Adamson, A. W., Physical Chemistry of Surfaces, John Wiely and Sons, New York (1990)
Beltran, F. J., Encinar, J. M. and Garcia-araya, J. F., “Ozonation of o-Cresol in Aqueous Solution,“ Water Research, 24, 1309 (1990)
Benitez, F. J., Beltran-heredia, J., Gonzales, T. and Pascual, A., “Ozone Treatment of Methylene Blue in Aqueous Solution,“ Chemical Engineering Communications, 119, 151 (1993)
Bibby, T. F. A., Adams, J. A., Holland, K., Krulik, G. A. and Parikh, P., “CMP CoO Reduction : Slurry Reprocessing, “Thin Solid Films, 308,538 (1997)
Borst, C. L., Thakurta, D. G., Gill, W. N. and Gutmann, R. J., “Chemical Mechanical Polishing Mechanisms of Low Dielectric Constant Polymers in Copper Slurries, “Journal of The Electrochemical Society, 146(11), 4309 (1999)
Browne, S., Krygier, V. and Sandstrom, E. L., “Treating Wastewater from CMP using Ultrafiltration,“ MICRO, 77, March (1999)
Browne, S., Maze, J. and Heid, B., “Assessing a System for CMP Waste Minimization and Water Recycling,“ MICRO, March (2000)
Calvosa, L., Monteverdi, A., Rindone, B. and Riva, G., “Ozone Oxidaiton of Compounds Resistant to Biological Degradation, “ Water Research, 25, 985 (1991)
Carpio, R., Farkas, J. and Jairath, R.,“ Initial Study on Copper CMP Slurry Chemistries,“ Thin Solid Films, 266, 238 (1995)
Chen, W. C. and Yen C. T., “Chemical-Mechanical Polishing of Low Dielectric Constant Poly (silsesquioxane): HSQ, “Journal of Polymer Research, 6(3), 197 (1999)
Choudhury, J. P., Ghosh, P. and Guha, B. K., “Styrene-Grafted Cellulose Acetate Reverse Osmosis Membrne for Ethanol Separation,” Journal of Membrane Science, 35, 301 (1988)
Corlett, G., “Targeting Water Use for Chemical Mechanical Polishing, “Solid State Technology, 43(6), 201 (2000)
Dean, J. A., Lange’s Handbook of Chemistry, McGraw-Hill, Inc., New York (1985)
Dustin, J., Ph.D., Deon, C., Jereme, F., Thuy, N. and Daun, B., “A Process for Efficient Treatment of Cu CMP Wstewater, “Semiconductor International, 23(5), 8 (2000)
Foussard, J. N., Debellfontaine, H. and Besombes-vailhé, J., “Efficinet Elimination of Organic Liquid Wastes: Wet Air Oxidation,“ Journal of Environmental Engineering, 115, 367 (1989)
Fury, M. A., “Emerging Developments in CMP for Semiconductor Planarization,” Solid State Technology, 47, April (1995)
Gilles, D. G. and Loehr, R. C., “Waste Generation and Minimization in Semiconductor Industry,” Journal of Environmental Engineering, 120, 72 (1994)
Gould, J. P. and Weber Jr., W. J.,“ Oxidation of Phenols by Ozone,“ Journal of Water Pollution Control Federation, 48, 47 (1976)
Grover, G. S., Liang, H., Ganeshkumar, S. and Fortino, W., “Effect of Slurry Viscosity Modification on Oxide and Tungsten CMP,“ Wear, 214, 10 (1998)
Gurol, M. D. and Vatistas, R., “Oxidation of Phenolic Compounds by Ozone and Ozone + U.V. Radiation: A Comparative Study,“ Water Research, 21, 895 (1987)
Gutmann, R. J., Steigerwald, J. M.,You, L., Price, D. T., Neirynck, J., Duquette, D. J. and Murarka, S. P., “Chemical-Mechanical Polishing of Copper with Oxide and Polymer Interlevel Dielectrics, “Thin Solid Films, 270, 596 (1995)
