..55
3.7.3 運輸時間…………………………………………………………..62
3.8 第二階段子組裝的建立………………………………………………….63
3.8.1 廠房間的關係……………………………………………………..64
3.8.2 第二階段子組裝…………………………………………………..68
3.9 搜尋廠房次序…………………………………………………………….76
第四章 系統分析…………………………………………………………….…….83
4.1 跨廠組裝次序的設計與應用…………………………………………….83
4.2 系統規劃設計…………………………………………………………….83
4.3 系統演算流程…………………………………………………………….86
4.4 介面說明………………………………………………………………….88
第五章 實例探討…………………………………………………………………91
5.1 範例產品一……………………………………………………………….91
5.2 範例產品二……………………………………………………………...110
5.3 範例產品三……………………………………………………………...125
第六章 結論與未來展望………………………………………………………..139
6.1 前言……………………………………………………………………...139
6.2 電子組裝產品之跨廠組裝次序評估的重要性………………………...139
6.3 主要貢獻………………………………………………………………...140
6.4 未來發展與建議………………………………………………………...141
參考文獻……………………………………………………………………………143

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