臺灣博碩士論文加值系統

電子產品體積日益變小且更加輕薄易於攜帶，但其核心處理器的運算功能卻日趨強大。由處理器運算後所衍生的熱量積累容易造成高溫，使電子產品的功能下降甚至造成當機。因此，如何將衍生的熱量帶離熱源避免累積就變成相當重要。本論文利用導電高分子PEDOT填補氮化硼、氮化鋁與碳化矽微奈米陶瓷填料間隙，結合電子與聲子兩種熱傳導作用，使複合鍍膜的導熱率最高達到148.66 (W/m∙K)；紅外發射率最高達到0.977。本研究的成果未來亦可以應用於輕薄化、無風扇化或需要節能的裝置上。

The size of electronic products is becoming smaller and lighter and easier to carry today, but the computing power of the core processor is growing day by day. The heat generated from the CPU is likely to cause high temperature in the device. The performance, stability, lifespan, and user comfortability of electronic products could be reduced and even cause shot down of the system, since the thermal released from the CPU is accumulated quickly and difficult to dissipate from the electronic device. Therefore, how to remove the derived heat away from the heat source to avoid accumulation becomes quite important. In this study, we combined the electronic and phononic heat transfer mechanisms to increase the thermal conductivity of the composite coating films by filling a conductive polymer PEDOT between the BN, AlN, SiC micro-nano ceramic fillers gap. The heat is radiated from the surface of the composite films due to the high infrared emissivity fillers were connected by the conductive polymer. The highest thermal conductivity and the infrared emissivity of the composite coating can achieve 148.66 (W/M∙K) and 0.977, respectively. The results of this study also could be applied to the devices that are lightweight, fan-free or energy-efficient required devices in the future.

摘要.....................................i
Abstract................................ii
誌 謝..................................iii
目錄....................................iv
表目錄...................................v
圖目錄..................................vi
第一章 緒論..............................1
1.1 前言.................................1
1.2專利檢索..............................4
第二章 實驗步驟與方法....................6
2.1實驗方法..............................6
2.1.1陶瓷填料之表面改質..................6
2.1.2複合塗料之製作......................6
2.1.3 PEDOT:PSS-複合鍍膜之製作...........6
2.2 實驗分析(Characterizations)..........6
2.2.1複合鍍膜熱阻之量測..................7
2.2.2複合鍍膜紅外發射率之量測............8
第三章 結果與討論........................9
3.1陶瓷填料含量對膜厚之影響..............9
3.2複合鍍膜中陶瓷填料對導熱係數之影響....9
3.3陶瓷填料種類對紅外發射率之影響.......10
第四章 結論.............................11
第五章 未來展望.........................12
參考文獻................................13
Extended Abstract.......................21

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