Hartmannsgruber, E., Zwicker, G. and Beekmann, K., ”A Selective CMP Process for Stacked Low-k CVD Oxide Films,“ Microelectronic Engineering, 50, 53 (2000)
Hoigné, J. and Bader, H., “Rate Constants of Reactions of Ozone with Organic and Inorganic Compounds in Water-ⅠNon-dissociating Organic Compounds,“ Water Research, 17, 173 (1983)
Hoigné, J. and Bader, H., “Rate Constants of Reactions of Ozone with Organic and Inorganic Compounds in Water-Ⅱ Dissociating Organic Compounds,“ Water Research, 17, 185 (1983)
Hoigné, J., Bader, H., Haag, W. R. and Staehelin, J., “Rate Constants of Reactions of Ozone with Organic and Inorganic Compounds in Water-Ⅲ Inorganic Compounds and Radicals,“ Water Research, 19, 993 (1985)
Hsu, Y. C., Chen, J. T. and Yang, H. C., “Decolorization of Dyes Using Ozone in a Gas-Induced Reactor, “AIChE Journal, 47, 169 (2001)
Hsu, Y. C., Huang, C. J., Yen, W. H. and Peng, R. Y., “Onset on Gas Induction and Power Consumption in an Agitated Tank Having Shortened Narrower,“ Journal of Chemical Technology and Biotechnology, 71, 187 (1998)
Kaufman, F. B.,Thompson, D. B., Broadie, R. E., Jaso, M. A., Guthrie, W. L., Pearson, D. J. and Small, M. B., “Chemical-Mechanical Polishing for Fabricating Patterned W Metal Features as Chip Interconnects, “Journal Electrochemical Society, 138(11),3460 (1991)
Ku, Y., Su, W. J. and Shen, Y. S., “Decomposition of Phenols in Aqueous Solution by a UV/O3 Process,“ Ozone Science & Engineering, 18, 443 (1996)
Li, S. H. and Miller, R. O.,Chemical Mechanical Polishing in Silicon Processing, Academic Press, San Diego (2000)
Li, W., Shin, D. W., Tomozawa, M. and Murarka, S. P., “The Effect of The Polishing Pad Treatments on The Chemical-Mechanical Polishing of SiO2 Films, “Thin Solid Films, 270, 601 (1995)
Lin, K. L., Chu, M. L. and Shieh, M. C., “Treatment of Uranium Containing Effluents with Reverse Osmosis Process,” Desalination, 61, 125 (1987)
Marinas, B. J., “Reverse Osmosis Technology for Wastewater Resuse,” Water Science Technology, 24, 215 (1991)
Mehdizadeh, H. and Dickson, J. M., “Theoretical Modification of Surface Forcepore Flow Model for Reverse Osmosis Transport,” Journal of Membrance Science, 42, 119 (1989)
Morooka, S., Ikemizu, K. and Kato, Y., “The Decomposition of Ozone in Aqueous Solution,“ International Chemical Engineering, 19, 650 (1979)
Mueller, B. L. and Steckenrider, J. S., “Polishing Surfaces for Integrated Circuits, “Chemtech, 28, 38 (1998)
Najm, I. N., Snoeyink, V. L. and Richard, Y., “Removal of 2,4,6-Trichlorophenol and Natural Organic Mater from Water Supplies Using PAC in Floc-blanket Reactors,“ Water Research, 27, 551 (1993)
Nomura, T., Nakao, S. and Nomura, S., “Influent of The Temperature of Feed on Ultrafiltration,” International Chemical Engineering, 29, 707 (1989)
Osada, Y. and Nakagawa, T., Membrane Science and Technology, Dekker, New York (1992)
Pearl, R., The Biology of Population Growth, Alfred A. Knopf, New York (1925)
Pimenov, A. V., Lieberman, A. I., Shmidt, J. L. and Cheh, H. Y., “Accelerated Adsorption with Activated Carbon Fiber,“ Separation Science and Technology, 30, 3183 (1995)
Ratkowsky, D. A., Nonlinear Regression Modeling, Marcel Dekker, New York (1983)
Ruthven, D. M., Principles of Adsorption and Adsorption Processes, John Wiely and Sons, New York (1984)
Stavreva, Z., Zeidler, D., Plotner, M. and Drescher, K., “Characteristics in Chemical-Mechanical Polishing of Copper : Comparison of Polishing Pads, “Applied Surface Science, 108, 39 (1997)
Steigerwald, J. M., Murarka, S. P. and Gutmann, R. J., Chemical Mechanical Planarization of Microelectronic Materials, John Wiley &Sons Inc., New York (1997)
Steigerwald, J. M., Murarka, S. P., Gutmann, R. J. and Duquette, D. J., “Chemical Processes in The Chemical Mechanical Polishing of Copper, “Materials Chemistry and Physice, 41, 217 (1995)
Tsapyuk, E. A. and Kucheruk, D. D., “Transfer of Aqueous Sucrose Solution through Semipermeable Membranes,” Soviet Progress in Chemistry, 49, 40 (1983)
Wang, Y. L., Wang, T. C., Wu, J., Tseng, W. T. and Lin, C. F., “A Modified Multi-Chemical Spray Cleaning Process for Post Shallow Trench Isolation Chemical Mechanical Polishing Cleaning Application,“ Thin Solid Films, 332, 385 (1998)
Yamamoto, Y., Niki, E., Shiokawa, H. and Kamiya, Y., “Ozonation of Organic Compounds. 2. Ozonation of Phenol in Water, “Journal of Organic Chemistry, 44, 2137 (1979)
Yao, C., “Extended and Improved Langmuir Equation for Correlating Adsorption Equilibrium Data, ”Separation and Purification Technology, 19, 237 (2000)
Yoon, Y. H. and Nelson, J. H., “Application of Gas Adsorption Kinetics I. A. Theoretical Model for Respirator Cartridge Service Life, “American Industrial Hygiene Association Journal, 45,509 (1984)
Zeidler, D., Stavreva, Z., Plotner, M. and Drescher, K., ”Characterization of Cu Chemical Mechanical Polishing by Electrochemical Investigations, “Microelectronic Engineering, 33, 259 (1997)
Zhang, Q. and Chuang, K. T., “Lumped Kinetic Model for Catalytic Wet Oxidation of Organic Compounds in Industrial Wastewater,“ AIChE Journal, 45, 145 (1999)
于仰聖, “以逆滲透膜法處理螯合重金屬廢水之研究,” 台灣工業技術學院碩士論文 (1993)余振華, ”次0.35μm後段製程技術概觀,” 電子資訊, 2(2), 72 (1996)
劉訓瑜、甘其銓、邱顯盛、黃志彬, “化學機械研磨廢水混凝沈澱效能之評估,” 第二十五屆廢水處理研討會 (2000)
吳心玲, “氧化鋁漿體的穩定性研究,” 成功大學碩士論文 (2000)周孟賢, “化學機械研磨時控製程參數最佳化技術,” 中興大學碩士論文(2000)姜志新、堪竟清、宋正孝, 離子交換分離工程, 天津大學出版社, 天津大學 (1992)
張景學、吳昌崙, 半導體製造技術, 文京, 台北 (1998)
張漢昌, 廢水處理, 文京, 台北 (1997)
李臻誠, “晶圓化學機械研磨之研磨液流場及磨潤性能理論分析與實驗,” 成功大學碩士論文 (1998)林志朋、雷大同、溫紹炳、涂佳薇、詹耀富, “柱槽溶器加壓浮選處理半導體化學機械研磨(CMP)廢液之研究,” 第二十四屆廢水處理研討會 (1999)
林淇松, “化纖製程廢水處理與回收再利用之研究, “元智大學碩士論文 (1997)林義雄, “研磨液組成及機械變數對鋁-化學機械拋光法中電化學性質影響之研究,” 成功大學碩士論文 (1997)楊正杰、張鼎張、鄭晃忠, “銅金屬與低介電常數材料與製程, “工業材料, 167期, 121 (2000)楊金鐘、楊叢印、蔡秀惠, “半導體業晶圓廠化學機械研磨廢水性質初步探討,” 第六屆海峽兩岸環境保護研討會 (1999)
王建榮、林慶福、林必窕, 半導體平坦化CMP技術, 全華,台北 (1999)
王清弘, “捲氣式催化氧化反應之研究,” 元智大學碩士論文 (1999)盧文章, ”淺談半導體產業節約用水,” 節約用水季刊, 32, 九月 (1998)莊達人, VLSI製造概論, 高立, 台北 (1998)
葉和明, 單元操作, 三民書局, 台北 (1991)
蔡明蒔, “化學機械研磨後清洗技術簡介,” 毫微米通訊, 6(1) (1999)
蔣本基, 工業廢水逆滲透處理, 經濟部工業污染防治技術服務團 (1988)
詹煌義, “催化氧化反應及捲氣式反應器之研究,” 元智大學碩士論(2000)詹耀富, “以柱槽溶氣浮選法回收二氧化矽奈米微粒之研究,” 成功大學碩士論文 (2000)陳志祥, 晶亞世界, 南亞科技股份公司, 桃園, 二月 (2000)
陸九芳、李總成、包鐵竹, 分離過程化學, 清華大學出版社,中國大陸 (1993)